IC Advanced Packaging Industry Report, 2005-2006
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The prices of semiconductor are fluctuating now and then because of continual advent of new products and the shortened lifecycle. In view of the cost of a complete semiconductor product,  expense on packaging accounts for 5 to 25 percentage of market price of one semiconductor unit; however, as technology advances, the proportion of packaging cost to the whole cost becomes higher. Therefore, most clients of  international semiconductor venders care more about the quality of packaging, yield and terms of delivery. The packaging technology becomes so complicated and so many packaging methods available that add trouble to one single international semiconductor company of IDM to meet the increasing market demand. As a result, outsourced packaging becomes the mainstream.

In the outsourced packaging and test market, large international IDM companies shift their attention to  core advantages such as design, R&D and marketing when facing fierce competition results from the rapid updating of products. Meanwhile, large international IDM companies become far less profitable under the influence of universal recession in the industry. Therefore, they sharply decrease their capital expense on semiconductor produce capacity and are rather conservative in extending produce capacity of backend packaging. Meanwhile World class package foundries continually invest in new technology R&D as advanced package demands are brought about by new IC products. As a result, large international IDM companies are more dependent upon advanced packaging technology of package and test foundries. The market scale of outsourced IC packaging, as estimated, is to grow up to USD13.1 billion in 2006. As international IDM companies speed up outsourced processing worldwide, CAGR will reach 168% between 2003 and 2009. According to ETP, market share of specific package foundry companies in package market increased from 27.2% in 2004 to 29.5% in 2005, and will increase to 31.1% in 2006, 32% in 2007 and 33% in 2008. Their total package also increased, from 28,860,000 units in 2004 to 31,830,000 units in 2005, and will increase from 37,190,000 units in 2006 to 43,060,000 units in 2007 then 49,240,000 units in 2008.

Outsourced packaging e.g. BGA, CSP, FC, QFN and SiP are all fairly advanced. To enter the field, large investment (at least one billion RMB) is needed to purchase equipment and conduct technological R&D. Without enough capital and strong technological R&D capability, it is quite impossible to enter this field. So only big enterprises may go somewhere and only a few may have a place in package. As a result, supply never meets demand in package market. Therefore, advanced package companies get a higher gross profit margin. Gross profit margins of most companies have an increment from about 6% in 2001 to 20-35% at present. Naturally their revenues also increased by a large margin. Such case may only happen to advanced package industry in electronic industry.

In the following diagram, SPIL is short for Siliconware Precision Industries Co., Ltd, so do STTS,STATS ChipPAC Ltd; AMKR represents Amkor Technology Inc and ASX is abbr. for Advanced Semiconductor Engineering Incorporated; IMOS stands for ChipMos technologies Ltd and finally ASTSF is ASE Test Ltd, a member of ASE (ASX) Group.

 Gross Profit margin of Global Top Six Packaging and Test Companies, 2005




Gross Profit margin of Global Top Six Packaging and Test Companies, 2006Q1

 

 

Global Top Ten Packaging Companies, 2005

 

 

No.

company

Headquarters

Revenue 2005

(million USD)

04/05 CAGR

1

ASE Global

Taiwan

2582

33%

2

Amkor

USA

2100

22%

3

SPIL

Taiwan

1338

47%

4

STATS-ChipPAC

Singapore

1157

81%

5

IMOS

Taiwan

482

94%

6

PTI

Taiwan

347

 

7

UTAC

Singapore

325

 

8

KYEC

Taiwan

318

 

9

CARSEM

Malaysia

264

14%

10

GREATEK

Taiwan

216

41%

 

Taiwan is gradually becoming a power in the packaging and test . Among the global top ten packaging and test companies, six are from Taiwan, all of which are performing well in both revenues and profits. If ranking by profit scale, nine Taiwan package and test companies may be listed in top-ten. So it can be concluded that global advanced packaging and test companies inhabit in Taiwan. However, Japanese often do well in the IC substrate field, so close business relationship between Taiwan and Japan is built as Japan companies transfer their technologies to Taiwan when an inadequate production capacity takes place. Actually 95% of electronic technologies in Taiwan, including packaging but not limited to, are from Japan.

With simultaneous complete master of both global advanced IC wafer foundry and IC advanced packaging technologies, Taiwan achieves best performance in the semiconductor industry worldwide and has become the heart of global semiconductor industry.

Taiwan's large packaging and test companies often merge and purchase small ones when developing. On average each company merges or acquires at least three small companies. For instance ChipMos Technology Ltd has merged and acquired seven in five years. Or incorporate virtual group is formed such as Mosel Vitelic Inc, most of its member company deal with packaging & test. With their own know-how, they compete nice and well in the market. Many rank No. 1 in their respective fields and are very competitive. Sound in capital market and excellent in integrating, Taiwan companies are quite successful in merge  and acquisition, which contributes a lot in the overall success of Taiwan packaging and test industry.

1. Overview of Global PCB and Packaging Industry
1.1 Global PCB Industry
1.2 Global Packaging and Test Market
1.3 Global Key Packaging and Test Manufacturers
1.4 Taiwan's Packaging and Test Industry

2. Overview of IC substrate Packaging Market
2.1 IC substrate Packaging Market
2.2 Downstream Product Market of IC substrate Packaging 
2.3 LCD Drive IC Packaging Market

3. Brief Introduction of Advanced Packaging
3.1 History of IC substrate Packaging
3.2 BGA Packaging
3.2.1 Concept of BGA
3.2.2 Advantages and Processes of BGA Packaging
3.2.3 PBGA
3.2.4 CBGA
3.2.5 TBGA
3.3 GSP Packaging
3.3.1 WL-CSP Packaging
3.3.2 Applications of WL-CSP
3.3.3 Processes of WL-CSP
3.4 FC Packaging 
3.4.1 Concept of FC Packaging 
3.4.2 Processes of FC Packaging
3.5 QFN Packaging
3.6 SiP Packaging

4. Advanced Packaging Material Industry and Market
4.1 Golden Thread
4.2 IC Substrate

5. Advanced Packaging Manufacturers
5.1 ASE (Advanced Semiconductor Engineering Incorporated)
5.2 Amkor (Amkor Technology Inc)
5.3 SPIL (Siliconware Precision Industries Co., Ltd)
5.4 STTS (STATS ChipPAC Ltd)
5.5 PPt (Phoenix Precision Technology Corporation)
5.6 Nan Ya PCB
5.7 Kinsus (Kinsus Interconnect Technology Corp.)
5.8 PTI (Power Technology Inc.)
5.9 ChipMos (ChipMos Technology Ltd)
5.10 KYEC (King Yuan Electronics Co., Ltd)
5.11 Chipsbank (Chipsbank Microelectronics Co., Ltd)
5.12 IST (International Semiconductor Technology Ltd)
5.13 UTAC (United Test and Assembly Center Ltd)
5.14 Carsem
5.15 IBIDEN (IBIDEN Co., Ltd)
5.16 Shinko (Shinko Electronic Co., Ltd)
5.17 Jiangyin Changjiang Electronics Co., Ltd
5.18 GAPT (Global Advanced Packaging Technology Limited) (Shanghai)
5.19 Unimicron (Unimicron Technology Corp.)
Proportion of Global PCB Production Value by Technology Types, 2005
Production Value of Global PCB by Regions, 2005
Production Value of Global PCB by Their Belonging Regions, 2005
Market Scale of the Packaging and Test Industry, 2003-2009
Market Scale of Specific Packaging and Test Industries, 2003-2009
Proportion of Outsourced Packaging and Test, 2003-2009
Proportion and Estimated Proportion of Various Packaging Forms, 2003-2008
Quarterly Revenues of Global Top Five Packaging and Test Manufacturers, 2000Q1-2005Q4
Growth Rate in Revenues of Global Top Six Packaging and Test Manufacturers, 2005
Growth Rate in Income of Global Top Six Packaging and Test Manufacturers, 2006Q1
Gross Profit margins of Global Top Six Packaging and Test Manufacturers, 2005
Gross Profit margins of Global Top Six Packaging and Test Manufacturers, 2006Q1
Operation Profit Rate of Global Top Six Packaging and Test Manufacturers, 2005
Operation Profit Rate of Global Top Six Packaging and Test Manufacturers, 2006Q1
Net Profit Rate of Global Top Six Packaging and Test Manufacturers, 2005
Net Profit Rate of Global Top Six Packaging and Test Manufacturers, 2006Q1
Semiconductor Industrial Chain of Taiwan
Market Scale and Forecast of Global IC substrate Market, 2001-2007
Proportion of Global IC substrate Production Value by Regions, 2005-2006
Market Scale and Forecast of Global IC substrate Market in Taiwan, 2001-2007
Proportion and Forecast of Global IC substrate by Technology Types, 2003-2007
Growth Rate in Production Value of FC, PBGA and CSP, 2004-2007
Forecast of DRAM Memory Shipments and Its Average Price, 2006Q1-2007Q4
Forecast of DRAM Memory Demand & Supply, 2006Q1-2007Q4
Forecast of NAND Memory Shipments and Its Average Price, 2006Q1-2007Q4
Forecast of NAND Memory Demand & Supply, 2006Q1-2007Q4
Estimated Market Share of Global Memories by Shipments, 2006
Quarterly Demand and Supply in LCD Drive IC Golden Bump Industry, 2005Q1-2006Q4
Quarterly Demand and Supply in LCD Drive IC TCP/COF/COG Industry, 2005Q1-2006Q4
Market Share of Global Packaging Golden Thread, 2005
Market Share of Global Packaging Tinball Material, 2005
Revenues of ASE, 2001-2005
Gross Profit of ASE, 2001-2005
Market Value of ASE, 2001-2005
Structure of ASE
Fiscal Status of ASE, 2005Q1-2006Q1
Fiscal Status of ASE's Packaging Segment, 2005Q1-2006Q1
Status Quo of ASE's Packaging Technologies
Revenues of Amkor, 1985-2005
Structure of SPIL
Revenues and Gross Profit Margins of SPIL, 2001-2006
Regional Distribution of SPIL's Revenues, 2005Q4-2006Q1
Downstream Application Structure of SPIL's Products, 2005Q4-2006Q1
Revenue Structure of STTS, 2003-2005
Downstream Application Structure of STTS' Products, 2003-2005
Regional Distribution of STTS' Revenues, 2003-2005
Turnover of PPt, 1997-2005
Product Structure of PPt, 2005Q1-2006Q1
Layer Proportion of PPt's Products, 2005Q1-2006Q1
Downstream Application Proportion of PPt's Products, 2005Q1-2006Q1
Regional Distribution of PPt's Revenues, 2005Q1-2006Q1
Academic Title Distribution of PPt's Staff
Statistics of PPt’s Assets and Its Staff
Contribution Distribution of NYPCB's Key Clients, Jan-Jun 2005
Revenues and Gross Profit Margins of Kinsus, 2001-2006
Product Structure of Kinsus, 2005-May 2006
Downstream Clients Proportion of Kinsus, Jan-May 2006
Revenues and Gross Profit Margins of PTI, 2001-2006
Regional Distribution of PTI's Revenues in Two Consecutive Quarters
Structure of ChipMos
Revenues of ChipMos, 2001-2005
Revenue Structure of ChipMos, 2006Q1
Proportion of Revenue from All ChipMos' Clients, 2006Q1
Client Constitution of ChipMOs, 2005
Revenues of ChipMos in Memory Field, 2001-2006Q1
Estimated Quarterly Income of ChipMos in DDRII Field, 2006
Estimated Quarterly Income of ChipMos in Flash Memory Field, 2006
Revenues of ChipMos in LCD Drive IC Field, 2001-2006Q1
Revenues and Gross Profit Margins of KYEC, 2001-2005
Structure of KYEC
Product Distribution of Chipsbank' Revenues, 2005
Revenues and Gross Profit Margins of UTAC, 2001-2005
Clients of UTAC and NSEB
Income Structure of UTAC, 2006Q1
Regional Distribution of UTAC's Income, 2006Q1
Fiscal Status of IBIDEN, 2001-2005
Statistics and Forecast of Sales, Shanghai Xinguang Electric Automation Co., Ltd, 2003-2007
Statistics and Forecast of Net Profit, Shanghai Xinguang Electric Automation Co., Ltd, 2003-2007
Product of Shanghai Xinguang Electric Automation Co., Ltd
Ranking of Unimicron in Global PCB Industry, 1996-2004
Global layout of Unimicron
Structure of Unimicron
Revenues and Gross Profit Margins of Unimicron, 2000-2006
Revenue Structure of Unimicron, 2006Q1
Global Top 20 PCB Companies, 2000-2005
Global Top Ten Packaging Companies, 2005
Output Capacity and Clients of Global Leading FC Carrier Manufacturers
Supply and Demand in LCD Drive IC Golden Bump Industry, 2005Q1-2006Q4
Supply and Demand in LCD Drive IC TCP/COF/COG Industry, 2005Q1-2006Q4
Differences between Traditional IC and WL-CSP
Merging and Acquisition of ChipMos
Output Capacity of ChipMos Shanghai Base
Investment Plan of ChipMos, 2006
Machine Number of UTAC and NSEB
FC Packaging Capability of Unimicron

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