Chip Passive Components Industry Report, 2007
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According to the reaction to electric current, circuit groupware can be divided into active components and passive components. The groupware that can enable the execution and treatment of data algorithm are called as active components; likewise, circuit groupware that do not affect basic features of signal and only allow the overpass of signals instead of changing them are named as passive components. Passive components can be generally classified into RCL passive groupware (resistor, inductor and capacitor) and RF passive groupware (wave filter, oscillator). Compared to RF passive components, RCL has a much bigger market size and has been shaped into a relatively independent industry. The report only studies on RCL passive components. Chip passive components refer to chip components for SMT production line and reflow soldering production line. As usual, chip capacitor refers to MLCC, chip resistor refers to R-CHIP and, chip capacitor refers to L-CHIP.

RCL passive components are basic groupware indispensable to electronic circuit. As usual, RCL takes less than 10% of whole electronic cost. Yet, it is of great importance and belongs to a sort of derived demand. RCL sells quite well in downstream electronic products. When the new-generation products or high-end application is released, the utilized volume of RCL will increase considerably (on circuit design, RCL utilized proportion R: C: L = 1:1:0.5).

Of RCL, the capacitor market is the biggest scaled. And MLCC is the biggest category in the capacitor market. By shipment, Taiwan-based enterprises have strength to compete with Japanese counterparts. However, in terms of sales revenue, Japanese enterprises are still in the leading position. The whole MLCC market is dominated by Murata, TDK and Taiyo Yuden (the three take 65% or so of market shares), of which Murata has a complete product lineup and takes a global market share of 30%. TDK and Taiyo Yuden are specialized in high-capacitance MLCC. Electric components require high stability and low capacitance gap. The Japanese enterprises' preciseness of doing things is acknowledged by most enterprises. Even with the same technical level as Japanese counterparts, Taiwan-based enterprises would still be inferior to Japanese producers in terms of production & quality stability and customer loyalty. Thus, the leading position of Japanese enterprise is unshakable in short run.

In MLCC field, high-capacity is still the most frequently discussed topic, and it probably substitute for partial Tantalum capacitor market. On the one hand, the output of handset, PC, digital camera, LCD TV continues to growth, which greatly drives the increasing demand for MLCC. On the other hand, partial terminal products have a rising requirement on capacitance per unit. Taking PC for instance, Dothan single-core platform of Intel approximately need an external capacitance of 26.4μF or so. Then, Yonah dual-core platform requires total capacitance of 77.2μF. As for 4-core and 8-core CPU platform in the future, the capacitance demands to be up to 160μF and 265μF. This is greatly incentive to the capacitor market. In 2006, the output of X5R and Y5V high-capacity MLCC amounted to 216 billion units and 48 billion units respectively. And the figures will considerably increase to 428.2 billion units and 90.8 billion units separately in 2009, with a respective annual compound growth rate of 25.62% and 23.67%.

R-Chip market is faced with the rising prices. The price of ruthenium raw materials rose by six times within a year. Resistor producers can not fully make up for the rising cost. The world's largest R-chip manufacturer Yageo first announced to raise prices. Besides, Yageo plans to acquire TA-I Technology Co., Ltd. But the latter refused to be purchased. We believe that TA-I will be obtained by Yageo sooner or later. Judging from the gross profit margin rising from 3% to 20% or above after Ralec was purchased by Yageo, it is a good thing to be a member of Yageo.

1 Brief Introduction to Passive Components

2 Status Quo of Chip Passive Components Downstream Market
2.1 Handset
2.1.1 China Mobile Phone Industry and Market
2.2 Notebook PC
2.2.1 China Notebook PC Market
2.3 Desktop PC (Motherboard)
2.4 Flat Panel Display

3 Status Quo of Chip Passive Components Market
3.1 Overall Market of Chip Passive Components
3.2 MLCC

4 Status Quo and Trend of Chip Passive Components Industry
4.1 Status Quo of MLCC Industry
4.2 Trend of MLCC Industry
4.2.1 Technical Narrowing of Taiwanese Enterprise and Japanese Counterparts
4.2.2 High-Capacity MLCC
4.3 R-Chip
4.3.1 Rising Price of R-Chip
4.4 L-Chip
4.5 Lateral Comparison of Passive Component Enterprises
4.6 Status Quo of China Passive Components Industry
4.7 Magnetic Components
4.8 Solid Capacitor

5 Manufacturers of Chip Passive Components
5.1Yageo
5.2 Murata
5.3 TDK
5.4 Kyocera
5.5 Yuden
5.6 Walsin Technology
5.7 KEMET
5.8 KOA
5.9 Samsung SDI
5.10 Fenghua Advanced Technology
5.11 EYang Technology
5.12 Holy Stone
5.13 TA-I Technology
5.14 Ralec
5.15 Chilisin
Statistics and Forecast of Global Handset Shipment, 2002-2011
Statistics and Forecast of Handset Output in China, 2002-2011
Statistics and Forecast of Notebook PC Shipment Worldwide, 2002-2011
Statistics and Forecast of Notebook PC Sales Volume in China, 2001-2011
Market Shares of Notebook PC Manufacturers in China, 2007Q1
Statistics and Forecast of Desktop PC Shipment, 2006-2010
Market Shares of Major Motherboard Manufacturers Worldwide, 2006
Statistics and Forecast of LCD TV and LCD Display, 2006-2011
Statistics and Forecast of LCD-TV and PDP-TV Shipment, 2006-2011
Global Output Value of Passive Components, 2001-2007
ASP Change Trend of MLCC in Past Years
ASP and Sales Volume of MLCC in Past Years
Market Shares of Major MLCC Manufacturers Worldwide by Shipment, 2006
Market Shares of Major MLCC Manufacturers Worldwide by Shipment, 2007
Market Shares of Major MLCC Manufacturers Worldwide by Sales Income, 2007
Demand in High-capacity MLCC Market, 2006-2009
Market Shares of R-chip Manufacturers Worldwide by shipment, 2006
Market Shares of R-chip Manufacturers Worldwide by Sales Income, 2006
Market Shares of L-Chip Manufacturers, 2005
Market Shares of Major Magnetic Components Manufacturers Worldwide, 2006
Income Structure of Yageo by Product, 2007Q1
Income Structure of Yageo by Region, 2007Q1
Income Structure of Yageo by Region, 2006Q3-2007Q2
Income Structure of Yageo by Product Downstream Applications, 2007Q1
Shares of Yageo in Chinese Chip Resistance Market, 2002-2006
Income Structure of Yageo by Sales Channel, 2007Q1
Production Capacity and Capacity Utilization Ratio, 2006Q2-2007Q3
Revenues and Profits of Murata, FY2003-2007
Income Structure of Murata by Product, FY2003-2007
Income Structure of Murata by Product Downstream Applications, FY2003-2007
Income Structure of Murata by Region, FY2003-2007
Sales Revenues of Beijing Murata, 1995-2005
Proportion for Overseas Production of TDK, FY2003-2007
Revenues and Operating Profits of TDK, FY2003-2007
Income Structure of TDK by Product, FY2007
Income Structure of TDK by Region, FY2007
Organizational Structure of Xiamen TDK
Income Structure of Kyocera by Product, FY2007
Income Structure of Kyocera by Region, FY2007
Revenue of Shanghai Kyocera, 2001-2006
Revenue and Operating Profit of Yuden, FY2003-2007
Income Structure of Yuden by Product, FY2007
Organizational Structure of Walsin Lihwa Group
Statistical Revenue of Walsin Lihwa Group, 2001-2006
Revenue of Walsin Technology Corporation by Business Cluster, 2003-2007
Income Structure of Walsin Technology Corporation by Product, 2006-2008
Client Structure of Walsin Technology Corporation, 2005/2006
Revenues of KEMET, 2005Q1-2007Q2
Gross Profit Margin of KEMET, 2005Q1-2007Q2
Operating Profit of KEMET, 2005Q1-2007Q2
Income Structure of KEMET by Product, 2007Q2
Income Structure of KEMET by Region, 2007Q2
Quarterly Revenue and Operating Profit of KOA, FY2001-2007
Income Structure of KOA by Product, FY2006/2007
Income Structure of KOA by Region, FY2006/2007
Income Structure of Samsung SDI by Product, 2007Q1&Q2
Staff Structure of Samsung SDI by Department
Capital Expenditure Plan of Samsung SDI, 2007
MLCC Sale Achievements of Samsung SDI, 2004-2006
Organizational Structure of EYang Technology Development Co., Ltd
Income Structure of Holy Stone, 2006
Revenue and Gross Profit Margin of TA-I Technology, 2001-2006
Revenue and Gross Profit Margin of Ralec, 2000-2006
Income Structure of Chilisin by Product Downstream Application, 2006
Handset Production and Exportation, 2000-2006
Top 22 Handset Producers in China by Handset Exported Volume, 2006
Global Demand and Annual Growth Rate of MLCC Downstream Application
Ranking of Passive Components Enterprises in China, 2006
Production of Main Plants of Chilisin Electronics Corp
New Clients of Chilisin Electronics Corp

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