Global and China Mobile Phone Platform Industry Report, 2008-2009
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Base band, the core of mobile phone platform, is also the key component of a mobile phone.

The year of 2009 will witness the prosperity of smart phone. With the increasing enhancement of hardware performance, a mobile phone will be more like a PC. In addition, as 3G is arriving, the mobile phone is marching into the mobile internet era, which indicates that more and more mobile phones will have open operating system and the function of full web browsing. Meanwhile, the success of IPhone has promoted more PC manufacturers focus on smart phones.

During the world’s communication industry conference on Feb 16 2009, Acer announced eight new smart phone models, and the revenue from those eight models are expected to account for 10% of Acer’s total revenue in the next three years, which is about US $2billion. Moreover, Dell will also launch its own smart phone by the end of Feb 2009, Toshiba and HP will also tend to enlarge their smart phone investments.

Mobile phone platform manufacturers certainly have made more efforts on smart phone platform developments. In the middle of Feb, 2009, MediaTek announced its launch of MT6253, its first GSM/GPRS smart phone chip, which integrates the basic components like DBB, ABB, PM, and RF Transceiver, it also supports abundant multimedia functions such as camera, high speed USB and Class D audio power amplifier. Not like ASIC, the SiP packaging has made the success of such a high-integrated IC in a short term.

MT6516, another smart phone solution simultaneously launched by MediaTek, which supports WVGA LCD resolution, MPEG-2 decoding, and mobile phone TV application standards like CMMB, DVB-T, and DVB-H, by the integration of various video codec. And no doubt that MediaTek supports Windows Mobile.

Although it has been adopted by many smart phone manufacturers, Qualcomm’s MSM72XX series was not originally designed for smart phone. In order to expand the smart phone market, Qualcomm launched the dramatically SNAPDRAGON platform focus on smart phones. So far, it has been adopted by Toshiba and HTC. Moreover, its CPU and DSP speed can respectively reach 1GHz and 600MHz, moreover, it supports WLAN, GPS, 12 million-pixel camer and mobile phone TV (including ISDB-T and DVB-H)

Marvell, the new entrant, it had acquired INTEL’s mobile phone communication division at the cost of US $600 million in 2006. Originated from XScale technology, Marvell’s PXA processor series achieved a great performance in the high-end smart phone sector. Marvell had divided into two routes in 2008, one was PXA930, integrating application processor and 3G Modem; the other was application processor, including PXA310, PXA312, PXA320 and PXA168.

However, there are two sides regarding smart phones, one side insists to separate application processor and base band processor, while the other side claims to the integration. Apple, Nokia and Japanese manufacturers are supporting the former, while Sony Ericsson, Acer, HTC, BlackBerry, MOTO, Samsung and LC are for the other side. It also the main reason why Infineon, TI, ST, and NXP do not launch single-chip smart phone base band, because they are also the supporters of Apple, Nokia and Japanese Manufacturers.

Two big events had taken place in global mobile phone platform industry in 2008, one was mobile phone business integration of ST, NXP and Ericsson mobile phone platform (EMP), and the other was TI quits the general base band market.
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In Apr, 2008, ST and NXP wireless division co-established a new company, which started its operation in the beginning of Aug, 2008. Then the new company starts to remerge the EMP (the revenue of EMP was US $500 million in 2007FY), and the merger is expected to complete in 2009Q2. NXP, ST and EMP are respectively good at DSP operation and radio frequency, radio frequency and analog, and communication Modem.
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TI had made significant adjustments to its mobile phone base band strategy on Oct 20, 2008. It planned to sell its general mobile phone base band division, which could save approximately US $200 million expenditure each year, but it still maintained the division producing custom base band for manufacturers like Nokia. The main products of TI’s general mobile phone base band division were LoCosto and eCosto, and the annual revenue of this division only accounted for 10% of TI’s total wireless revenue in 2008, while the proportion for the custom base band division was 65%. It is expected the general mobile phone base band division will be sold out in 2009Q2; otherwise, TI will shut it up. However, TI will enlarge investment in custom base band sector, to compete with ST rather than quit.

1.Global Mobile Phone Market 

2. China Mobile Phone Market 
2.1 Mobile Phone Market
2.2 Export
2.3 Smart Phone Market

3. Development Trend of Mobile Phone and Baseband
3.1 Mobile Internet Era Is Forthcoming
3.2 Mass Application of HSPA Has Started 
3.3 Development Trend of Mobile Phone Baseband
3.3.1 Brief Introduction
3.3.2 Number of Smart Phone Baseband Developers Increased 
3.3.3 Package Is Still the Key
3.4 Status Quo of Baseband Industry

4. Mobile Phone Hardware Structure 
4.1 Hardware Structure of Smart Phone 
4.1.1 BlackBerry BOLD
4.1.2 BlackBerry STORM
4.1.3 HTC Touch Pro
4.1.4 Sony Ericsson XPERIA X1
4.1.5 T-MOBILE T1
4.1.6 MOTO KRAVE ZN4
4.1.7 NOKIA N95
4.1.8 IPHONE 3G 16GB
4.2 Development Trend of Smart Phone CPU 

5. Global Mobile Phone Platform Market
5.1 Market Share Distribution 
5.2 CPU of Smart Phone

6. Main Mobile Phone Vendors
6.1 Nokia
6.2 Motorola
6.3 Samsung
6.4 Sony Ericsson
6.5 LG
6.6 Chinese Mobile Phone Platform Manufactures 
6.6.1 Tianyu Communication Equipment
6.6.2 Lenovo
6.6.3 Gionee

7. Mobile Phone Platform Vendors
7.1 Qualcomm
7.2 Texas Instruments
7.3 Freescale
7.4 Infineon
7.5 BROADCOM
7.6 MTK
7.8 Spreadtrum
7.8 T3G
7.9 STM
7.9.1 EMP
7.9.2 NXP
Global Mobile Phone Shipment and the Proportion of Smart Phones, 2007-2012e
Quarterly Global Mobile Phone Shipment and Growth, 2007-2008
Regional Distribution of Quarterly Global Mobile Shipment, 2007-2008
Technology Distribution of Quarterly Global Mobile Shipment, 2007-2008
Global Market Share Distribution of Major Mobile Phone Vendors, 2008
Global Market Share Distribution of Major Smart Phone Vendors, 2008
China’s Mobile Phone Shipment and the Proportion of Smart Phones, 2004-2012e
Chinese Market Share Distribution of Major Mobile Phone Vendors, 2008
China’s Mobile Phone Output, 2004-2012e
Chine’s Mobile Phone Export, 1999-2008
China’s Mobile Phone Export Value, 2002-2008
China’s Regional Distribution of Mobile Phone Export, 2008
Chinese Market Share Distribution of Major Smart Phone Vendors, 2008
Mobile Phone Development Trend, 1995-2012e
Development Trend of Mobile Phone Communication Protocol, 2008-2013e
UMTS-HSPA Network Distribution in Latin America
Perspectivity of Infineon PMB8878 Electron Microscope 
Internal Framework of N95
Global Market Share Distribution of Major Mobile Phone Baseband Vendors by Shipment, 2007and 2008 
Chinese Market Share Distribution of Major Mobile Phone Platform Vendors by Shipment, 2008 
Quarterly Shipment of Nokia in China, Q12005-Q42008
Quarterly Shipment of Samsung, Q12005-Q42008
Shipment and Average Sales Price of Sony Ericsson, Q12005-Q42008
Quarterly Shipment of LG, Q12005-Q42008
Organization Structure of Tianyu Communication Equipment
Organization Structure of Gionee
Organization Structure of JM Electronics
Quarterly Shipment of Qualcomm’s MSM Chips, 2004-2008
Mobile Phone Baseband Distribution of Texas 
Internal Framework of TCS2315
Internal Framework of OMAPV1035
Software Structure of OMAPV 
Freescale’s Sales Revenue Structure
Revenue of Infineon’s Communication Department, FY Q42006-FY Q42008
Internal Framework of PMB7870
Internal & Application Framework of X-GOLD-608 
Software Structure of XMM2050 
Internal Framework of XMM2051
Products Sakes Revenue Structure of Qualcomm, Q12006-Q42008
Internal Framework of BCM2124 
Internal Framework of BCM21331 
Internal Framework of BCM2133 
Internal Framework of BCM2152 
Internal Framework of BCM21551 
Internal Framework of BCM2153
Revenue & Gross Profit Margin of MTK, 2001-2009e
Route Chart of MTK, 2006-2009e
Route Chart of MTK Blue Tooth Products
System Solution of MTK TD-SCDMA
Platform Framework of AD6900 EDGE 
Internal Framework of AD6722 
Internal Framework of AD6721 
Internal Framework of AD6720 
Platform Framework of WCDMA 
Platform Framework of TD-SCDMA
Internal Function Module of AD6525
Internal Module of AD6537
Application Structure of AD6720
Revenue of Spreadtrum, 2003-2008
Revenue & Gross Profit Margin of Spreadtrum, Q1 2006-Q4 2008
Spreadtrum’s EDGE Baseband Products Layout
Spreadtrum’s 3G Baseband Route
Mobile TV Solutions of Spreadtrum’s C6600V CMMB
Development Route of Spreadtrum’s Mobile TV Multimedia Solutions 
Typical Application Chart of SC8800H
Typical Application Chart of SC8800D
Distributing Proportion of T3G Researchers
Internal Framework of T3GTD-SCDMA Baseband Processor
Application Framework of T3GTD-SCDMA Baseband Processor
Protocol Stack of T3GTD-SCDMA Baseband Processor
Reference Design Chart of T3GTD-SCDMA
Product Route Map of T3G
STM’s Revenue Structure, 2008
STM’s Revenue, 2005-2008
STM’s Regional Revenue Structure, 2008
STM’s Organization Structure
STM’s Revenue from Wireless Business, 2003-2008
Product Route Chart of EMP
NXP 52XX Series Products Distribution, 2007
NXP 49XX Series Products Distribution, 2007
2G Route Chart of NXP and MTK
Framework of PNX4902 
Internal Framework of PNX54901/03 
Framework of PNX5209
Internal Framework of PCF5213
Nexperia System Solution 5210 
Platform Framework of NXP TD-SCDMA7130
Platform Framework of NXP7210 
Internal Framework of PNX5221
Shipment of Global Top 13 Mobile Phone Vendors, 2008
Global Top 25 Mobile Phone Vendors by Output, 2008
Technical Parameters of BlackBerry BOLD
Component Structure of BlackBerry BOLD
Technical Parameters of BlackBerry STORM
Component Structure of BlackBerry STORM
Technical Parameters of HTC Touch Pro 
HTC Touch ProBill of Materials Sheet (CDMA)
Technical Parameters of Sony Ericsson XPERIA X1
Technical Parameters of T-MOBILE T1
Raw Materials Sheet of T-MOBILE T1 
Technical Parameters of MOTO KRAVE ZN4
Technical Parameters of IPHONE 3G 16GB
Component Supply Sheet of APPLE IPHONE 16GB 
General View of Sony Ericsson Mobile Phone Platform
Configuration Sheet of 17 Typical Types of LG Mobile Phone
Configuration Sheet of 11 Typical Types of Tianyu Mobile Phone
Configuration Sheet of 10 Typical Types of Lenovo Mobile Phone
Configuration Sheet of 5 Typical Types of Gionee Mobile Phone
Profile of Qualcomm’s Seven Branch Companies
Qualcomm’s Chip Shipment and market Share, 2002-2007
Mobile Phone Platform of Texas Instruments
Revenue of Freescale ‘s Mobile Phone Department, Q1 2006-Q4 2008
Profile of Infineon’s Advanced Platform
Baseband Products of Infineon
Brief Introduction of BROADCOM’s Acquisitions 
ADI’s Mobile Phone Baseband Products
Shipment of Spreadtrum’s Mobile Phone Baseband Chips, 2005-2008
NXP’s Baseband Products

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