Global and China Semiconductor Package and Test Industry Report, 2011-2012
  • May/2012
  • Hard Copy
  • USD $2,400
  • Pages:134
  • Single User License
    (PDF Unprintable)       
  • USD $2,300
  • Code: ZYW110
  • Enterprise-wide License
    (PDF Printable & Editable)       
  • USD $3,600
  • Hard Copy + Single User License
  • USD $2,600
      
The report revolves around the following aspects:
1. Overview of global semiconductor industry;
2. Status quo of analog semiconductor, MCU, DRAM, NAND and compound semiconductor market;
3. Status quo of IC manufacturing industry;
4. Package & test industry;
5. 24 major package & test vendors

Independent package & test vendors are generally known as OSAT or ASAT. In 1997, the OSAT industry scale was no more than USD5.1 billion or so, making up 19.6% of the semiconductor industry, as opposed to the market size of USD23.6 billion in 2011. Owning to the fact that TSV technology advances slowly and that foundries are designed to assume partial package business, the OSAT market scale may see little change but slim growth, with the estimated revenue in 2012 registering USD24.4 billion. In the package & test market, the proportions by revenue of package and test are roughly 78% and 22% respectively. It is estimated that the IC test and wafer test will be more time-consuming, further propelling cost proportion up.

Package & test companies are heavily reliant on foundries and IDMs, especially on foundries. Only count on large foundries can package & test companies capture bigger market share. A case in point is ASE, the world’s first largest package & test vendor, which closely collaborates with TSMC, the world’s largest foundry. ASE undertakes nearly all the package & test business of TSMC, the market occupancy of which reaches roughly 48% in global foundry market, while the market share of ASE in global package & test market approximates 18%. In addition, the world’s second largest package & test company Amkor carries cooperation with Global Foundries; the third largest one SPIL teams up with UMC; the world’s fourth largest player, cooperates with INTEL? and Singapore-based Chartered.

The global package & test industry features high concentration, with the combined market share of the top four reaping 46%. This is mainly because of great support from large foundries. The foundry industry in Taiwan is highly developed with the global market occupancy exceeding 60%, which fuels the package & test industry, with a global market share of 56%.

Driven by Singapore-based Chartered and Japan-based IDM, enterprises in Southeast Asia occupy the second place with the market share of 15%. However, since it was merged by Global foundries, business performance of Chartered was bogged down. Inasmuch as most products made by Southeast Asia-based companies are analog IC package & test, there is a great possibility that the business performance of these enterprises will set back due to limited potential.


America-based counterparts are mainly engaged in package & test of high-end products, and there are a host of foundries and IDMs in America, which makes it the third position with the market occupancy of 13%. As for South Korea, the package & test enterprises rely on Samsung and SK Hynix. In the future, Samsung is expected to embrace positive growth in terms of memory business and System LSI business. Therefore, South Korea-based package & test enterprises enjoy bright prospect.

Revenue of Top 24 Package & Test Companies Worldwide, 2008-2012 (USD mln)
20120524.gif

Although there are many foundries in Chinese Mainland, the technology falls far behind. Subsequently, package & test enterprises feature small scale and poor business performance. In 2011, the operating profit of JCET, China’s largest package & test enterprise, slumped by 97.3%; while Nantong Fujitsu Microelectronics, the second largest player, sharply dropped by 89.5%. On average, the operating profit of the world’s top 4 package & test vendors fell by 18%, approximately.
1. Global Semiconductor Industry
1.1 Overview
1.2 IC Design Industry
1.3 IC Package and Test Industry
1.4 Chinese IC Market

2. Semiconductor Industry Pattern
2.1 Analog Semiconductor
2.2 MCU
2.3 DRAM Industry
2.3.1 Status Quo
2.3.2 Market Share of DRAM Manufacturers
2.3.3 Market Share of Mobile DRAM Manufacturers
2.4 NAND
2.5 Compound Semiconductor Industry

3. IC Manufacturing Industry
3.1 Capacity
3.2 Foundry
3.3 MEMS Foundry
3.4 China Foundry Industry
3.5 Foundry Market
3.5.1 Global Mobile Phone Market Size
3.5.2 Market Share of Mobile Phone Brands
3.5.3 Smartphone Market 
3.5.4 PC Market
3.6 Semiconductor Equipment Market
3.7 Semiconductor Material Market

4. Package & Test Industry
4.1 Market Size
4.2 Industry Pattern
4.3 WLCSP Market
4.4 TSV Package
4.5 Semiconductor Test
4.5.1 Teradyne
4.5.2 Advantest
4.6 Ranking of Package & Test Companies Worldwide

5. Package & Test Companies
5.1 ASE 
5.2 Amkor
5.3 SPIL
5.4 STATS ChipPAC
5.5 PTI
5.6 Greatek
5.7 ChipMOS
5.8 KYEC
5.9 Unisem
5.10 FATC
5.11 JCET
5.12 UTAC
5.13 Lingsen Precision.
5.14 Nantong Fujitsu Microelectronics
5.15 Walton Advanced Engineering
5.16 Chipbond
5.17 J-DEVICES
5.18 MPI
5.19 STS Semiconductor
5.20 Signetics
5.21 Hana Micron
5.22 Nepes
5.23 Tianshui Huatian Technology
5.24 Shinko

Revenue of Semiconductor Packaging Material Manufacturers Worldwide, 2010-2013
Chinese IC Market Size, 2007-2011
Product Distribution of Chinese IC Market, 2011
Chinese IC Market by Application, 2011
Market Share of Major IC Companies in China, 2011
Market Share of Major Analog Semiconductor Companies, 2011
Market Share of Catalog Analog Semiconductor Companies, 2011
Ranking of Top 10 Analog Semiconductor Companies, 2011
Ranking of MCU Companies, 2011
CAPEX of DRAM Industry, 2000-2012
Global DRAM Shipment, 2000-2013
DRAM Contract Price Fluctuations, Oct. 2009-Jan. 2012
Revenue of DRAM Companies Worldwide, Q1 2005-Q4 2012
Global Shipment of DRAM Wafer, Q1 2010-Q4 2012
RAM Demand, 2001-2013
Ranking of DRAM Brands by Revenue, Q4 2011
Market Share of Mobile DRAM, 2009-2011
GaAs-based Device Industry Chain
Major Manufacturers in GaAs-based Device Industry Chain
Ranking of GaAs-based Device Companies Worldwide, 2011-2012
Global 12-inch Fabs Capacity, 2011
Capacity of 12-inch Fabs by Region Worldwide, 1999-2012
Expenditure of Major Fabs by Product type, Q4 2011-Q4 2012
Global Wafer Installed Capacity by Product, Q1 2010-Q4 2013
Global Wafer Equipment Expenditure by Region, 2010-2012
Ranking of Global Foundries by Sales, 2005-2011
Operating Margins of World’s Major Foundries, 2005-2011
Ranking of World’s Top 30 MEMS Companies by Revenue, 2011
Ranking of World’s Top 20 MEMS Foundries, 2011
Sales of Chinese Foundries, 2011
Ranking of World’s Top 25 IC Design Houses, 2011
Global Shipment of Mobile Phones, 2007-2014
Global Mobile Phone Shipment and Growth Rate, Q1 2009-Q4 2011
3G/4G Mobile Phone Shipment by Region, 2010-2012
Quarterly Shipment of Major Mobile Phone Brands Worldwide, 2010-2011
Shipment of Major Mobile Phone Vendors Worldwide, 2010-2011
Smartphone Shipment of Major Mobile Phone Vendors Worldwide, 2010-2011
Market Share of Smartphone OS, 2011
Global Shipment of CPU and GPU for PC, 2008-2013
Shipment of Net book, iPad and Tablet PC, 2008-2012
Global Investment in Wafer Equipment, 2007-2016
CAPEX of Global Semiconductor Companies, 2011-2016
WLP Equipment Expenditure Worldwide, 2011-2016
Die Packaging Equipment Expenditure Worldwide, 2011-2016
Automatic Test Equipment Expenditure Worldwide, 2011-2016
CAPEX of Global Top 10 Semiconductor Companies, 2011-2012
Global Semiconductor Materials Market by Region, 2010-2013
Semiconductor Back-end Equipment Expenditure by Region Worldwide, 2010-2012
OSAT Market Size, 2006-2014
Global IC Packaging Types by Shipment, 2007
Global IC Packaging Types by Shipment, 2010
Global Package & Test Market by Technology, 2007, 2011, 2015
Global OSAT Output Value by Region, 2012
Revenue of Taiwanese IC Package & Test Industry, 2007-2011
WLCSP Market Size, 2010-2016
WLCSP’s Shipment by Application, 2010-2016
Fan-in WLCSP 2010-2016 unit CAGR by Device Type
Mobile Phone CPU / GPU Packaging Roadmap
Revenue and Operating Margin of Teradyne, Q1 2010-Q4 2011
New Orders of SOC Products of Teradyne, Q1 2005-Q4 2011
Sales and Backlog Orders of Teradyne by Region, Q4 2011
Orders of Advantest by Segment and Region, FY2010-FY2011
Revenue of Advantest by Segment and Region, FY2010-FY2011
Orders of Advantest by Segment, Q1 2010-Q4 2011
Orders of Advantest by Region, Q1 2010-Q4 2011
Revenue of Advantest by Segment, Q1 2010-Q4 2011
Revenue of Advantest by Region, Q1 2010-Q4 2011
Sales of Advantest’s Semiconductor Test Division by Application, 2000-2011
Global Presence of Advantest
Revenue of Top 24 Global IC Package & Test Companies, 2008-2012
Organizational Structure of ASE
Revenue and Gross Margin of ASE, 2001-2012
Revenue Breakdown of ASE by Business, 2010-2011
Copper Wire Bonding Revenue of ASE, Q1 2010-Q4 2011
Copper Wire Bonding Conversion Rate of ASE, Q1 2010-Q4 2011
ASE’s Copper Wire Bonding Revenue by Region, Q1 2010-Q4 2011
ASE’s Copper Wire Bonding Revenue by Client, Q1 2010-Q4 2011
Revenue and Gross Margin of ASE’s Package Segment, Q1 2010-Q1 2012
Revenue of ASE’s Package Segment by Type, Q1 2010-Q1 2012
Revenue and Gross Margin of ASE’s Test Segment, Q1 2010-Q1 2012
Revenue of ASE’s Test Segment by Business, Q1 2010-Q1 2012
Revenue, Gross Margin and Operating Margin of ASE’s Materials Segment, Q1 2010-Q1 2012
CAPEX and EBITDA of ASE, Q1 2010-Q1 2012 
Top 10 Clients of ASE, Q1 2012
Revenue of ASE by Application, Q1 2012
ASE Presence in China
Package Types of ASE Shanghai
Revenue of ASE Shanghai, 2004-2011
Revenue, Gross Margin and Operating Margin of Amkor, 2005-2011
Amkor’s Revenue by Package Type, 2007-2011
Amkor’s Revenue by Package Type, Q4 2008-Q1 2012
Amkor’s Shipment by Package Type, Q4 2008-Q1 2012
Amkor’s CSP Packaging Revenue and Shipment, 2005-Q3 2011
Amkor’s CSP Packaging Revenue by Application, 2011
Amkor’s BGA Packaging Revenue and Shipment, 2005-Q3 2011
Amkor’s BGA Packaging Revenue by Application, 2011
Amkor’s Leadframe Packaging Revenue and Shipment, 2005-Q3 2011
Amkor’s Leadframe Packaging Revenue by Application, Q3 2011
Amkor’s Packaging Capacity Utilization, Q1 2008-Q4 2011
Revenue, Gross Margin and Operating Margin of SPIL, 2003-2011
Revenue of SPIL by Region, 2005-Q1 2012
Revenue of SPIL by Application, 2005-Q1 2012
Revenue of SPIL by Business, 2005-Q1 2012
SPIL’s Capacity Statistics in Q1 2006, Q2-Q3 2007 and Q3-Q4 2011
Revenue and Gross Margin of STATS ChipPAC Ltd., 2004-2011
Revenue of STATS ChipPAC Ltd. by Package Type, 2006-Q1 2012
Revenue of STATS ChipPAC Ltd. by Application, 2006-Q1 2012
Revenue of STATS ChipPAC Ltd. by Region, 2006-2011
Revenue and Operating Margin of PTI, 2006-2012
PTI’s Factories
PTI’s TSV Solutions 
PTI’s Revenue by Business, Q1 2012
PTI’s Revenue by Product, Q1 2012
Revenue, Gross Margin and Operating Margin of Greatek, 2002-2011
Revenue of Greatek by Technology Type, 2007-2010
Revenue and Gross Margin of ChipMOS, 2003-2011
Revenue of ChipMOS by Business, 2010-2011
Revenue of ChipMOS by Product, 2010-2011
Revenue of ChipMOS by Client, 2011
Revenue of ChipMOS by Region, 2006-2011
Revenue and Gross Margin of KYEC, 2002-2012
Monthly Revenue of KYEC, Apr. 2010-Apr. 2012
KYEC’s Factories
KYEC’s Testing Platforms 
Unisem’s Revenue and EBITDA, 2006-2011
Organizational Structure of Formosa Plastic Group
Revenue and Operating Margin of FATC, 2006-2012
Monthly Revenue of FATC, Apr. 2010-Apr. 2012
Revenue and Operating Margin of JCET, 2006-2012
JCET’s Roadmap
JCET’s Revenue by Region, 2011
Revenue and Operating Margin of Lingsen Precision Industries, Ltd., 2007-2012
Monthly Revenue of Lingsen Precision Industries, Ltd., Apr. 2010-Apr. 2012
Revenue and Growth Rate of Nantong Fujitsu Microelectronics, 2006-2011
Net Income and Growth Rate of Nantong Fujitsu Microelectronics, 2006-2011
Quarterly Revenue and Growth Rate of Nantong Fujitsu Microelectronics, 2006-2011
Quarterly Net Income and Growth Rate of Nantong Fujitsu Microelectronics, 2006-2011
Quarterly Gross Margin of Nantong Fujitsu Microelectronics, 2006-2011
Quarterly Selling, Administrative and R&D Expenses of Nantong Fujitsu Microelectronics, 2006-2011
Revenue and Operating Margin of WALTON, 2007-2012
Monthly Revenue and Growth Rate of WALTON, Apr.2010-Apr.2012
Revenue and Operating Margin of Chipbond, 2006-2012
Monthly Revenue and Growth Rate of Chipbond, Apr.2010-Apr.2012
Revenue of Chipbond by Product, Apr.2009-Apr.2012
Revenue and EBIT of MPI, FY2007-FY2012
Revenue of MPI by Region
Revenue of Carsem by Product, Q1 2011-Q1 2012
Revenue and Operating Margin of STS Semiconductor, 2006-2012
Equity Structure of Signetics
Revenue and Operating Margin of Signetics, 2007-2012
Capacity Utilization and Operating Margin of Signetics, Q1 2010-Q4 2012
Revenue of Signetics by Product, 2011
Revenue of Signetics by Customer, 2011
Revenue and Operating Margin of Hana Micron, 2006-2012
Revenue of Hana Micron by Customer, 2011
Revenue and Operating Margin of Nepes, 2007-2012
Quarterly Revenue and Operating Margin of Nepes, 2006-2012
Quarterly Revenue of Nepes by Division, 2006-2012
Quarterly Operating Income of Nepes by Division, 2006-2012
Revenue and Operating Margin of Tianshui Huatian Technology, 2006-2012
Revenue and Net Income of Shinko, FY2007-FY2012
Revenue of Shinko by Business, FY2011-FY2012

Global and China IC Substrate Industry Report, 2011-2012

With the improvement of IC operating frequency and integration, traditional leadframe packaging is out of use, and IC has to be packaged by substrates. By packaging mode, the mainstream IC substrates ...

Global and China Semiconductor Equipment Industry Report, 2011-2012

In 2011, the CAPEX of semiconductor industry were about USD65.8 billion, up 14.3% compared with that in 2010, among which, the CAPEX on equipment stood at about USD44 billion, with a year-on-year incr...

Global and China GaAs-based Device Industry Report, 2011-2012

Distinct from traditional silicon semiconductor, gallium arsenide (GaAs) is a compound of the elements gallium and arsenic. It is an III-V semiconductor and is mainly used in handset RF front end like...

Global and China IC Manufacturing Industry Report, 2011-2012

The IC manufacturing industry mainly involves memory vendors, IDMs and foundries. By technology, IC can be divided into analog, digital and mixed signal. Most digital IC businesses are IC design house...

Global and China Semiconductor Equipment Industry Report, 2013-2014

After two years of recession, the semiconductor equipment market is projected to achieve growth in 2014. In 2011, the semiconductor equipment market size hit a record high of USD43.532 billion, but it...

China Digital TV Transmitter Industry Report, 2013

According to the planning of the State Administration of Radio, Film and Television (SARFT), China in 2015 will shut down analog TV and complete the integral transition of cable TV from analog to digi...

Global and China Memory Industry Report, 2013

Global and China Memory Industry Report, 2013 consists of the following contents: Brief introduction to global semiconductor industry Market analysis of DRAM and NAND Major memory vendors  Majo...

Global and China Passive Component Industry Report, 2012-2013

The report highlights the followings: 1. Brief Introduction to Passive Components;  2. Passive Component Industry & Market Segments-Capacitor, Inductor and Resistor;  3. Main Downst...

Global and China GaAs Industry Report, 2012-2013

Global and China GaAs Industry Report, 2012-2013 covers the followings: 1 Brief introduction to GaAs2 Industry overview of GaAs3 Downstream market of GaAs4 Analysis on mobile phone RF system 5 Study o...

Global and China Advanced Packaging Industry Report, 2012-2013

Global and China Advanced Packaging Industry Report, 2012-2013 covers the followings: 1.     Global Semiconductor Industry Overview;2.     IC Manufacturing Industry Overv...

Global and China Touch Screen (Panel) Industry Report, 2012-2013

Global and China Touch Screen (Panel) Industry Report, 2012-2013 covers the followings: Touch Screen Market Size Trends of Small, Medium and Large-sized Touch Screens Touch Screen Downstream Market...

Global and China Mobile PC Casing (Enclosure) Industry Report, 2012-2013

The report covers the followings:    1. Global and Chinese PC markets    2. Global and China Mobile PC industry    3. Notebook and tablet PC casing industr...

Global and China PC Cable Assembly Industry Report, 2012-2013

Global and China PC Cable Assembly Industry Report, 2012-2013 covers the followings: 1. Global and China PC Market; 2. Global and China Mobile PC Market;3. PC Cable Assembly Industry;4. 15 Major PC Ca...

Global and China Flexible Printed Circuit Board (FPCB) Industry Report, 2012

Global and China Flexible Printed Circuit Board (FPCB) Industry Report, 2012 includes the following contents: 1. Profile of FPCB2. Overview of FPCB Market and Industry3. Analysis of 22 Major FPCB Ma...

Global and China OLED Industry Report, 2012

Promoted by the display giants headed by Samsung and LG, OLED industry is still in the stage of steady development. In 2011, the OLED output value worldwide approximated USD3.3 billion, with year-on-y...

China Navigation Equipment Industry Report, 2012-2014

After forty years of development, the global satellite navigation system has developed into a “one plus three” pattern. And the “one” refers to GPS made in the USA, and the three refer to Chinese, Rus...

Global and China Power Device Industry Report, 2011-2012

Global and China Power Device Industry Report, 2011-2012underlines: 1. power device; 2. global and China power device market; 3. power device industry; 4. IGBT, SiC and GaN market and industry outlook...

China Digital TV Transmitter Market Report, 2012

The analog-to-digital TV signal conversion in different countries around the world reached its peak after 2009, so did the digital television network construction. The United States plans to complete ...

Global and China LCD Backlight Unit (BLU) Industry Report, 2011-2012

Global and China LCD Backlight Unit (BLU) Industry Report, 2011-2012 covers the followings: Introduction to LCD Backlight Unit LCD Backlight Unit Market LCD Panel Market 11 Major LCD Panel Players 12 ...

Global and China Display Driver IC Industry Report, 2011-2012

The report highlights the followings: Brief introduction to display driver IC;Display driver IC market;Small-and medium-sized panel market of display driver IC; Research of 9 leading display driver ...

China IC Card/Smart Card Industry Report, 2011-2012

In 2011, the sales of IC card grew 11.1% over 2010 to around RMB9 billion, and its sales volume rose 13.6% over 2010 to 2.43 billion, hitting a record high. The IC card industry is expected to increas...

Global and China Touch Panel (Including Small- and Medium-sized Display) Industry Report, 2011-2012

Global and China Touch Panel (Including Small- and Medium-sized Display) Industry Report, 2011-2012 conducts studies on the followings: Downstream market of touch panel; Touch panel & small- and mediu...

2005-2014 www.researchinchina.com All Rights Reserved 京ICP备05069564号-1 京公网安备1101054484号
在线客服系统