Camera Phone Module Industry Report, 2004-2005
  • Mar/2005
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Taiwan of China dominates the world camera phone module assembly market.

The top 3 world camera module assembling companies - Primax, Premire and Chicony are all Taiwan-based, and they take 40% of the total world market share. With other Taiwan-based assembling manufacturers, Taiwan-based companies controlled over 60% of the world camera phone module-assembling sector. However, as a downstream sector and because of the relatively low technological contents, most enterprises just gain a poor profit thanks to large-scale producing et to components cost-cut.

CCD sensor module is dominated by manufacturers from Japan, while CMOS sensor by manufacturers from USA and South Korea.

Over 90% of the CCD module market share is occupied by Japanese manufacturers, and used mainly in digital cameras and Japanese domestic camera phones. Led by Sony, Panasonic and Sharp, modules over 2 mega pixels often adopt CCD sensor. CMOS sensor module is led by Omnivision, Agilent and Micron, followed by Samsung, Hyundai, Pixart, and IC Media, and is usually lower than 2 mega pixels.

American manufacturers dominate the back-end chip market.

Similar to mobile handset’s baseband chip, back-end chip, exclusively used for information process, is led by TI, Qualcom, Zoran, followed by Renesa, ZTE. And Lingyang, Songhan, Huabang, Zhaohong, Huajin are also active manufacturers, all those companies accounting for over a 65% market share in the world.

Plastic lens module is led by Taiwan manufacturers, while glass lens is monopolized by Japanese enterprises.

FPC production is divided between Japan, America, and East Asia.

Japan accounts for 35% of world FPC output, while America accounts for 32%, and Asia (excluding Japan) accounts for 19% (Taiwan 7%, and Thailand 6%). Japanese companies include Mektron, Smitoto, Fujikura, Nitto, etc. American companies include Parlox, Sheldahl, Adflex, etc. Although FPC single cost is low, its profitability is high.

Current available modules in the market are 0.3 mega pixels, 1.3 mega pixels and 2 mega pixels. The 1.3 mega pixels will still be the mainstream in the first half of 2005, 2.0 mega pixels will be mainstream later, in 2005-2006. Lens technology is the key point to increase the number of pixels, glass lens will become mainstream, and represents a great potential in the optical zooming sector.

This report looks into the global camera phone module sector, considers the competition and cooperation between upstream and downstream of the sector, analyzes enterprises' status and competition patterns, relations between camera module manufacturers and lens module, CCD sensor module, CMOS sensor module, back-end chip and FPC manufactures. It reveals problems and opportunities in the camera phone module sector; moreover, it analyzes global camera phone module technology, market status and trends, providing detailed information to the enterprises aiming to enter this industry.  


 

1.Composition of camera phone module and the industry chain 
1.1 Composition and principle concepts
1.1.1 Lens
1.1.2 Sensor
1.1.3 Back-end IC
1.1.4 FPC
1.2 Assembly technics 
1.2.1 CSP (Chip Scale Package)
1.2.2 COB (Chip on Board)
1.3 Cost of the components 
1.4 Composition of the industry chain 

2.Global market and trends
2.1 Summary of the global market
2.2 Continental markets
2.2.1 Asian-Pacific 
2.2.2 Europe 
2.2.3 North America
2.2.4 Others
2.3 Major national and regional market
2.3.1 Japan
2.3.2 ROK
2.3.3 The USA
2.3.4 Taiwan of China
2.3.5 Others
2.4 Trends of the global market

3.Market status quo and trends of China's camera phone module
3.1 Demand and output value
3.2 Supply and profits
3.3 Technology trends
3.4 Market trends

4.Major camera phone module components manufacturers
4.1 Lens module manufacturers 
4.1.1 Summary
4.1.2 Taiwan Yujin
4.1.3 Taiwan Largon
4.1.4 Taiwan Yaguang
4.1.5 Taiwan Jinyuan
4.1.6 Taiwan Jinguoguan
4.1.7  Sanxing Dianji
4.1.8 Sekonix
4.1.9 Olympus
4.1.10 Cowell World Optech
4.1.11 Kolen
4.1.12 Phoenix Optical
4.1.13 Other manufacturers
4.2 CMOS module manufacturers 
4.2.1 Summary of CMOS module market 
4.2.2 CMOS sensor IC design 
4.2.3 OmniVision
4.2.4 Agilent
4.2.5 Micron
4.2.6 ST semiconductor
4.2.7 Hynix(Hyundai)
4.2.8 Pixart
4.2.9 Sanxing Dianji
4.2.10 Taiwan Primax
4.2.11 Taiwan Prixart
4.2.12 Taiwan Tishi
4.2.13 Taiwan Yilin
4.2.14 Taiwan Dunlang
4.2.15 TransChip
4.2.16 Conexant
4.2.17 Toshiba
4.2.18 Sony
4.3 CCD module manufacturers 
4.3.1 CCD module market summary
4.3.2 CCD sensor IC design summary
4.3.3 Sony
4.3.4 Panasonic
4.3.5 Sharp
4.3.6 Sanyo
4.3.7 Toshiba
4.3.8 Mitsubish
4.3.9 Fuji
4.3.10 Kyocera
4.3.11 LG Innotek
4.3.12 Other manufacturers
4.4 Back-end IC manufacturers 
4.4.1 Market summary
4.4.2 TI
4.4.3 Qualcomm
4.4.4 Renesas
4.4.5 ZTE Microelectronics
4.4.6 ST Semiconductor
4.4.7 Zoran
4.4.8 Linyang
4.4.9 Songhan
4.4.10 Huabang
4.4.11 Nvidia
4.4.12 Intel
4.4.13 Other manufacturers
4.5 FPC manufacturers 
4.5.1 FPC market summary
4.5.2 Qisheng
4.5.3 Jialianyi
4.5.4 Qixing
4.5.5 Yaxing
4.5.6 Weisheng Technology
4.5.7 Jiayi
4.5.8 Hejun

5.Camera phone module-assembling companies
5.1 Summary of the assembly market
5.2 Zhishen Technology
5.3 Premier Taiwan
5.4 Qunguan Taiwan
5.5 Zhiji Electronics
5.6 Dunan
5.7 Yangxin
5.8 Sanxing
5.9 Cowell World Optech 
5.10 Sunyang Digital Image
5.11 Hansung Elcomtec
5.12 Alps Electric
5.13 Olympus
5.14 Pentax
5.15 Sharp

6.Prospects and opportunities
6.1 lens module
6.2 Sensor
6.3 Assembly line

7.Conclusion and Suggestions
Relationships between lens and pixel degree
Comparison of CCD and CMOS sensor
Major subassemblies of image sensor
Function sketch map
Major products and functions of FCP
Comparison between CSP and COB
CSP assembly process elementary diagram
COB assembly process elementary diagram
Cost composition of camera module subassemblies
Mobile camera module sales price
Structure diagram of mobile camera module industry chain
Market development in 2002-2007
Core technologies distribution in the world
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