IC Advanced Packaging Industry Report, 2009
  • Oct/2009
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The semiconductor industry is in the era of 32nm process, and it is expected that it will meet 16nm around 2019. Designing a 45nm SoC costs USD20-50 million except labor cost, and the design of a 32nm SoC costs USD75-120 million, while it is less than USD5 million for 130nm. Therefore, even if the IC design companies with annual revenue of over USD2 billion probably can not afford such high cost, and there are no more than ten such companies all over the world, which means that the majority of IC design companies are disqualified to enter 45nm or 32nm era. Perhaps the semiconductor industry will develop at the pace of Moore’s Law. Having made up for the bottleneck of process shrinkage, the packaging industry will yield unusually brilliant results in post-Moore’s Law era.

In practice, the packaging industry has become increasingly important since 2000, and the debut of BGA, FC and CSP has sped up the progression of semiconductor industry. However, the front-end of semiconductor manufacturing has been in stagnancy, still in the era of 12-inch wafer, and it is likely that 15-inch wafer era will not come. Currently, a revolutionary packaging, TSV packaging presents itself, which is so called 3D IC. The technology will dramatically improve chip transistor density, cubic density rather than plane density, and make semiconductor industry surpass the development pace of Moore’s Law. Not only packaging companies and wafer OEMs, but also nearly all global prominent semiconductor companies such as IBM, Samsung, Intel and Qualcomm are all actively developing TSV technology. TSV has been in large shipment in image sensor and MEMS field, and it will rapidly expand to memory field in the future, and to DSP, RF IC, cell phone baseband, processor, CPU and GPU in 2013. Furthermore, TSV market size will rise to over US$2 billion from less than US$ 300 million currently, which will be the rapidest growing field in semiconductor industry.

In the meantime, the advanced packaging has an increasingly powerful driving force. IC advanced packaging mainly refers to IC substrate packaging, including BGA, CSP, FC and LGA, and it mainly applies for cell phone, memory, PC (CPU, GPU and Chipest), network communications, and consumer electronics. In addition, the network communications include high-speed switch, router and base station. Consumer electronics are as the followings such as game console, IPOD, ITOUCH, and high-end PMP. The cell phone has more and more powerful functions, thinner and thinner in size; and the smart phones have covered a rising ratio. In the field of memory, DDR3 has become the mainstream, with the rate increased to over 1GHz; CPU has multi-cores, and the number of pins has exceeded 1,200. China’s 3G and the world’s 4G network distribution has boosted up the sales of base stations. The stay-at-home economy has made game machine shipment increase sharply as well.

Revenue Forecast of Global 19 IC Advanced Packaging Manufacturers, 2009

Japan and Taiwan have almost dominated IC packaging industry. Among the global top 12 companies, seven of which are from Taiwan, two from Japan, two from the United States, and one from South Korea.

1 Status Quo and Future of IC Advanced Packaging 
1.1 IC Packaging Overview 
1.2 IC Packaging Types 
1.2.1 SOP 
1.2.2 QFP and LQFP
1.2.3 FBGA
1.2.4 TEBGA
1.2.5 FC-BGA
1.2.6 WLCSP 
1.3 Future Star – TSV Packaging  
1.3.1 TSV Intro
1.3.2 Why is TSV rather than SoC  
1.3.3 TSV Development 
1.3.4 TSV Industry and Market 

2 IC Advanced Packaging Market 
2.1 Cell Phone IC Advanced Packaging Market 
2.2 Cell Phone Baseband Packaging 
2.2.1 Cell Phone Baseband Industry 
2.2.2 Cell Phone Baseband Packaging 
2.3 Cell Phone (Mobile) Application Processor 
2.3.1 Definition 
2.3.2 Market and Industry 
2.4 Smart Phone Processor Industry and Packaging 
2.5 Cell Phone Embedded Memory 
2.5.1 Overview 
2.5.2 Cell Phone Memory Development 
2.5.3 Cell Phone Memory Industry and Packaging 
2.6 Cell Phone RF IC 
2.6.1 Market 
2.6.2 Industry 
2.6.3 3G/4G-era Cell Phone RF IC Packaging  
2.7 Other Cell Phone IC  
2.8 Cell Phone Market and Industry 
2.8.1 Market 
2.8.2 Industry 
2.8.3 China’s Smart Phone Market 
2.9 Advanced Packaging in PC Field 
2.9.1 DRAM Industry 
2.9.2 DRAM Packaging 
2.9.3 NAND Flash Industry 
2.9.4 NAND Flash Packaging Development  
2.9.5 CPU, GPU & North and South Bridge Chipset  
2.10 Image Sensor  

3 Advanced Packaging Industry 
3.1 Industry Scale 
3.2 Industry Patterns
3.3 Comparison of Manufacturers

4 Advanced Packaging Manufacturers 
4.2 Greatek
4.3 Formosa 
4.4 ASE 
4.6 SPIL
4.9 Nanya 
4.10 Kinsus
4.11 PowerTech
4.12 ChipMOS 
4.13 King Yuan Electronics 
4.18 NEPES
4.19 STS
4.20 SEMCO
4.21 Unimicron 
4.22 Chipbond
4.23 Changjiang Electronics Technology 
IC Packaging Development Course, 1980-2010 
SOP and TSSO Outline and Cross-sectional Diagram 
QFP, LQFP, HQFP Packaging Outline and Cross-sectional Diagram 
FBGA Outline and Cross-sectional Diagram 
FBGA Development Roadmap, 2006-2012 
TEBGA Outline and Cross-sectional Diagram 
FC-BGA Outline and Cross-sectional Diagram 
FC-BGA Development Roadmap, 2006-2012 
WL-CSP Outline, Manufacturing Flow and Cross-sectional Diagram 
Via First TSV Sketch-map
Via Last TSV Sketch-map 
TSV Roadmap, 2005-2015 
TSV Application Roadmap
TSV Via Size Roadmap
TSV Industry Layout
TSV Wafer Shipment by Application, 2006-2014 
Typical Cell Phone Block Diagram 
Market Shares of Global Cell Phone Baseband Manufacturers' Shipment, 2007-2009 
Market Shares of China’s Cell Phone Baseband Manufacturers, 2009 
Processor Marker Scale Forecast by Type, 2008-2012 
Market Shares of Main Non-Smart Phone Processor Manufacturers by Sum, 2008 
Market Shares of Main Smart Phone Processor Manufacturers, 2009 
Cell Phone Embedded Memory Development Roadmap
Cell Phone NOR Memory Demand (Mb), 2004-2012 
Cell Phone RAM Memory Demand (Mb), 2004-2012 
Cell Phone NAND Memory Demand (Mb), 2004-2012 
Market Shares of Main Cell Phone Memory Manufacturers, 2009 
Cell Phone Single-chip Memory Packaging Trend, 2007-2010 
SIP Cell Phone Memory Packaging Development Trend, 2007-2011 
PoP Cell Phone Memory Development Trend, 2007-2011 
Global Cell Phone RF Market Scale, 2003-2010E 
Global 3G Cell Phone Distribution by Band Number, 2009-2013 
Market Shares of Global Main Cell Phone RF Transceiver Manufacturers by Shipment, 2008 
Market Shares of Global Main Cell Phone PA Manufacturers by Sum, 2008 
Comparison of Main PA Manufacturers’ Technology Capabilities 
Intel CPU Development Trend, 2009-2011 
PC Shipment, 2006-2013E 
Early Cell Phone Camera Module Sketch-map
Cell Phone Camera Module with TSV Packaging 
Cell Phone Camera Module Industry Chain 
CMOS Image Sensor Shipment, 2008-2013 
Market Shares of Main CMOS Image Sensor Manufacturers, 2009 
Market Shares of Cell Phone Camera Module Assembly Manufacturers 
Market Shares of Main Cell Phone Camera Optics Lens Manufacturers 
TSV Roadmap of CMOS Image Sensor
Global IC Packaging Shipment by Type, 2007 
Global IC Packaging Shipment by Type, 2012 
Global IC Packaging Sum by Type, 2007 
Global IC Packaging Sum by Type, 2012 
Downstream Distribution of Global Advanced Packaging Industry , 2009 
Regional Distribution of Global Advanced Packaging Industry, 2009 
Market Shares of Main Global Advanced Packaging Manufacturers in Cell Phone Field, 2009 
Market Shares of Main Global Advanced Packaging Manufacturers in Laptop Field, 2009 
Market Shares of Main Global Advanced Packaging Manufacturers in Memory Field, 2009 
Market Shares of Main Global Advanced Packaging Manufacturers in Network Communication, 2009 
Market Shares of Main Global Advanced Packaging Manufacturers in Consumer Electronics, 2009 
TESSERA Business Distribution 
TESSERA’s Patent Number, 2000-2009Q2 
TESSERA’s Revenue, 2004-2008 
TESSERA’s Main Clients 
TESSERA’s Presence Worldwide
Revenue and Gross Profit Margin of Greatek Electronics, 2002-2012 
Organization Structure of Greatek Electronics 
Revenue of Greatek Electronics by Packaging Technology, 2007-2008 
Formosa’s Revenue and Gross Profit Margin, 2002-2012 
Formosa’s Organization Structure 
Formosa’s Revenue by Product, 2009 
ASE’s Revenue and Gross Profit Margin, 2001-2010
ASE ‘s Organization Structure 
ASE’s Revenue and Gross Profit Margin, 2007Q1-2009Q2 
ASE’s EBITDA and Investment Amount, 2007Q1-2009Q2 
ASE’s Packaging Revenue and Gross Profit Margin, 2007Q1-2009Q2 
ASE’s Packaging Revenue by Product, 2007Q1-2009Q2 
ASE Test Department’s Revenue and Gross Profit Margin, 2007Q1-2009Q2 
ASE Test Department’s Revenue by Technology, 2007Q1-2009Q2 
ASE Product Downstream Application, 2005Q4, 2007Q2, 2008Q1 and 2009Q2 
ASE’s Core Test Technologies 
Amkor’s Revenue and Gross Profit Margin, 2007Q1-2009Q2 
Amkor’s Expenditure Ratio by Item, 2007Q1-2009Q2 
Amkor’s Revenue by Division, 2008Q1-2009Q2 
Amkor’s Product Downstream Application, 2008Q1-2009Q2 
Amkor’s IC Shipment by Packaging Type, 2008Q1-2009Q2 
Amkor’s Output Utilization Rate and Customer Concentration, 2008Q1-2009Q2
SPIL’s Organization Structure 
SPIL’s Revenue and Gross Profit Margin, 2003-2010 
SPIL’s Revenue by Region, 2005Q4, 2007Q2, 2009Q1 & 2009Q2 
SPIL’s Product Downstream Application Structure, 2005Q4, 2007Q2, 2009Q1 & 2009Q2 
SPIL’s Product Structure by Technology Type, 2005Q4, 2007Q2, 2009Q1 & 2009Q2
StatsChipPAC’s Revenue and Gross Profit Margin, 2004-2009 
StatsChipPAC’s Revenue by Division, 2006-2009Q2 
StatsChipPAC’s Product Downstream Application Ratio, 2006-2009Q2 
StatsChipPAC’s Revenue by Region, 2006-2009Q2 
PHOENIX’s Organization Structure
PHOENIX’s Revenue and Gross Profit Margin, 2003-2010 
PHOENIX’s Product Structure, 2008Q1-2009Q2
PHOENIX’s Product by Layer, 2008Q1-2009Q2 
PHOENIX’s Product Downstream Application Ratio, 2008Q1-2009Q2 
PHOENIX’s Revenue by Region, 2007Q1-2009Q2
PHOENIX’s Staff Structure
Nanya’s Revenue and Gross Profit Margin, 2003-2010 
Nanya's Circuit Board Revenue Structure, 2007, 2008 & 2009Q2 
Nanya’s Circuit Board Product Downstream Application Ratio, 2009Q2 
Kinsus’ Revenue and Gross Profit Margin, 2001-2010
Kinsus’ Revenue, Jul, 2008-Jul, 2009 
Kinsus’ Product Downstream Application Ratio, Jan-Jul, 2009
Ratios of Main Clients’ Contribution to Kinsus Revenue, 2007H1 
Kinsus’ Products by Technology, 2007-2009 
PowerTech’s Revenue and Gross Profit Margin, 2005-2010
ChipMOS Organization Structure 
ChipMOS Revenue and Gross Profit Margin, 2001-2009 
ChipMOS Revenue by Region, 2006-2008 
ChipMOS Revenue by Division, 2006-2008 
ChipMOS Memory Revenue, 2001-2007Q3 
ChipMOS Flash Memory Revenue, 2006Q1-2007Q3 
ChipMOS LCD Driver IC Revenue, 2001-2007Q3 
Revenue and Gross Profit Margin of King Yuan Electronics, 2003-2010 
Organization Structure of King Yuan Electronics
Revenue of King Yuan Electronics by Process, 2007Q3 
Revenue of King Yuan Electronics by Product, 2007Q3 
Product Downstream Applications of King Yuan Electronics, 2007Q3 
IBIDEN’s Revenue and Operation Profit Margin, 2004-2008FY 
IBIDEN’s Revenue by Division, 2004-2008FY 
IBIDEN’s Revenue by Region, 2004-2008FY 
IBIDEN’s FC Substrate Output Capability Expansion Plan 
IBIDEN’s FC Packaging Product Shipment, 2006-2012 
Shinko’s Revenue and Operating Profit Margin, 2005-2010 
Shinko’s Total Liabilities and Shareholder’s Equities, 2005-2009FY 
Shinko’s Net Profit, 2005-2009FY 
Shinko’s Capital Expenditure, 2005-2009FY
Shinko’s Revenue by Division, 2005-2009FY 
Shinko’s Product Tree 
Unisem’s Revenue and Gross Profit Margin, 2004-2009 
Nepes’ Revenue and EBITDA, 2007-2011E 
Nepes’ Revenue by Division, 2008Q1-2009Q4 
STS Revenue and EBITDA, 2004-2008 
STS Revenue by Product, 2009Q1-2010Q4 
Unimicron’s Organization Structure 
Unimicron’s Revenue and Gross Profit Margin, 2000-2010
Unimicron’s Plants
Unimicron’s Output Capability by Product, 2007-2009 
Unimicron’s Revenue by Product, 2009Q1 vs. 2009Q2 
Unimicron’s Revenue by Downstream Application, 2009Q1 vs. 2009Q2 
Unimicron’s Revenue by Product, 2008 vs. 2009H1 
Unimicron’s Revenue by Downstream Application, 2008 vs. 2009H1 
Chipbond’s Revenue and Gross Profit Margin, 2003-2010
Chipbond’s Revenue by Technology, 2006-2010 
Chipbond’s Clients, 2005-2009 
Revenue and Operating Profit Margin of Changjiang Electronics Technology, 2006-2009 
Staff Structure of Changjiang Electronics Technology by the end of 2008 

Revenue of Global Main Cell Phone Baseband Manufacturers, 2008 
Packaging Technology Development Forecast of Global Main Cell Phone Baseband Manufacturers, 2008-2013 
Comparison of 12 Typical Baseband Packaging Types 
Packaging Comparison of Typical Cell Phone Processors 
Packaging Technologies of Global Typical Cell Phone Processors, 2009 
Comparison of 12 Typical PA Packaging 
Comparison of 13 Typical RF Transceivers’ Packaging 
Other Typical Cell Phone IC Packaging Technologies 
Shipment of Global Top 13 Brand Manufacturers, 2008 
Top 25 Cell Phone Manufacturers in China by Output, 2008 
ASE’s Top Ten Clients, 2006Q1, 2008Q1 & 2009Q2 
SPIL’s Output Capacity, 2006Q1, 2007Q2&Q3 and 2009Q1&Q2 
Nanya’s Circuit Board Output Capacity, 2007-2009 
M&A Events of ChipMOS
Output Capacity of ChipMOS Shanghai Base 
FC Packaging Revenue, 2006-2009FY 
Chipbond’s Output Capacity, 2009-2010 

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