Global and China PCB (printed circuit board) Industry Report, 2010
  • Jun.2010
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In 2009, the output value of the global PCB industry reached about US$40.6 billion, down 15.83% over 2008. This was mainly caused by continuously decreasing PCB shipment and average prices. As for main sub-sectors, the output value of the global substrate, rigid PCB and flexible printed circuit (FPC) board sectors descended by 50%, 20% and 3.8% respectively compared with 2008. The decline of the global substrate and rigid PCB sectors is mainly due to the sharp drop of sales volume of desktops and medium to high-end notebooks. In comparison, the global FPC board sector declined more slightly in 2009, thanks to the growing number of LED backlight modules and Smart Phone FPC boards as well as the touch panel boom.

From 2000 to 2009, in terms of output value, computer, communications, industrial/medical, military and automotive PCBs decreased by 3%, 13.5%, 20.5%, 20.1% and 26.8% respectively, while consumer electronics PCB and package substrate increased by 15.8% and 68% respectively. Single-sided/double-sided PCB and multilayer PCB decreased by 37.3% and 25.2% respectively, while high-density interconnect (HDI) board, package substrate and FPC increased by 163.1%, 68.1% and 90.0% respectively.

In 2009, from the perspective of the global PCB distribution pattern, Mainland China, Japan and Taiwan were still the main production areas, South Korea continued to expand its PCB industry, while Europe and the United States were in recession. Compared with Japan and South Korea with advantages in high-end products such as IC substrate and FPC board, and Taiwan with advantages in mobile phone PCB, China, mainly engaged in single-sided PCB and multilayer PCB, is inferior in terms of the technical content of the PCB industry.

In 2009, China's PCB industry for the first time saw its output value decline slightly by 3.6% to US$16.35 billion. Nevertheless, its share in the global PCB output value continued to rise. Among China's top 100 PCB enterprises in terms of sales revenue, local ones performed well, for example, the sales revenue of Bomin Electronic rose by 150.7% over 2008.

Sales Revenue Growth of Major Chinese PCB Enterprises, 2009 
Source: ResearchInChina; China Printed Circuit Association

1. Application of PCB 
1.1 Mobile Phone PCB Industry 
1.2 PCB for Memory Module
1.3 PCB for Photovoltaic Panel
1.4 PCB for Notebook and DV 
1.5 PCB for Automobile Electronics

2. PCB Industry
2.1 PCB Industry Chain
2.2 PCB Industry Review in 2009 and Outlook in 2010
2.3 Technology Pattern of PCB Industry 
2.4 Geographical Pattern of PCB Industry 
2.5 PCB Industry in Taiwan
2.6 PCB Industry in Mainland China 
2.7 FPC Market Scale
2.8 FPC Industry Chain
2.9 Geographical Distribution of FPC Industry 
2.10 Relationship between FPC Customers and Suppliers
2.11 Ranking in FPC Industry
2.12 Ranking in PCB Industry

3. Typical PCB Manufacturers
3.1 Samsung Electro
3.2 AT&S
3.3 Guangdong Goworld Co., Ltd
3.3.1 Profile and Operation
3.3.2 Business Development Advantages
3.3.3 Development Trends, 2010
3.4 Aspocomp
3.5 Founder PCB
3.6 Meiko Electronics Co., Ltd
3.7 Meadville Group
3.8 Unimicron
3.10 Unitech
3.11 WUS Printed Co., Ltd
3.13 Chin Poon Industrial Co., Ltd
3.14 Tripod Technology Corporation
3.16 HannStar Board Co., Ltd
3.17 Tianjin Printronics Circuit Corp
3.18 Kingboard Chemical Holdings Ltd
3.19 DYnamic Electronics Cp., Ltd
3.21 Viasystems Group Inc
3.22 Daisho Microline Limited
Technology Trends of Mobile Phone PCB 
Mobile Phone PCB Suppliers of Apple, 2009
Mobile Phone PCB Suppliers of RIM, 2009
Mobile Phone PCB Suppliers of Nokia, 2006,2009 
Mobile Phone PCB Suppliers of Samsung, 2006,2009 
Mobile Phone PCB Suppliers of LG, 2006,2009
PCB Suppliers of Major Mobile Phone Manufacturers
Market Shares of Mobile Phone PCB Manufacturers by Revenue, 2009
Market Shares of Major Memory PCB Suppliers, 2006,2009
Market Shares of Major Photovoltaic Panel Manufacturers in Taiwan, 2006, 2009  
Technical Roadmap of Notebook PCB 
Market Shares of Major Notebook PCB Manufacturers in the World, 2006, 2009 
Cost Structure of CCL Industry and PCB Industry
Global PCB Output Value, 1997-2009
Global PCB Shipment and Average Price, 1999-2009
Global PCB Output Value, 1997-2011
Global PCB Downstream Application, 2000, 2009
Global PCB Product Structure, 2000, 2009
Geographic Distribution of Global PCB Output Value, 2006-2011
PCB Output Value of Taiwan, 2007-2012
Distribution of Taiwan’s PCB Output Value by Region, 2008-2010
Distribution of Taiwan’s PCB Output Value by Technology, 2009
PCB Market Scale in Mainland China, 2007-2012
Geographic Distribution of PCB Industry in Mainland China by Output Value, 2008-2010
PCB Market Segments in Mainland China, 2008-2010
PCB Downstream Applications in Mainland China, 2008-2010
FPC Market Scale, 2007-2013
Downstream Distribution of FPC Market, 2007-2013
FPC Industry Chain in Taiwan
Geographic Distribution of FPC Industry (by Location of Corporate Headquarters), 2009
Geographic Distribution of FPC Industry (by Place of Production), 2009
Ranking of FPC Manufacturers in Japan
Ranking of FPC Manufacturers in South Korea
Ranking of FPC Manufacturers in Taiwan
Ranking of FPC Manufacturers in Mainland China and Hong Kong
Top 20 PCB Manufacturers in the World by Income, 2004-2008
Ranking of Top 18 PCB Manufacturers in the World, 2009
Ranking of Top 20 PCB Manufacturers in Taiwan, 2009
Sales and Gross Profit of Samsung Electro-Mechanics, 2009-Q1 2010
Revenue Structure of Samsung Electro-Mechanics by Division, Q1 2010
Revenue Structure of ACI Division of Samsung Electro-Mechanics, Q1 2010
Revenue Structure of LCR Division of Samsung Electro-Mechanics, Q1 2010
Revenue Structure of OMS Division of Samsung Electro-Mechanics, Q1 2010
Revenue Structure of CDS Division of Samsung Electro-Mechanics, Q1 2010
Financial Data of AT&S, Q4 2009
Revenue of AT&S by Division, FY2006-FY2009
Revenue of AT&S by Region, FY2008-FY2009
Business Performance of AT&S in Austria, FY2008-FY2009
Business Performance of AT&S in Asia-Pacific, FY2008-FY2009
Operating Income of Goworld, 2007-2009
Quarterly Net Profit of Goworld, 2007-2009
Revenue of Goworld by Product and by Region, 2009
Operating Income and Gross Profit of Aspocomp, Q4 2008-Q4 2009
Organizational Structure of Founder’s PCB Industry
Founder’s PCB Industry Layout
Specifications of Founder’s PCB HDI
Specifications of Founder’s PCB Backplane & Line Card
Specifications of Founder’s PCB Backplane & Line Card
Specifications of Founder’s Gold Finger PCBs
Specifications of Founder’s PCB Substrate
Development of Meiko
Global Business Scope of Meiko Electronics
Revenue and Gross Profit of Meiko Electronics, Q4 2008- Q4 2009
Revenue of Meiko Electronics by Region, Q3 2009
Revenue of Meiko Electronics by Application, Q2-Q3 2009
PCB Revenue of Meiko Electronics by Layer Count, Q2-Q3 2009
Meadville Group Technology Roadmap for Conventional PCB
Meadville Group Technology Roadmap for HDI PCB
Meadville Group Technology Roadmap for IC Substrate
Financial Data of Meadville Group, H1 2009
Meadville Group Revenue by Layer Count, 2004-2008
Meadville Group Revenue by Application, 2004-2008
Unimicron’s Revenue, 1990-2009
Unimicron’s Profit Margin, 1995-Q1 2009
Unimicron’s Position in the World
Unimicron’s Organizational Structure 
Unimicron’s Technology Roadmap
Operating Income of Unimicron by Product, 2009
Unimicron’s Plants
Production Capacity of Unimicron by Product, 2006-end of 2009
Application of Unimicron’s Products, 2007-2009
COMPEQ General Capabilities Product Types
COMPEQ HDI Product Types
COMPEQ High Layer Count / Regular Product Types
COMPEQ Rigid-Flex Product Types
COMPEQ Flex Product Types
Revenue and Gross Profit of COMPEQ, 2004-2008
COMPEQ Branches Worldwide
Application of COMPEQ’s Products, 2004-2008
Output Value and Output of COMPEQ, 2007-2008
Sales Volume and Sales Revenue of COMPEQ, 2007-2008
R&D Investment of COMPEQ, 2004-Q1 2009
COMPEQ Employees in Taiwan
Roadmap for Unitech’s Mobile Phone Technology
Roadmap for Unitech’s Rigid-Flex Technology
Revenue and Net Profit of Unitech, 2007-2009
Monthly Operating Income of Unitech, 2008-2010
Operating Income of Unitech by Product (by Layer Count), 2008
Sales Revenue of Unitech by Region, 2006-2008
WUS Capabilities of HDI
WUS Capabilities of RF Module
WUS Capabilities of Multi-Layer
Revenue and Gross Profit Margin of WUS, 2004-2009
Income Statement of GCE, 2005-Q3 2009
Sales Revenue of GCE by Product, Q1 2009
Sales of GCE’s Products by Region
Equipment of GCE
Production Capacity of GCE
Monthly Revenue of Chin Poon, 2008-2010
Organizational Structure of Chin Poon
Revenue of Chin Poon by Region, 2006-2008
Production Capacity of Chin Poon by Plant (by Layer), 2009
PCB Output Value of Chin Poon by Application, 2007-2009
Sales Volume and Revenue of Main Products of Chin Poon, 2007-2008
Monthly Revenue of Tripod Technology, 2007-2009
Production Capacity Planning of Tripod Technology, 2009
Application of Products of Tripod Technology, 2009
Products of Tripod Technology by Layer Count, 2009
Revenue and Gross Profit of PLOTECH, 2004-2009
PLOTECH Production Capabilities
HDI Capability and Roadmap of HannStar Board
Multi-Layer Board Capability and Roadmap of HannStar Board
Application of Products of HannStar Board, Q1 2010
Revenue and Gross Profit of HannStar Board, 2005-2009
Monthly Net Operating Income of HannStar Board, 2009-2010
HannStar Board’s Total Capacity, 2006-2010
TPC’s Production Process and Standard Capability
Operating Income and Gross Profit of TPC, 2008-2010
Organizational Structure of TPC
Product Categories of TPC, 2006-H1 2009
Revenue and Gross Profit of Kingboard, 2006-2009
Profit Structure of Kingboard, 2009
PCB Revenue of Elec & Eltek by Region, 2008-2009
PCB Revenue of Elec & Eltek by Layer Count, 2008
PCB Revenue of Elec & Eltek by Layer Count, 2009 
Dynamic’s Organizational Structure
Dynamic’s Production Bases
Dynamic’s Revenue, 2001-2009
Production Capacity Expansion Plan of Dynamic, 2009-2012
Production Capacity Expansion Plan of Dynamic Taiwan, 2009-2012
Production Capacity Expansion Plan of Dynamic Kunshan, 2009-2012
Production Capacity Expansion Plan of Dynamic Xiamen, 2009-2012
Application of Dynamic’s Products, 2008-Q1 2009
R&D Roadmap of Dynamic
Roadmap for Production Capacity of Dynamic
Regional Distribution of TPT's Business Network
Major Clients of TPT
Monthly Operating Income and Growth Rate of TPT, 2007-2009 
Operating Income of TPT by Product
Application of TPT’s Products
Production Capacity Planning of TPT, 2007-2009
Capital Expenditure and Production Capacity of TPT, 2005-2009
Viasystems’PCB Technology Roadmap for Capabilities and Processes
Operating Income and Profit of Viasystems, 2005-2009
Revenue of Viasystems by Region, 2007-2009
Application of Products of Viasystems, 2007-2009
Revenue of Viasystems by Application, 2008-2009
Major Clients of Viasystems by Revenue, 2009
Operating Income of Daisho Microline, FY2007-FY2009
Operating Income of Daisho Microline by Region, 2008-Q2, Q3 2009
Revenue of IBIDEN, FY2005-FY2009
R&D Investment of IBIDEN, FY2006-FY2010
Revenue of IBIDEN by Region, FY2009
Sales of IBIDEN by Segment, FY2008
Operating Income of CMK, FY2007-FY2009
Revenue of CMK (by Product), 2008-2009
Revenue of CMK (by Region), 2008-2009
Revenue of CMK (by Application), 2008-2009
Bases of CMK in China
Sales Revenue of CMK (Wuxi), 2002-2008
Output of CMK (Wuxi), 2002-2008
Application of CMK (Wuxi)’s Products, 2008
Main Products of CMK (Wuxi) (by Layer)

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