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The mobile phone can be divided into four categories, low-end mobile phone, featured phone, smart phone and high-end mobile phone. The low-end mobile phone uses one two-chip MCP memory, which is generally 32 or 64 NOR, 16 or 8M RAM, but not NAND. Presently, featured phone has two kinds of memory configuration methods, one is a three-chip MCP memory, which is usually from Toshiba, 256M NOR, 128M RAM, 512 or 1204M NAND. It is a popular way for Chinese mobile phone manufacturers to adopt, as these manufacturers do not have their own design platforms. While, the leading manufacturers, such as Nokia, Motorola, have had rich experiences in platform design, and these platforms have not considered to correspond the three-chip MCP memory, (Toshiba started to popularize the earliest three-chip MCP memory in the industry at the beginning of 2005), therefore, the design should be separated. Generally, it has two pieces of memory, one is the common memory including NOR and RAM, and the other is the single NAND or NAND including RAM.
Growth Trend of Mobile Phone Memory Capacity
Smart phone has two kinds of memory configuration methods, one is DISK-ON-CHIP technology developed by M-SYSTEM and acquired by SANDISK, which can transfer some NAND to NOR, and Motorola is of such case. Usually, 1024 NAND can transfer to 256M NOR, as well as can save about 640M NAND. However, as far as the pace concerned, the manufacturers need to add one traditional two-chip MCP to correspond the fundamental frequency communication system, in addition, DISK-ON-CHIP is the XSCALE processor mainly for the smart phone. The price of NAND decreased a lot, while the gross profit of brand memory of SANDISK is a bit higher, but the gross profit of OEM NAND is too much low. The supply amount of DISK-ON-CHIP in the future will decrease, so it is definitely that the small-size manufacturers cannot obtain it. Generally, the manufacturers adopt one NAND and DDR SDRAM or Mobile RAM memory to boost up the calculation capability.
Generally, the high-end mobile phone has the powerful video function, especially the multi-media application or TV mobile phone. This kind of mobile phone not only requires application processor, but also MPEG-2 decode or 3D picture acceleration. Therefore, it usually has three pieces of memories. Such as N73, one Samsung two-chip memory K5G2829ATC-DF75 is responsible for fundamental frequency NOR and RAM requirement, meanwhile, NOR memory capacity is 128M, and RAM is 128M DDR SDRAM. In addition, one Samsung two-chip memory K5E1G12ACM-S075 meets the demand of application processor OMAP 2410, and the RAM memory capacity is 512M DDR SDRAM, NAND memory capacity is 1024M. Moreover, the STMicroelectronics MT48H4M16LFB3 that can match picture acceleration DM290 and, its capacity is 64M SDRAM.
Viewed from the future development trend, as the transfer of the featured phone design platform, one three-chip MCP memory will be the absolute mainstream. However, Samsung three-chip MCP memory and four-chip MCP memory generally supply Samsung itself, so Toshiba may obtain much market. The DISK-ON-CHIP amount used by smart phone drops, so the second configuration method is required to adopt, while it will not change in a short period. As the increasing maturation of the latest concentration and powerful multi-media function fundamental frequency development platform, the memory of high-end mobile phone will reduce to two chips, however, the capacity will not decrease, but much higher, especially RAM, 1024 RAM will appear.
The key suppliers in China mobile phone memory market are Spansion, Samsung and Toshiba. Spansion is the leading supplier, and nearly monopolizes the low-end mobile phone field. However, Samsung grew up in the second half of 2006, the serious lack of SPANSION 128+32 and 64+16/64+31NOR+SRAM MCP provided a favorable chance for Samsung, and then Samsung entered the mobile phone MCP field gradually in August, and the 128+32MCP chip it launched can replace SPANSION 129 series of products with pin to pin as long as the simple adjustment in the software, moreover, the price is USD 0.5 lower than the same product of SPANSION 128+32, so which made the B-class mobile phone manufacturing base design companies and manufacturers in mainland China came to Samsung MCP. In the beginning of 2007, Samsung launched its latest 128+32 products, K5L2931 and K5L2731, which attacked the large market shares of SPANSION. If SPANSION does not take corresponding measures, and its market shares will drop dramatically then.
Meanwhile, Toshiba monopolizes the three-chip MCP market in China. Due to the high price, the application scope of Toshiba is relatively small. However, Toshiba has many large clients, so the shipment is much higher. Samsung is weak even if it is taking the three-chip memory into account actively as well, as its popularization platform belongs to Spreadtrum, while the platform of Toshiba belongs to MTK, so its effect is much better.
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The mobile phone can be divided into four categories, low-end mobile phone, featured phone, smart phone and high-end mobile phone. The low-end mobile phone uses one two-chip MCP memory, which is generally 32 or 64 NOR, 16 or 8M RAM, but not NAND. Presently, featured phone has two kinds of memory configuration methods, one is a three-chip MCP memory, which is usually from Toshiba, 256M NOR, 128M RAM, 512 or 1204M NAND. It is a popular way for Chinese mobile phone manufacturers to adopt, as these manufacturers do not have their own design platforms. While, the leading manufacturers, such as Nokia, Motorola, have had rich experiences in platform design, and these platforms have not considered to correspond the three-chip MCP memory, (Toshiba started to popularize the earliest three-chip MCP memory in the industry at the beginning of 2005), therefore, the design should be separated. Generally, it has two pieces of memory, one is the common memory including NOR and RAM, and the other is the single NAND or NAND including RAM.
Growth Trend of Mobile Phone Memory Capacity
Smart phone has two kinds of memory configuration methods, one is DISK-ON-CHIP technology developed by M-SYSTEM and acquired by SANDISK, which can transfer some NAND to NOR, and Motorola is of such case. Usually, 1024 NAND can transfer to 256M NOR, as well as can save about 640M NAND. However, as far as the pace concerned, the manufacturers need to add one traditional two-chip MCP to correspond the fundamental frequency communication system, in addition, DISK-ON-CHIP is the XSCALE processor mainly for the smart phone. The price of NAND decreased a lot, while the gross profit of brand memory of SANDISK is a bit higher, but the gross profit of OEM NAND is too much low. The supply amount of DISK-ON-CHIP in the future will decrease, so it is definitely that the small-size manufacturers cannot obtain it. Generally, the manufacturers adopt one NAND and DDR SDRAM or Mobile RAM memory to boost up the calculation capability.
Generally, the high-end mobile phone has the powerful video function, especially the multi-media application or TV mobile phone. This kind of mobile phone not only requires application processor, but also MPEG-2 decode or 3D picture acceleration. Therefore, it usually has three pieces of memories. Such as N73, one Samsung two-chip memory K5G2829ATC-DF75 is responsible for fundamental frequency NOR and RAM requirement, meanwhile, NOR memory capacity is 128M, and RAM is 128M DDR SDRAM. In addition, one Samsung two-chip memory K5E1G12ACM-S075 meets the demand of application processor OMAP 2410, and the RAM memory capacity is 512M DDR SDRAM, NAND memory capacity is 1024M. Moreover, the STMicroelectronics MT48H4M16LFB3 that can match picture acceleration DM290 and, its capacity is 64M SDRAM.
Viewed from the future development trend, as the transfer of the featured phone design platform, one three-chip MCP memory will be the absolute mainstream. However, Samsung three-chip MCP memory and four-chip MCP memory generally supply Samsung itself, so Toshiba may obtain much market. The DISK-ON-CHIP amount used by smart phone drops, so the second configuration method is required to adopt, while it will not change in a short period. As the increasing maturation of the latest concentration and powerful multi-media function fundamental frequency development platform, the memory of high-end mobile phone will reduce to two chips, however, the capacity will not decrease, but much higher, especially RAM, 1024 RAM will appear.
The key suppliers in China mobile phone memory market are Spansion, Samsung and Toshiba. Spansion is the leading supplier, and nearly monopolizes the low-end mobile phone field. However, Samsung grew up in the second half of 2006, the serious lack of SPANSION 128+32 and 64+16/64+31NOR+SRAM MCP provided a favorable chance for Samsung, and then Samsung entered the mobile phone MCP field gradually in August, and the 128+32MCP chip it launched can replace SPANSION 129 series of products with pin to pin as long as the simple adjustment in the software, moreover, the price is USD 0.5 lower than the same product of SPANSION 128+32, so which made the B-class mobile phone manufacturing base design companies and manufacturers in mainland China came to Samsung MCP. In the beginning of 2007, Samsung launched its latest 128+32 products, K5L2931 and K5L2731, which attacked the large market shares of SPANSION. If SPANSION does not take corresponding measures, and its market shares will drop dramatically then.
Meanwhile, Toshiba monopolizes the three-chip MCP market in China. Due to the high price, the application scope of Toshiba is relatively small. However, Toshiba has many large clients, so the shipment is much higher. Samsung is weak even if it is taking the three-chip memory into account actively as well, as its popularization platform belongs to Spreadtrum, while the platform of Toshiba belongs to MTK, so its effect is much better.
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2005-2006 www.researchinchina.com All Rights Reserved |
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1 Mobile Phone Memory 1.1 Mobile Phone Embedded Memory 1.2 Three Classifications of PSRAM 1.3 Cellular RAM 1.4 COSMORAM 1.5 UtRAM 1.6 Mobile SDRAM 1.7 Competition between NOR and NAND 1.8 PRAM 1.9 MRAM2 Mobile Phone Memory Market and Industry Situation 2.1 Mobile Phone Memory Market 2.2 NOR Memory Market 2.3 NAND Market 2.4 Mobile DRAM 2.5 Mobile Phone Memory Industry 3 Memory Usage of Mobile Phone Manufacturers 3.1 Status Quo of Mobile Phone Memory Configuration and Future Development Trend 3.2 China Mobile Phone Memory Market Competition 3.3 China Mobile Phone Market 3.4 Nokia 3.5 Motorola 3.6 Samsung 3.7 LG 3.8 Sony Ericcson 3.9 Bird 3.10 Lenovo 3.11 Amoi 3.12 Memory Usage of Second-line Mobile Phone Manufacturers 3.12.1 Grey Market Mobile Phone 3.12.2 Second-line Mobile Phone 4 Mobile Phone Memory Manufacturers 4.1 Spansion 4.2 Samsung 4.3 Toshiba 4.4 STMicroelectronics Intel 4.5 Elpida 4.6 Windbond 4.7 Sharp 4.8 Etron 4.9 ESMT 4.10 Qimonda 4.11 MICRON 4.12 MXIC 4.13 SST
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2005-2006 www.researchinchina.com All Rights Reserved |
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Mobile Phone Embedded Memory Development Line PSRAM and SRAM Technology Comparison Comparison of Cellular RAM Mobile SDRAM and Common PSRAM Main Characteristics of Cellular RAM MRAM Structure MRAM Working Principle Mobile Phone Memory Shipment Statistics and Forecast by Type, 2005-2010 Mobile Phone Memory Market Scale by Type, 2005-2011 Mobile Phone Memory Frame Proportion by Type, 2006-2010 Mobile Phone Memory Shipment by Type, 2006-2010 Quarterly Global NOR NAND Shipment, 1998-2007Q1 Quarterly Global NOR NAND Revenue, 1994-2007Q1 Mobile DRAM Memory Shipment Statistics and Forecast, 2004-2008 Market Shares of Key Global Mobile Phone Memory Manufacturers, 2006 NOR NAND Market Shares of Key Manufacturers, 2005/2006/2007Q1 Mobile Phone MCP Product Line Market Share Forecast of Key China Memory Manufacturers, 2007 MirrorBit Memory Revenue of SPANSION, 2006Q3-2007Q1 SPANSION Mobile Phone Memory Production Technique Line Revenue Proportion Structure of Samsung by Division, 2006Q4-2007Q1 Profitability Structure of Samsung by Division, 2006 Samsung Memory Product Application Samsung OneNAND Structure Revenue Structure Proportion of Samsung Semiconductor, 2006 Revenue and Operation Profit of Toshiba Semiconductor, 2004-2006 Quarterly Operation Profit of Toshiba Semiconductor, 2004-2006 Characteristics of Intel NAND ELPIDA Capital Stock Structure ELPIDA Revenue and Operation Profit, 2003Q1-2006Q4 ELPIDA Product Application Proportion Structure, 2005Q4-2006Q4 Revenue and Gross Profit of Windbond, 2005Q2-2007Q1 Revenue and Gross Profit of Windbond Memory and Logic Division, 2005Q2-2007Q1 Product Revenue Structure of Windbond, 2006Q4-2007Q1 Windbond DRAM Product Combination Ratio, 2005Q3-2007Q2 Etron Revenue Statistics and Forecast, 1995-2007Q1 Etron Pre-tax Profit Statistics, 1998-2007Q1 Revenue and Operation Profit Rate of Etron, 2001-2006 Etron Structure ESMT Revenue and Gross Profit, 2000-2006 Qimonda Revenue and Gross Profit, 2006Q2-2007Q2 Qimonda Sales, 2003-2007Q1 Qimonda Gross Profit and Gross Profit Margin, 2003-2007Q1 Qimonda R&D Expenditure, 2003-2007Q1 Qimonda Output, 2003-2007Q1 Qimonda Revenue Structure by Region, 2006 MICRON Revenue and Gross Profit Margin, 2006Q2-2007Q2 MICRON Regional Revenue Structure Proportion, 2005-2006 MXIC Quarterly Revenue and Gross Profit Margin, 2002Q2-2006Q4 MXIC Quarterly Revenue and Operation Profit, 2002Q2-2006Q4 MXIC Product Revenue Structure Proportion, 2005Q4-2006Q4 MXIC Product Shipment Structure Proportion, 2005Q4-2006Q4 MXIC Regional Revenue Structure, 2005Q4-2006Q4 SST Product Shipment, 1995-2005 SST Authorized Product Shipment, 2000-2005 Key SST Wafer OEM Partners SST Back-end Packaging and Test Partners SST Product Application Proportion Structure, 2006Q1 SST Regional Revenue Structure, 2006Q1 SST Technology Line SST Regional Revenue Structure, 2005Q4/2006Q3/2006Q4 SST Product Application Proportion Structure, 2005Q4/2006Q3/2006Q4 SST Operation Cost Proportion, 2006Q3/2006Q4 Mobile Phone MCP Configuration by Level Common MCP Memory Capacity Configuration of Toshiba Sales Volume of Top 13 Manufacturers in China Memory Usage of 36 Mobile Phones of Nokia, 2006-2007 Memory Configuration of 19 Mobile Phones of Motorola, 2006-2007 Memory Configuration of 18 Mobile Phones of Samsung, 2006-2007 Memory Configuration of 12 Mobile Phones of LG, 2006-2007 Memory Configuration of 7 Mobile Phones of Sony Ericcson, 2006-2007 Memory Configuration of 26 Mobile Phones of Bird, 2006-2007 Memory Configuration of 18 Mobile Phones of Lenovo, 2006-2007 Memory Configuration of 13 Mobile Phones of Amoi, 2006-2007 Memory Configuration of 34 Second-line Mobile Phones, 2006-2007 Spansion Sales and Gross Profit Margin, 2004Q4-2006 Spansion Wafer Manufacturing Factories Spansion Packaging and Testing Factories MCP Products of Toshiba Mobile Phones ELPIDA Mobile DDR SDRAM Products Sharp NAND Products Etron Responsibilities by Division ESMT Mobile SDRAM Product Indices Qimonda Mobile RAM Products MICRON Mobile DDR SDRAM Products MICRON Mobile SDR SDRAM Products MICRON CELLUAR DRAM Products
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