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Revenue of World Top 14 Wafer Foundry Fabs, 2005
The wafer foundry industry can be divided into three camps. The first camp has a sole member of Taiwan Semiconductor Manufacturing Company Limited (TSMC), which has first class productivity and owns good quality fame worldwide. So it is always the first choice for many large IC design houses. Whenever the semiconductor industry suffers recession or declining market demand, large-sized IC design houses tend to order from TSMC. Therefore the more recessionary the semiconductor industry is, the more orders TSMC gets and accordingly the fewer other wafer foundry fab has.
The second camp includes United Microelectronics Company (UMC), Semiconductor Manufacturing International Corporation (SMIC), CHARTERED and IBM. The four wafer foundry fabs are usually the second choice or alternative for large IC design houses and the first choice for medium IC design houses. When recession falls in the semiconductor industry, these four companies are apt to be firstly impacted. To avoid such impact, they all have their own major clients with strong loyalty. The major clients of UMC are Media Tek and NOVATEK, both are included in the UMC camp. Media Tek is the worldwide largest DVD player IC manufacturer with a stable capacity of 50,000 --- 60,000 pieces per month. NOVATEK is the largest TFT-LCD driver IC manufacturer with a stable capacity of 30,000 pieces per month. While SMIC takes Infineon and ELPIDA as its major clients and maintains a relatively stable business relationship by offering memory foundry. CHARTERED, Infineon, Samsung and IBM have built a cross platform wafer foundry ally and the market demand is also growing steadily. IBM, however, provides CPU foundry services for game machine makers with super production capacity like Microsoft XBOX and Sony PS3.
Relying on the local industry chain, manufacturers in the third camp each have their own specialties and regional advantages. MAGNACHIP and VANGURD are both specialize in LCD driver IC foundry and meanwhile they cooperate with driver IC industry in South Korea and Taiwan. MAGNACHIP is also specialized in image sensor CMOS foundry like Dongbu Anam, which is also accomplished in automobile electronics. While HHNEC is strong in the Smart card domain,and JAZZ is sophisticated in RF IC foundry services. X-FAB is adept at mixed-signal and MEMS foundry. Episil is expert in power semiconductor components and Advanced Semiconductor Manufacturing Corporation Limited (ASMC) is skilled in analog IC foundry.
Source: ResearchinChina
The development of wafer foundry industry in China mainland is greatly hampered by IC design houses in China Mainland. Among those 500 IC design houses, only at most 50 are able to have mass productions. Over 90% of those companies are just conceptual ones relying on loans or external investments. Considering those 50 design houses are having mass productions, more than 90% of them are focus on logical IC rather than analog IC. For logical IC, wafer size and manufacturing techniques determine the production cost. 12-inch and 90nm or 65nm wafer is the lowest-cost solution for logical IC. In logical IC field, wafer foundry fabs in China mainland are all of weak competitiveness except SMIC. 45 out of 57 wafer fabs in China mainland are still manufacturing products over 0.5nm.
In China mainland, many blindly started wafer production lines focus on foundry services. As most of the investment is from loans, it is quite hard to bring any profits.
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Revenue of World Top 14 Wafer Foundry Fabs, 2005
The wafer foundry industry can be divided into three camps. The first camp has a sole member of Taiwan Semiconductor Manufacturing Company Limited (TSMC), which has first class productivity and owns good quality fame worldwide. So it is always the first choice for many large IC design houses. Whenever the semiconductor industry suffers recession or declining market demand, large-sized IC design houses tend to order from TSMC. Therefore the more recessionary the semiconductor industry is, the more orders TSMC gets and accordingly the fewer other wafer foundry fab has.
The second camp includes United Microelectronics Company (UMC), Semiconductor Manufacturing International Corporation (SMIC), CHARTERED and IBM. The four wafer foundry fabs are usually the second choice or alternative for large IC design houses and the first choice for medium IC design houses. When recession falls in the semiconductor industry, these four companies are apt to be firstly impacted. To avoid such impact, they all have their own major clients with strong loyalty. The major clients of UMC are Media Tek and NOVATEK, both are included in the UMC camp. Media Tek is the worldwide largest DVD player IC manufacturer with a stable capacity of 50,000 --- 60,000 pieces per month. NOVATEK is the largest TFT-LCD driver IC manufacturer with a stable capacity of 30,000 pieces per month. While SMIC takes Infineon and ELPIDA as its major clients and maintains a relatively stable business relationship by offering memory foundry. CHARTERED, Infineon, Samsung and IBM have built a cross platform wafer foundry ally and the market demand is also growing steadily. IBM, however, provides CPU foundry services for game machine makers with super production capacity like Microsoft XBOX and Sony PS3.
Relying on the local industry chain, manufacturers in the third camp each have their own specialties and regional advantages. MAGNACHIP and VANGURD are both specialize in LCD driver IC foundry and meanwhile they cooperate with driver IC industry in South Korea and Taiwan. MAGNACHIP is also specialized in image sensor CMOS foundry like Dongbu Anam, which is also accomplished in automobile electronics. While HHNEC is strong in the Smart card domain,and JAZZ is sophisticated in RF IC foundry services. X-FAB is adept at mixed-signal and MEMS foundry. Episil is expert in power semiconductor components and Advanced Semiconductor Manufacturing Corporation Limited (ASMC) is skilled in analog IC foundry.
Source: ResearchinChina
The development of wafer foundry industry in China mainland is greatly hampered by IC design houses in China Mainland. Among those 500 IC design houses, only at most 50 are able to have mass productions. Over 90% of those companies are just conceptual ones relying on loans or external investments. Considering those 50 design houses are having mass productions, more than 90% of them are focus on logical IC rather than analog IC. For logical IC, wafer size and manufacturing techniques determine the production cost. 12-inch and 90nm or 65nm wafer is the lowest-cost solution for logical IC. In logical IC field, wafer foundry fabs in China mainland are all of weak competitiveness except SMIC. 45 out of 57 wafer fabs in China mainland are still manufacturing products over 0.5nm.
In China mainland, many blindly started wafer production lines focus on foundry services. As most of the investment is from loans, it is quite hard to bring any profits. |
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2005-2006 www.researchinchina.com All Rights Reserved |
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1. The Semiconductor Market 1.1 Forecast of the Semiconductor Industry,2006-2010 1.2 Forecast of the Downstream Semiconductor Market,2006 1.3 Status Quo of Global Wafer Foundry Industry 1.4 Status Quo of Global Semiconductor Equipment Industry 1.5 China's Semiconductor Market2. Overview of the Wafer Foundry Industry 2.1 Wafer Manufacturing Techniques 2.2 Global Wafer Industry and Main Wafer Manufacturers 2.3 Policy Environment in China's Semiconductor Industry 2.4 Status Quo and Forecast of China's Wafer Manufacturing Industry 3. Wafer Fabs 3.1 Semiconductor Manufacturing International Corporation (SMIC) 3.2 Shanghai Hua Hong NEC Electronics Company. Limited (HHNEC) 3.3 Grace Semiconductor Manufacturing Corporation (GRACE) 3.4 China Resources Microelectronics (Holdings) Limited (CRM) 3.5 Shanghai Advanced Semiconductor Manufacturing Co.,Ltd (ASMC) 3.6 Hejian Technology (Suzhou) Co.,Ltd 3.7 BCD Semiconductor Manufacturing Limited (BCD Semi) 3.8 Founder Microelectronics Corporation Limited 3.9 Zhongning Microelectronics Company 3.10 Nantong Green Mountain Integrated Corp.,Ltd (GMIC) 3.11 Nanotech Corporation 3.12 Zhuhai Nanker Integrated Circuit Co.,Ltd 3.13 Comfort Superpower Semiconductor (Beijing) Co.,Ltd 3.14 Technology Semiconductor Limited in Shenyang (TSLS) 3.15 Optoelectronics (Dalian) Co.,Ltd 3.16 Xi'an Xiyue Electronics Technology Co.,Ltd 3.17 Jilin Sino Microelectronics Co.,Ltd 3.18 Dandong Anshun Microelectronics Co.,Ltd 3.19 Lite-On Semiconductor Corp. 3.20 Fujian Fushun Microelectronics Co.,Ltd 3.21 Hangzhou Lion Microelectronics Co.,Ltd 3.22 Hangzhou Silan Integrated Circuit Co.,Ltd 3.23 Hynix-ST Semiconductor Co.,Ltd 3.24 Taiwan Semiconductor Manufacturing Company Limited (TSMC) 3.25 United Microelectronics Company (UMC) 3.26 Chartered Semiconductor Manufacturing Ltd (Chartered) 3.27 DongbuAnam Semiconductor Co.,Ltd (DongbuAnam) 3.28 Advanced Semiconductor Manufacturing Corporation Limited (ASMC) 3.29 Jazz Semiconductor 3.30 MagnaChip 3.31 Silterra 3.32 X-Fab 3.33 1st silicon (Malaysia) 3.34 Tower Semiconductor 3.35 Episil Technologies 3.36 IBM |
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2005-2008 www.researchinchina.com All Rights Reserved |
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Cycle Period of the Semiconductor Industry, 1960-2005 Nine Research Institutes' Growth Forecast of the Semiconductor Industry, 2006 Market Share Forecast of Globally Various Semiconductor Components, 2006 Growth Forecast of Globally Various Semiconductor Components, 2006 Investment Cycle Prosperity of Global Semiconductor, Q1, 2003-Q2, 2006 Statistics & Forecast of Semiconductor Annual Market Growth, 1990-2010 Market Share Forecast of Global Semiconductor Components, 2010 Shipment Growth of Major Terminal Electronic Products, 2006 Market Share Forecast of Semiconductor Downstream Applying, 2010 Market Share Forecast of Semiconductor by Regions, 2010 Diameter Proportion of Global Wafer Productivity, Q1, 2000 -Q4, 2005 Newly Put-into-production Wafer Manufacturers, 2006 Income of Global Top Five Semiconductor Packaging and Testing Manufacturers, 2000 Q1-2005 Q4 Regional Distribution of Semiconductor Equipment Market, 2004 & 2005 Regional Distribution of Wafer Equipment Market, 2004 & 2005 Regional Distribution of Testing Equipment Market, 2004 & 2005 Regional Distribution of Packaging Equipment Market, 2004 & 2005 Market Share Trend of Global Wafer, Packaging, Testing and Other Semiconductor Equipments, 2004-2008 Promising Semiconductor Manufacturers of China, 2005 Flow Chart of Processing Original Wafer Flow Chart of Planting Wafer into the Circuit Demand & Supply Forecast of China's IC Market, 2005-2010 Income Statistics and Forecast of China's IC Design Companies, 2000-2009 Wafer Size Distribution of China's 57 Wafer Manufacturers Technological Capability Distribution of China's 57 Wafer Manufacturers Technical Route of China's Wafer Manufacturers Income and Profit Statistics of SMIC, 2000-2005 Organization of SMIC Rapid Mature Course of SMIC Productivity Analysis of SMIC, 2004-2005 Quality Standards Achieved by SMIC Downstream Applying Structure of SMIC Products, Q1, 2005-Q1, 2006 SMIC International Product Structure, Q1, 2005 - Q1, 2006 SMIC Client Type Structure, Q1, 2005 -Q1, 2006 SMIC Income Regional Structure, Q1, 2005 - Q1, 2006 SMIC Wafer Delivery and Productivity Utilizing Rate, Q1, 2005- Q1, 2006 SMIC Product Technique Distribution, Q1, 2005 - Q1, 2006 SMIC Logical Product Technique Distribution, Q1, 2005 -Q1, 2006 Technical Status of SMIC Figure: Technical Route of Shanghai Huahong NEC Electronic Co, Ltd. MLM Technology Logical Techniques Development Scheme of Grace Semiconductor Manufacturing Corporation Figure: Flash Memory Techniques Development Scheme of Grace Shareholding Structure of ASMC Pre-listed Shareholding Structure of ASMC Post-listed History of ASMC BCD Product Classification BCD Product Classification I BCD Product Classification II BCD Product Classification III Sales Rate and Net Profit of Optoelectronic 1998-2002 Operation Income and Gross Profit of Sino Microelectronics, Ltd Operation Income of Sino Microelectronics, Ltd, by Region Company Organization of Lion Microelectronics, Co, Ltd Income & Profit Statistics of TSMC TSMC Structure of Product Technology, Q1, 2005-Q1, 2006 TSMC Product Applying Structure, Q1, 2005 -Q1, 2006 TSMC Income Regional Structure, Q1, 2005 -Q1, 2006 TSMC Client Structure, Q1, 2005 -Q1, 2006 TSMC Product Technology Route Map TSMC Service Route Map TSMC Staff Educational Background Income and Gross Profit of UMC 2000-2005 Productivity Change of UMC 2000-2005 Educational Background of UMC Personnel 2004-2005 Regional Income Structure of UMC Q1, 2006 Client Structure of UMC Q1, 2006 Product Structure of UMC Q1, 2006 Technical Structure of UMC Q1, 2006 Technical Route of UMC Income and Net Profit of Chartered Semiconductor Manufacturing1998-2005 Events of Cooperation between CSM and IBM Q 1, 2004- Q1, 2006 Partners in Various Fields of CSM Landscape of Five Wafer Fabs of CSM Special Technical Route of CSM Productivity of CSM 2003-2006 Statistics of CSM 0.13-micron Technical Productivity Statistics of CSM Profit & Cash Flow Q2, 2005-Q2, 2006 Statistics of CSM Income Q2, 2006-Q2, 2006 Technical Route of DongbuAnam Semiconductor Income, Gross Profit and Productivity Utility of VIS Q1, 2005-Q1, 2006 Product Technical Structure of VIS Q1, 2005-Q1, 2006 Downstream Applying Structure of VIS Q1, 2005-Q1, 2006 Specific Applying Structure of VIS Q1, 2005-Q1, 2006 Quarterly Income Statistics of VIS Q2, 2003-Q1, 2006 Technical Route of VIS OTP and Flash Memory Technical Route of VIS High Voltage Technical Route of VIS Logical High-precision Analog, Mixed Signal and RFCMOS Technical Route of VIS JAZZ Semiconductor MEMS Technical Route of VIS JAZZ High Voltage and Analog Technical Route of VIS JAZZ BCD MagnaChip Business Performance, 2003-Q1, 2006 MagnaChip R&D Input Changes, 2003-Q1, 2006 Principal Product Ratio of MagnaChip Revenue Fiscal Year 2003-2005 Regional Distribution of MagnaChip Revenue Fiscal Year 2003-2005 Technical Route of Silterra Logical and Mixed Signal Technical Route of Silterra High Voltage Skill X-FAB Technical Route X-FAB MEMS Technical Route 1stSilicon Logical and Mixed Technical Route 1stSilicon Special Tech Route Tower Semiconductor Technical Route Tower Semiconductor Micro Flash Tech Route IBM Wafer Foundry Technical Route Global Top 20 Semiconductor Manufacturers, 2005 Output Value Distribution of China's Semiconductor Industry, 2005 Sales Income and Growth of China's IC Industry, 2001-2010 Top 20 Semiconductor Suppliers of China mainland, 2004 & 2005 China's Top Ten Semiconductor Manufacturers in 2005 Quantitative Ranking of Global 300mm Wafer Manufacturers, 2005 Mainstream R&D Technology and Client Distribution of Principal Global Wafer Foundry Fabs, 2005 Global Top 15 Wafer Foundry Fabs, 2005 China's Main 6-inch, 8-inch and 12-inch Wafer Manufacturers in Operation China's 6-inch, 8-inch and 12-inch Wafer Manufacturers under Construction China's 4-inch, 5-inch and 6-inch Wafer Manufacturers Main Wafer Foundry Fabs of Grace Features of Grace 0.25 Micron Techniques Parameters of Grace 0.25 Micron Units Parameters of Grace 0.15 Micron Units Parameters of 0.15 Micron Units (EDR) Product Types of China's Resources Semiconductor BCD Productivity Overview Electronic Product Specifications of Lion Wafer Fabs of TSMC Personnel Organization of TSMC Technical Features of TSMC 90 nm Technical Features of TSMC Mixed Signal Technical Features of TSMC Mems Technical Features of TSMC BiCMOS Technical Features of TSMC High Voltage Skill Wafer Fabs of UMC UMC Major Investors and Cash Flow UMS Staff Structure 2004-2006 Technical Features of UMS Mixed Signal/RFCMOS Technical Features of UMS CMOS Image Sensor Features of UMS High Voltage Skill Features of Dongbu-Anam High Voltage Skill Features of VIS Logical Circuit Design Features of VIS Mixed Circuit Design Features of VIS High Voltage Circuit Design Technical Features of JAZZ Semiconductor BiCMOS and SiGe Foundry Technical Features of JAZZ Semiconductor RFCMOS and Fixed Signal Foundry Technical Features of JAZZ Semiconductor Digital CMOS Foundry Technical Features of 1stSilicon Episil Profit and Lose Q2, 2004-Q1, 2006 IBM Income from Wafer Foundry 2001-2005 Design Service Suppliers of IBM Wafer Foundry Brief Introduction of IBM130 Nanometer Platform Technical Features of IBM130 Nanometer Platform Logic IC Technical Features of IBM130 Nanometer Skill Double Pole IC Design Tools in IBM130 Nanometer Skill Platform Property Overview of IBM130 Nanometer CMOS Image Sensor
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