Mobile handset RF is composed of front-end model (FEM), transceiver and power amplifier. The core of FEM is aerial switch with low technology content, so this report mainly focused on the transceiver and power amplifier.

Transceiver is a key component of mobile handset. It is also a relatively independent component, so non-handset manufacturers can also find a place of their own in this field.

Global Market Share Distribution of Mobile Handset transceiver Manufacturers

QUALCOMM lists at No. 1 by the strength of its monopoly power in CDMA domain. In 2005, its shipment reached 182 million flakes and its CDMA transceiver shared over 80% of the market. In addition to CDMA mobile handset, QUALCOMM also produces transceivers aiming at CDMA/GSM. ST ranks at No. 2 by custom transceivers for Nokia, followed by Infineon who has Nokia, Panasonic, Siemens and BenQ as its clients. SILICON LAB is supported by Samsung and LG rely on its CNOS technologies. Except QUALCOMM, the platform-relying handset baseband manufacturers such as TI and Philips were not able to gain a good market share. Independent transceiver suppliers nevertheless shared 50% in the market.

SILICON LAB and Infineon are the earliest two transceiver manufacturers adopting CMOS techniques. Although the specifications of handset-purposed RF IC are extremely strict, however, the technical obstacles have been addressed.. After purchasing Berkana, QUALCOMM also adopts CMOS techniques in an extensive and intensive way. Some newly-founded RF manufacturers, without exception, all adopt RF CMOS techniques, even more advanced 65¦Ìm RF CMOS techniques. Old brands such as Philips, FREESCALE, ST and RENESAS maintained traditional technologies, which is mainly SiGe BiCMOS techniques. Nokia still massively draws upon ST RF transceivers. This suggests that some large handset manufacturers are still hold tentative attitude towards RF CMOS whereas Chinese manufacturers, Samsung and LG are more willing to accept new things.

In the infancy of 3G, multi-mode handsets are in great popularity. Lowly-integrated transceivers usually need four or five pieces of IC, which have negative influence on design sophistication, adjusting, size and power consumption. Therefore, RF CMOS has a good prospect. Yet it still needs observing. Nokia's mass application of RF CMOS transceivers can be the signal to judge RF CMOS maturity.

Power amplifier needs special techniques. GaAs semiconductor still keeps absolutely mainstream position in the field of handset-purposed power amplifiers. Power amplifiers influence handsets'  signal, voice quality and power consumption to a great extent. Handset manufacturers are very careful in choosing power amplifiers. They will not adopt other techniques without 4-5 years' trial. SiGe develops smoothly in the domain of Bluetooth, WLAN and GPS but will have no further development in the handset field.

The power amplifier industry is even more particular, with all the manufacturers being independent and seldom exploiting products relevant to mobile handsets. The reason is that GaAs is too special for silicon wafer manufacturers to acquaint in a short term.

Global Market Share Distribution of Handset-purposed Power Amplifiers in 2005

RFMD ranks at the first globally. It has the six largest handset manufacturers worldwide as its clients and supplies power amplifiers to over 80% of Nokia's mobile handsets. SKYWORKS lists at No.2 globally with LG, Lenovo and Samsung as its key clients. Amoi and Siemens are key clients of Renesas and it is also the supplier of Nokia's partial low-price handsets. PHILIPS has Samsung and Bird as its main clients and FREESCALE has MOTO and Bird.

For customer who purchased this report can have a free list of Semiconductor component configuration of 100 mobile handset models launched in Chinese market, 90% of the models been selected were launched in 2005, some of them are still waiting to be launched.

2. Overview of Global Handset RF Semiconductor Market

3. Global Handset RF Semiconductor Manufacturers
3.1 SKYWORKS
3.2 ST
3.3 INFINEON
3.4 Silicon Lab
3.5 RFMD
3.6 TI
3.7 PHILIPS
3.8 FREESCALE
3.9 AVAGO
3.10 QUALCOMM
3.11 ANADIGICS
3.12 TRIQUINT
3.13 MAXIM
3.14 Sirific Wireless
3.15 Sequoia Communications
3.16 Tropian
3.17 RENESAS
3.18 SiGe Semiconductor
3.19 WIN Semiconductor
3.20 Advanced Wireless Semiconductor Company (AWSC)
3.21 MC Devices (Shenzhen)
3.22 Airoha Technology Corp.
3.23 Beijing LHWT Microelectronics Inc.
3.24 Epic Communications, Inc. (Epicom)
3.25 Yuantonix, Inc.
3.26 Comlent Technology, Inc. (Comlent)
3.27 Rising Micro-Electronics Co., Ltd. (RME)
3.28 RDA Microelectronics
3.29 Hangzhou Sicom RF Technology, Inc.
3.30 Shanghai Tsinghuachip