• Semiconductor Materials

Grinm Semiconductor (600206.SH) announced the non-public offering plan on August 14., according to which,it will issue 61 million shares with RMB9.73/share in no-public manners to raise RMB587 million for 8 inches monocystal silicon polishing wafer project.

According to the announcement, the company’s operating and profitability are constrained by the insufficient capacity of 8 inches monocystal silicon polishing wafer. Now, the company has one 6 inches monocystal silicon polishing wafer processing line and one 8 inches mono-silicon polishing wafer processing line.