Taiwan-based wireless SiP (system in package) solution provider AcSiP Technology, viewing that fast increasing shipments of entry- to mid-level smartphones in China will bring about fast growing demand for built-in WLAN SiP modules, has set a challenging goal of shipping 40 million such modules in 2012, according to industry sources in Taiwan.

AcSiP shipped about one million WLAN SiP modules mostly used in feature phones a month in the first half of 2011, the sources noted. In the second half, AcSiP cooperated with a design house which won orders for a large number of four-in-one wireless chips from smartphone vendors and therefore saw increasing shipments of WLAN SiP modules, the sources indicated. AcSiP shipped two million WLAN SiP modules in November and three million units in December 2011, with 70-80% of those modules for use in smartphones, the sources pointed out.

AcSiP expects to ship 8.0 million WLAN SiP modules in the first quarter of 2012, the sources indicated. Along with partners' offering new handset chips, AcSiP expects its quarterly shipments of WLAN SiP modules to be increasing from the second quarter of 2012, the sources pointed out.

In addition to use in handsets, AcSiP has been developing WLAN SiP modules for use in other types of consumer electronics including digital cameras and e-book readers, the sources noted. In addition, AcSiP has cooperated with NXP Semiconductors to integrate NFC (near field communication) technology with WLAN SiP modules to broaden scope of application of such modules, the sources indicated.

Source:digitimes