Phison to mass ship 55nm-made chips in 2Q12

   Date:2012/01/13

NAND flash device controller supplier Phison Electronics is set to begin mass shipments of its 55nm-made products in the second quarter of 2012, according to company chairman Khein Seng Pua. Migrating to the newer node will allow the firm to implement an effective pricing strategy, said Pua.

Phison is gearing up for market share gains in 2012, Pua reiterated.

Pua remarked previously that Phison had preserved enough cash, and would shift its focus to revenue and market share growth in 2012. Pua identified USB 3.0, SSD and eMMC devices as the main applications driving company growth.

Pua has reaffirmed that in 2012, Phison will be dedicated to developing products for USB 3.0-enabled devices, SSD and embedded storage applications. Taking embedded SSDs as an example, demand is expected to boost in 2012 thanks to the growing market for ultrabooks, Pua said.

Pua revealed that starting the first quarter, system vendors have been rebuilding their chip inventory in preparation for their new ultrabook roll-outs. The new category of notebook computers is expected to further spur demand for NAND flash in 2012, Pua said.

Phison is actively developing its manufacturing process to improve its cost structure, Pua noted. To make its SSD controllers more competitive than others', the company will continue to invest in advance process development in 2012, Pua said.

Migrating to a newer 55nm process will also help Phison better survive in the USB 3.0 flash drive controller IC segment, where price competition is likely to heat up in 2012, according to industry observers. 

Source:digitimes

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