Tianshui Huatian Technology Co., Ltd. is a China-based company primarily engaged in packaging and testing of integrated circuit (IC) products. The Company's IC packaging products include dual in-line package (DIP), small out-line package (SOP), shrink small out-line package (SSOP), quad flat package (QFP) and small out-line transistor (SOT) series products, among others. The Company distributes its products in domestic and overseas markets. As of December 31, 2010, the Company had three major subsidiaries, which involved in design, manufacture and sale of semiconductor components.

Tianshui Huatian Technology Co., Ltd. is a China-based company primarily engaged in packaging and testing of integrated circuit (IC) products. The Company's IC packaging products include dual in-line package (DIP), small out-line package (SOP), shrink small out-line package (SSOP), quad flat package (QFP) and small out-line transistor (SOT) series products, among others. The Company distributes its products in domestic and overseas markets. As of December 31, 2010, the Company had three major subsidiaries, which involved in design, manufacture and sale of semiconductor components.

 

TIAN SHUI HUA TIAN TECHNOLOGY CO.,LTD.(HTTC) was established on 25th December 2003, mainly initiated by Tianshui Huatian Microelectronics Co., Ltd., incorporating with eight shareholders which are separately Gansu Electric Power Investment & Development Company, Yingfu Taike Pioneering and Investing Co.,Ltd., Hangzhou Silan Microelectronics Co.,Ltd., Hangzhou Youwang Microelectronics Co.,Ltd. ,Shanghai Belling Microelectronics Co.,Ltd. and Wuxi Silicon Power Co.,Ltd. The registered capital is 110 million yuan. It is specialized in IC testing and packaging for the semiconductor ICs, devices and components.

 

The quality and varieties for IC plastic packaging production line has been constantly enlarged and improved year by year with technical innovation and renovation. Furthermore, the products are divided into many series and 66 varieties, such as PDIP、SDIP、HDIP、SIP、ZIP、SKY、HSIP、SOP、SSOP、HSOP、PQFP、LQFP、TSOP、TO、SOT、RPM600CBR-S(20B-21.8) and eSOP. The output has reached 3 billion pcs per year and the yield is stably over 99.7 percent.

 

The IC Packaging Production Line was set up in 1989 and obtained the Quality Management System Certificates ISO 9002:1994 in 1996、ISO9001:2000 in 2003 and ISO14001:2004 in October 2005. TheOHSAS18000 and ISO/TS 16969 Systems are in implementation.