Global and China Memory Industry Report, 2011
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In 2011, the standard DRAM saw the slowdown in growth. But the mushroom of tablet PC and smart phone enables the CAGR of the Mobile DRAM shipment to soar to 175%. In Q1 2011, the Mobile DRAM accounted for 15.6% of the total output of global DRAM.

The CAGR of mobile flash exceeds 70%, and the embedded Flash market will enjoy a share of 40% in 2010 to over 60% in the Flash market. eMMC has a good prospect in mobile devices.

According to the ranking concerning revenue from memory products of DRAM vendors in H1 2011, South Korea-based Samsung and Hynix ranked the top two.

Samsung will transform its process technology of DRAM from 3x nm to 2x nm, and that of NAND Flash from 27 nm to 21 nm. In Q1 2011, the proceeds from DRAM, NAND Flash and MCP accounted for 54.4%, 42.3% and 3.3% of Samsung's memory revenue respectively. Benefiting from the substantial growth in the output of 35 nm products, Samsung’s memory occupied 40% market shares in Q2. As for Mobile DRAM, Samsung has mass-produced low-power LPDDR2 with 30 nm process.

Hynix will convert DRAM process from 44 nm to 38 nm, and NAND Flash process from 26 nm to 20 nm. In Q1 2011, the sales of DRAM, NAND Flash and MCP made up 71.2%, 19.7% and 9.1% of Hynix’s total revenue from memory products separately. Hynix presently employs the 50nm process to produce Mobile DRAM. Since Q2 2011, Hynix will add monthly capacity of 30,000 pcs and plans to raise the proportion of non-PC DRAM to 60%.

The NAND wafer fab, co-invested by Japanese vendors Toshiba and Sandisk, applies the 19-nm process technology. In 2011, Elpida realized the mass-production of 30-nm process DRAM. Elpida has transferred to focus on Mobile DRAM instead of standard DRAM and introduced 30-nm process for the fabrication of the former. The earnings from Mobile DRAM accounted for more than 50% of Elpida’s revenue.

The current process technology of Micron Technology is 42 nm process and 37-nm process is still in the testing phase. In Q1 2011, the sales of DRAM, NAND Flash and NOR shared 47%, 31% and 19% of Micron’s total revenue respectively. After its reorganization in 2010, Spansion is devoted to embedded memory and agrees to cross license their patented products with Samsung.

Taiwan-based vendor Macronix is the world's largest vendor of Mask ROM and the fourth largest NOR Flash vendor. In Q1 2011, ROM products of Macronix mainly adopted 65-nm process technology, and 45-nm process sample will be introduced in Q2. 110-nm process dominates the production of NOR Flash, and 75-nm process products will be mass-produced in Q2. The revenue of ROM, NOR Flash and Foundry Business Group made up 41%, 51% and 8% of Macronix’s total revenue separately in 1Q 2011.

In 2011, Nanya Technology expanded its output of memory to 60,000 pieces, 30,000 pcs of which are 50/42nm standard memory, and the rest 30,000 ones are special memories like Mobile DRAM.

Inotera provides DRAM wafer foundry services and its customers are Nanya Corporation and Micron Technology. The company reached full capacity of 50-nm process products in 2010 and introduced 42-nm process DRAM products in 2011.

The growth of Winbond is mainly motivated by Nor Flash, of which Serial Nor Flash made up around 90% of Flash shipment. In Q1 2011, the sales of Nor Flash, Specialty DRAM and Mobile DRAM accounted for 31%, 36% and 28% of Winbond’s total revenue respectively. The main customers of Mobile DRAM include Micron and Spansion.
1 Global and China Mobile Phone Market
1.1 Global Mobile Phone Market Size 
1.2 Market Share of Mobile Phone Manufacturers
1.3 Smart Phone Market and Industry
1.4 Mobile Phone Industry in China

2 Global and China Tablet PC Market and Industry
2.1 Global Tablet PC Market Size
2.2 Chinese Tablet PC Market
2.2.1 Price Distribution
2.2.2 Operating System and Hardware
2.3 Assembly and ODM

3 Memory Industry and Market
3.1 Industry Overview
3.1.1 Product and Technology
3.1.2 Market Size
3.1.3 DRAM Packaging and Testing
3.1.4 Flash Packaging and Testing
3.1.5 eMMC
3.2 DRAM Market
3.2.1 DRAM Supply Market
3.2.2 DRAM Demand Market
3.2.3 Competition
3.3 Flash Market 

4 Memory Used in Mobile Devices
4.1 Mobile DRAM Product and Application
4.2 Mobile DRAM Market
4.2.1 Mobile DRAM Market Size
4.2.2 Mobile DRAM Application Market
4.2.3 Production of Mobile DRAM Manufacturers
4.3 Flash Used in Mobile Devices

5 Memory Vendors
5.1 Samsung
5.2 Hynix
5.3 Toshiba
5.4 Elpida
5.5 Micron
5.6 Spansion
5.7 Macronix
5.8 Inotera
5.9 Winbond
5.10 Powerchip
5.11 Promos
5.12 Nanya
Shipment of Mobile Phone Worldwide, 2007-2014
Quaterly Global Mobile Phone Shipment and Annual Growth Rate, Q1 2008-Q1 2011
Quaterly Shipment of CDMA and WCDMA Mobile Phone, 2007-2011
Global Mobile Phone Shipment by Brand, Q1 2010-Q1 2011
Market Shares of Major Mobile Phone Brands by Revenue, Q1 2009-Q3 2010
Shipment of Mobile Phone Worldwide by Brand, 2009-2010
Operating Margin of Global Top5 Mobile Phone Manufacturers, Q1 2009-Q4 2010
Shipment of Smart Phone Operating System Worldwide, Q3 2010
Market Share of Global Smart Phone Manufatcturers, Q1 2011
Market Share of Smart Phone Operating System, 2009-2012
Smart Phone Shipment of Global Mobile Phone Manufacturers, 2010-2011
Chinese Mobile Phone Export Volume and Growth Rate, 2000-2010
Chinese Mobile Phone Export Value and Growth Rate, 2002-2010
Chinese Mobile Phone Export Volume and ASP, 2002-2010
Chinese Mobile Phone Output by Region, 2010
Shipment of NETBOOK,iPad and Tablet PC, 2008-2012
Shipment of Global Major Tablet PC Brands, 2011-2012
DRAM and NAND Technology Development of Major Memory Vendors
Evolution of DRAM Products, 2003-2010
Memory Market Size and Growth Rate, 2005-2015
Memory Market Size, 2005-2015
Comparison between eMMC and Common NAND Chip
DRAM Industry Capital Investment, 2002-2011
Global DRAM Wafer Investment, 2011
DRAM Wafer Fab Quantity, 2007-2012
DRAM Wafer Fab Construction and Closed Numbers, 2000-2011
Quarterly Operating Margin of Main DRAM Vendors
DRAM Shipment Growth Rate, 2000-2012
DRAM Fab Model 
Quaterly DRAM Bit Shipment of Major DRAM Vendors
DRAM Revenue Model 
DRAM Consumption by Application
PC Shipment by Product, 2005-2015F
DRAM Quoted Price,Supply and Demand, 2010
DRAM Contract Price, June, 2011
DDR3 2Gb Spot Price,June 2010-June 2011
Average Carrying Capacity of Standard Memory and the Growth Rate, 2006-2012
DRAM Market Size and Growth Rate, 2005-2012
DRAM Market Size by Application, 2005-2015
Operating Revenue and Market Share of DRAM Vendors, Q3 2010-Q2 2011
NOR Market Size and Growth Rate, 2005-2012
Market Share of NOR Flash Manufacturers Worldwide
NAND Flash Quoted Price, Q1 2011-Q2 2011
NAND Market Size and Growth Rate , 2005-2012
NAND Shipment by Application, 2008-2015
NAND Average Carring Capacity by Application 
NAND Market Demand by Application, 2008-2015 
NAND Demand Market by Application,2008-2012
Investment Expenditure of NAND Flash , 2004-2015
NAND Fab Construction and Closed Numbers, 2000-2011
NAND Fab Model 
NAND Bit Shipment Model 
NAND Application Market Demand
NAND ASP Model 
NAND Business Revenue of Major Memory Manufacturers
Market Share of Global Flash Memory Manufacturers, 2008-2011F
NAND Controll IC Manufacturers
Comparison Between Standard DRAM and Mobile DRAM
Comparison among DDR, DDR2 and DDR3
Proportion of Mobile DRAM in the DRAM Market by Revenue
Specifications of High-end Smart Phone, 2010
Average Carring Capacity and Growth Rate of Memory in Smart Phone
Average Carring Capacity and Growth Rate of Memory in Tablet PC
Mobile DRAM Products of Major DRAM Manufacturers
Specifications of Major Mobile DRAM Products
Market Share of Mobile DRAM Manufacturers
Global Flash Supply and Demand Market, Q1 2009-Q4 2011
Proportion of Embedded Flash Shippment, 2005-2012F
Shippment of Flash Used in Mobile Phone
eMMC Share of Total Flash Market 
eMMC Density Trend
Mobile Handset Booting Architecture
eMMC Brands of Major NAND Manufacturers
SAMSUNG Sales and Profits,2008-2010
SAMSUNG Sales by Division, 2008-2010
SAMSUNG Operating Profit by Division, 2008-2010
SAMSUNG Memory Segment Sales by product, Q1 2010-Q4 2011
SAMSUNG DRAM Shipment and ASP, Q1 2010-Q4 2011
SAMSUNG NAND Shipment and ASP, Q1 2010-Q4 2011
DRAM and NAND Revenue Contribution of Apple to SAMSUNG Electronics, 2011
Technology Roadmap of SAMSUNG MCP 
SAMSUNG Mobile DRAM and MCP Product
SAMSUNG eMMC Product
Operating Revenue and Gross Margin of Hynix, 2007-2011
HYNIX Memory Segment Sales by Product, Q1 2010-Q4 2011
HYNIX DRAM Shipment and ASP, Q1 2010-Q4 2011
HYNIX NAND Shipment and ASP, Q1 2010-Q4 2011
Hynix Sales by Application, Q1 2010-Q1 2011
HYNIX DRAM Sales by Node, Q1 2010-Q4 2011 
HYNIX NAND Sales by Node, Q1 2010-Q4 2011
Model Decoding of HYNIX MCP Memory for Mobile Phone
Sales and Net Income of Toshiba,FY2004-FY2010
Investment and R&D Expenditure of Toshiba, FY2010-FY2011
Memory Product Sales of Toshiba,FY2007-FY2010
NAND Flash Memory Product
Toshiba eMMC Product
Operating Revenue and Gross Margin of Elpida, FY2006-FY2010
Operating Revenue of DRAM Product in Elpida, FY2004-FY2010
Capital Expenditure of Elpida, FY2011
Operating Revenue and Net Income of Elpida, FY2003-FY2010
Operating Revenue of Elpida by Region, 2009-2010
Business Structure of Elpida
Mobile DDR/DDR2 DRAM Product of Elpida
MICRON Sale and Gross Margin, FY2004-FY2011
Revenue Structure of Micron by Product, FY2006-FY2010
Revenue Structure of Micron by Application, FY2006-FY2010
Business of Structure of Micron
Operating Revenue of Micron by Business, FY2011Q1-Q3
MICRON R&D and SG&A Expenses, Q3 FY2009-Q3 FY2011
MICRON  Cash Flow From Operations, Q1 FY2010-Q3 FY2011
Operating Revenue and Gross Margin of Spansion, 2004-2010
Quarterly Revenue and Gross Margin of Spansion, Q2 2009-Q1 2011
Revenue of Spansion by Application, Q2 2010-Q1 2011
Revenue of Spansion by Region, Q2 2010-Q1 2011
Macronix Sales and Gross Margin, 2003-2011
Macronix Sales Per Month, June 2009-June 2011
Macronix Gross Margin, Q1 2009-Q1 2011
Macronix Quarterly Sales Breakdown by Products, Q1 2010, Q4 2010, Q1 2010
Macronix Quarterly Quantity Breakdown by Products, Q1 2010, Q4 2010, Q1 2010
Macronix Quarterly Sales Breakdown by Technology, Q1 2010, Q4 2010, Q1 2010
Macronix 8” Equivalent Wafer Out & Utilization Rate, Q1 2006-Q1 2011
Macronix ROM Quantity Index, Q1 2006-Q1 2011
Macronix ROM Shipments by Technology, Q1 2009-Q1 2011
Macronix NOR Flash Quantity Index, Q1 2006-Q1 2011
Macronix NOR Flash Shipments by Technology, Q1 2009-Q1 2011
Macronix NOR Flash Breakdown, 2011Q1
Revenue and Gross Margin of Inotera, 2004-2011 
Inotera Revenue and Gross Margin, Q1 2010-Q1 2011
Inotera Wafer Shipments, Q1 2010-Q1 2011
Inotera Quarterly Bit Shipments, Q1 2010-Q1 2011
Revenue and Gross Margin of Winbond, 2006-2010
Quarterly Revenue and Gross Margin of Winbond, Q2 2009-Q1 2011
Wafer Process Technology of Winbond, Q1 2009-Q1 2011
Operating Revenue Structure of Winbond by Product, Q2 2009-Q1 2011
12-inch Wafer Output of Winbond by Product, Q1 2009-Q2 2011
Production Technology Migration Process of Winbond, Q1 2011-Q1 2012
Operating Revenue and Gross Margin of Powerchip, 2004-2010
Quarterly Operating Revenue and Gross Margin of Powerchip,Q1 2009-Q1 2011 
DRAM and Flash R&D Progression of Powership, Q1 2011-Q4 2011
DRAM Product Specifications of Powership
Revenue and Gross Margin of Promos, 2004-2010
Quarterly Revenue and Gross Margin of Promos, Q1 2009-Q1 2011
Promos MCP Product
Operating Revenue and Gross Margin of Nanya, 2004-2010
Quarterly Operating Revenue and Gross Margin of Nanya, Q1 2009-Q1 2011 
DRAM Sales Volume and Revenue of Nanya, 2008-2012F
Capital Expenditure of Nanya, 2003-2011
Cost Comparison between Micron and Elpida by Process Technology, 2010
Cost Saving with 50nm Process Technology

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