Global and China IC Substrate Industry Report, 2011-2012
  • Apr./2012
  • Hard Copy
  • USD $2,200
  • Pages:89
  • Single User License
    (PDF Unprintable)       
  • USD $2,100
  • Code: ZYW105
  • Enterprise-wide License
    (PDF Printable & Editable)       
  • USD $3,200
  • Hard Copy + Single User License
  • USD $2,400
      

With the improvement of IC operating frequency and integration, traditional leadframe packaging is out of use, and IC has to be packaged by substrates. By packaging mode, the mainstream IC substrates include BGA (Ball Grid Array), CSP (Chip Scale Package) and FC (Flip Chip), of which the latter two now prevail.

In 2012, the global IC substrate market will value USD8.67 billion. IC substrates mainly find application in PC, mobile phone and base station, particularly PC is the biggest consumer. Inside PC, CPU, GPU and Northbridge IC all employs FC-BGA packaging, featuring large packaging area, many layers and high unit price. CPU and GPU of smartphones use FC-CSP packaging, so does CPU of some feature phones. In addition to CPU and GPU, most of the IC in mobile phone (such as Bluetooth / WiFi / FM, CMOS image sensor, USB controller, GPS, Touch Screen Controllers, Audio Codec, MOSFET, DC / DC converter) adopt WLCSP packaging. The mobile phone IC shipment is huge, but with the small-sized substrates, the mobile phone IC substrate has a far smaller market size than the PC IC substrate.

IC substrate vendors are principally PCB manufacturers, yet the direct customers of IC substrate are the IC packaging companies. IDMs or IC Foundries produce IC die at first; then, packaging companies complete IC packaging; next, the products are delivered to IC design companies or IDMs, and finally shipped to electronics manufacturers. In general, packaging companies exerts greatest influence on substrate suppliers.

Taiwan IC packaging and testing industry ranks first in the world, with 56% market share, while Chinese Mainland packaging and testing industry just shares 3%. The reason why Taiwan has the developed IC packaging and testing industry lies in that Taiwan boasts the globally largest wafer foundries. 60% of the 50 nm (or below 50 nm) IC business is undertaken by TSMC. Nearly all IC in smart phones is fabricated by TSMC and UMC. Three out of the global top four packaging and testing corporations are from Taiwan. In the global IC substrate packaging market, Taiwanese players sweep more than 70% share.

Japanese manufacturers occupy the market of CPU, GPU and Northbridge IC substrate for PC. In 2012, NGK quitted, and its market share was taken by Taiwan's Nanya PCB. Also, Japanese companies reign in the high-end market, they develop the FC-BGA technology with Intel and their positions remain quite stable. IBIDEN is building a base in the Philippines to lower prices. IBIDEN and Shinko focus on ABF substrates, both of which take no interest in BT substrates in the field of communications.

When it comes to the South Korean manufactures, SEMCO involves in the widest range of business. On the one hand, it obtains many orders from Qualcomm and Samsung Electronics. On the other hand, SEMCO also receives a small portion of orders from Intel or AMD. SIMMTECH, also a leading memory PCB maker, is mainly engaged in the memory substrate packaging. Memory PCBs will apply substrate packaging widely, in particular all of MCP memory PCBs may utilize substrate packaging in 2013.

Among Taiwanese manufacturers, Nanya PCB takes Intel as its major client, while Kinsus is a PCB supplier for Qualcomm and Broadcom, 90% shipment of which goes to BT substrate.

Revenue of Major IC Substrate Manufacturers, 2010-2011 (USD mln)
20120414.gif
1 Global Semiconductor Industry
1.1 Overview
1.2 IC Packaging
1.3 IC Packaging and Testing

2 IC Substrate  
2.1 Introduction
2.2 Flip Chip IC Substrate
2.3 Trends

3 IC Substrate Market 
3.1 IC Substrate Market
3.2 Mobile Phone Market
3.3 WLCSP Market
3.4 PC and Tablet PC Market
3.5 FPGA and CPLD Market
3.6 IC Substrate Industry

4 IC Substrate Manufacturers   
4.1 Unimicron      
4.2 IBIDEN
4.3 Dae Duck Electronics 
4.4 SIMMTECH
4.5 LG INNOTEK
4.6 SEMCO
4.7 NANYA PCB 
4.8 Kinsus
4.9 Shinko

5 IC Substrate Packaging Companies 
5.1 ASE  
5.2 Amkor
5.3 Siliconware Precision
5.4 STATS ChipPAC
Unimicron’s Organizational Structure
IBIDEN’s Revenue and Operating Margin, FY2006- FY2012  
IBIDEN’s Revenue by Business , FY2006-Q3 FY2012
IBIDEN’s Operating Profit by Business, FY2009-Q3 FY2012
IBIDEN’s HDI Board Output, 2008-2012
Revenue and Operating Margin of Dae Duck Electronics, 2005-2012
Revenue of Dae Duck Electronics by Business, 2009-2011
Revenue of Dae Duck Electronics by Business, 2010–Q4 2011
Revenue and Operating Margin of Dae Duck GDS, 2005-2012
Revenue of Dae Duck GDS by Business, 2010-2012
SIMMTECH’s Revenue and Operating Margin , 2004-2012
SIMMTECH’s Revenue and Operating Margin, Q1 2010-Q4 2011    
SIMMTECH’s Memory Revenue by Speed, Q1 2010-Q4 2011     
SIMMTECH’s Substrate Revenue by Product, Q1 2010-Q4 2011
SIMMTECH’s Revenue by Application, Q1 2004 -Q4 2010 
SIMMTECH’s Clients, 2004-2010
SIMMTECH’s Plants
SEMCO’s Revenue by Division, 2010-2011      
Revenue and Operating Margin of SEMCO’s ACI Division, Q1 2010-Q4 2011    
Capacity and Global Distribution of NANYA PCB 
Clients of NANYA PCB, 2010
ASE’s Organizational structure
ASE’s Revenue and Gross Margin, 2001-2012     
Amkor’s Revenue and Gross Margin and Operating Margin, 2005-2011
Revenue, Gross Margin, Operating Margin of Siliconware Precision, 2003-2011
Revenue and Gross Margin of STATS ChipPAC, 2004-2011
Revenue of STATS ChipPAC by Packaging Type, 2006-2011
Revenue of STATS ChipPAC by Application, 2006-2011
Revenue of STATS ChipPAC by Region, 2006-2011
Global Semiconductor Industry and Global GDP Growth Rate, 1990-2016E
Quarterly World’s IC Shipment , 2000-2012
Annual Capital Expenditure of Semiconductor Industry, 1983-2011
Capital Expenditure of Global Semiconductor Industry by Region, 2005-2012
Global Wafer Capacity, 1994-2012
IC Packaging Types Used by Major Electronic Products
Market Share of OSAT Manufacturers Worldwide, 2011
Revenue of Taiwan Packaging and Testing Industry, 2007-2011
Revenue of Global Semiconductor Packaging Materials Manufacturers, 2010-2013
Proportion of IC Substrates in PCB Industry, 2006-2015
Application of IC Substrates, 2011-2012
Global Mobile Phone Shipment , 2007-2014 
Quarterly Global Mobile Phone Shipment, Q1 2009 –Q4 2011  
Quarterly CDMA and WCDMA Mobile Phone Shipment, 2007-2011 
WLCSP Packaging Market Size, 2010-2016
WLCSP’s Shipment by Application , 2010-2016
Global PC-use CPU and GPU Shipment , 2008-2013
NETBOOK, iPad and Tablet PC Shipment, 2008-2012
Application Distribution and Geographical Distribution of FPGA and CPLD Market, 2011
Market Share of Major FPGA and CPLD Manufacturers, 2000-2010  
Revenue of Major IC Substrate Manufacturers, 2010-2011
Unimicron’s Revenue and Gross Margin, 2003-2011     
Unimicron’s Quarterly Revenue and Growth Rate, Q1 2009-Q4 2011
Unimicron’s Revenue by Product, 2010-2011
Unimicron’s Revenue by Application, 2010-2011
Unimicron's Manufacturing Bases
Unimicron's M & A
Financial Data of Unimicron's Major Subsidiaries, 2009-2010
IBIDEN’s Revenue, 2007-2011 
DAEDUCK’s Revenue by Product, Q1 2011–Q1 2012
SIMM TECH’s Organizational Structure
Revenue of Memory Division of SIMM TECH by Product, 2010-2012  
Substrate Revenue of SIMM TECH by Product, 2010-2012  
SIMMTECH’s Capacity, Q1 2010-Q4 2011   
Revenue and Operating Margin of LG INNOTEK, 2006-2011       
Revenue of LG INNOTEK by Product, Q1 2010-Q4 2011
Revenue and Gross Margin of NANYA PCB, 2006-2011     
Monthly Revenue and Growth Rate of NANYA PCB, Jan 2010-Jan 2012
Kinsus’ Revenue and Gross Margin, 2003-2012     
Kinsus’ Revenue and Growth Rate, Jan 2010-Jan 2012   
Kinsus’ Revenue by Product, 2011
Kinsus’ Revenue by Application, 2011      
Shinko’s Revenue and Net Income, FY2007-FY2012
Shinko’s Revenue by Business, FY2011-FY2012
ASE’s Revenue by Business, 2010-2011
Revenue, Gross Margin and Operating Margin of ASE’s Packaging Division, Q1 2010-Q4 2011  
Revenue of ASE’s Packaging Division, Q1 2010-Q4 2011  
Revenue, Gross Margin and Operating Margin of ASE’s Materials Division, Q1 2010-Q4 2011
ASE’s Top 10 Clients, Q4 2011
ASE’s Revenue by Application, Q4 2011 
Amkor’s Revenue by Packaging Type, 2007-2011
Amkor’s Revenue by Packaging Type, Q4 2008-Q4 2011
Amkor’s Shipment by Packaging Type, Q4 2008-Q4 2011     
Amkor’s CSP Packaging Revenue and Shipment, 2005-Q3 2011   
Amkor’s CSP Packaging Revenue by Application, 2011      
Amkor’s BGA Packaging Revenue and Shipment, 2005-Q3 2011       
Amkor’s BGA Packaging Revenue by Application, 2011      
Amkor’s Leadframe Packaging Revenue and Shipment, 2005-Q3 2011  
Amkor’s Leadframe Packaging Revenue by Application, Q3 2011
Amkor’s Revenue and Shipment by Region, Q3 2011
Amkor’s Packaging Capacity Utilization , Q1 2008-Q4 2011 
Organizational Structure of Siliconware Precision 
Revenue of Siliconware Precision by Region, 2005-2011 
Revenue of Siliconware Precision by Application, 2005-2011
Revenue of Siliconware Precision by Business, 2005-2011
Capacity of Siliconware Precision, Q1 2006, Q2-Q3 2007, Q3-Q4 2011 

Global and China Semiconductor Equipment Industry Report, 2013-2014

After two years of recession, the semiconductor equipment market is projected to achieve growth in 2014. In 2011, the semiconductor equipment market size hit a record high of USD43.532 billion, but it...

China Digital TV Transmitter Industry Report, 2013

According to the planning of the State Administration of Radio, Film and Television (SARFT), China in 2015 will shut down analog TV and complete the integral transition of cable TV from analog to digi...

Global and China Memory Industry Report, 2013

Global and China Memory Industry Report, 2013 consists of the following contents: Brief introduction to global semiconductor industry Market analysis of DRAM and NAND Major memory vendors  Majo...

Global and China Passive Component Industry Report, 2012-2013

The report highlights the followings: 1. Brief Introduction to Passive Components;  2. Passive Component Industry & Market Segments-Capacitor, Inductor and Resistor;  3. Main Downst...

Global and China GaAs Industry Report, 2012-2013

Global and China GaAs Industry Report, 2012-2013 covers the followings: 1 Brief introduction to GaAs2 Industry overview of GaAs3 Downstream market of GaAs4 Analysis on mobile phone RF system 5 Study o...

Global and China Advanced Packaging Industry Report, 2012-2013

Global and China Advanced Packaging Industry Report, 2012-2013 covers the followings: 1.     Global Semiconductor Industry Overview;2.     IC Manufacturing Industry Overv...

Global and China Touch Screen (Panel) Industry Report, 2012-2013

Global and China Touch Screen (Panel) Industry Report, 2012-2013 covers the followings: Touch Screen Market Size Trends of Small, Medium and Large-sized Touch Screens Touch Screen Downstream Market...

Global and China Mobile PC Casing (Enclosure) Industry Report, 2012-2013

The report covers the followings:    1. Global and Chinese PC markets    2. Global and China Mobile PC industry    3. Notebook and tablet PC casing industr...

Global and China PC Cable Assembly Industry Report, 2012-2013

Global and China PC Cable Assembly Industry Report, 2012-2013 covers the followings: 1. Global and China PC Market; 2. Global and China Mobile PC Market;3. PC Cable Assembly Industry;4. 15 Major PC Ca...

Global and China Flexible Printed Circuit Board (FPCB) Industry Report, 2012

Global and China Flexible Printed Circuit Board (FPCB) Industry Report, 2012 includes the following contents: 1. Profile of FPCB2. Overview of FPCB Market and Industry3. Analysis of 22 Major FPCB Ma...

Global and China OLED Industry Report, 2012

Promoted by the display giants headed by Samsung and LG, OLED industry is still in the stage of steady development. In 2011, the OLED output value worldwide approximated USD3.3 billion, with year-on-y...

China Navigation Equipment Industry Report, 2012-2014

After forty years of development, the global satellite navigation system has developed into a “one plus three” pattern. And the “one” refers to GPS made in the USA, and the three refer to Chinese, Rus...

Global and China Power Device Industry Report, 2011-2012

Global and China Power Device Industry Report, 2011-2012underlines: 1. power device; 2. global and China power device market; 3. power device industry; 4. IGBT, SiC and GaN market and industry outlook...

China Digital TV Transmitter Market Report, 2012

The analog-to-digital TV signal conversion in different countries around the world reached its peak after 2009, so did the digital television network construction. The United States plans to complete ...

Global and China LCD Backlight Unit (BLU) Industry Report, 2011-2012

Global and China LCD Backlight Unit (BLU) Industry Report, 2011-2012 covers the followings: Introduction to LCD Backlight Unit LCD Backlight Unit Market LCD Panel Market 11 Major LCD Panel Players 12 ...

Global and China Display Driver IC Industry Report, 2011-2012

The report highlights the followings: Brief introduction to display driver IC;Display driver IC market;Small-and medium-sized panel market of display driver IC; Research of 9 leading display driver ...

China IC Card/Smart Card Industry Report, 2011-2012

In 2011, the sales of IC card grew 11.1% over 2010 to around RMB9 billion, and its sales volume rose 13.6% over 2010 to 2.43 billion, hitting a record high. The IC card industry is expected to increas...

Global and China Touch Panel (Including Small- and Medium-sized Display) Industry Report, 2011-2012

Global and China Touch Panel (Including Small- and Medium-sized Display) Industry Report, 2011-2012 conducts studies on the followings: Downstream market of touch panel; Touch panel & small- and mediu...

2005-2014 www.researchinchina.com All Rights Reserved 京ICP备05069564号-1 京公网安备1101054484号
在线客服系统