Global and China PCB Industry Report, 2010-2011
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This report only studies the rigid PCB sector.
PCB is the cornerstone of the electronics industry, and the circuit of all electronics requires PCB. PCB industry has been very mature, with limited growth rate or decline margin. In 2008 and 2009, the output value of PCB industry decreased due to the fierce price competition. In 2010, the electronics industry rebounded, but PCB industry only grew by 10.5%. In 2011, the growth rate of PCB industry is expected to be merely 5.1%.
Revenue of Global Rigid PCB Manufacturers, 2010 (Top 20) (USD million)
The internal PCB of ordinary mobile phones employs the design of 1HDI+2 traditional boards +1HDI, with HDI as the outer layer and the traditional board as the inner layer.
Intermediate and high-end smart phones adopt the design of 2 +2 +2 and 3 +2 +3, with 4 layers and 6 layers of HDI used respectively. In addition, iPad1 uses 1HDI +8 boards (traditional) +1 HDI, with 2 layers of HDI. iPad2 renders 3 +4 +3, with 6 layers of HDI, namely Any-Layer HDI, which reduces the thickness to be 0.88 cm. The thickness of iPad1 is 1.34 cm.
New type of iPad is 1/3 thinner than old type，mainly because HDI develops from the original multi-layer board to Any-Layer, and Any-Layer has dense holes. Nevertheless, the hole diameter of Any-Layer must be done by laser drilling instead of machine drilling. In the future, iPhone 5 will be lighter and thinner like iPad 2.
In the world, there are four iPad 2 suppliers, including Tripod which is the exclusive supplier of HDI mainboard in Taiwan, TTM of the USA, IBIDEN and MEIKO of Japan. All alternative suppliers are from Taiwan, including Nan Ya PCB Corporation, Gold Circuit Electronics, Compeq Manufacturing Co., Ltd. and Unimicron.
1. PCB Industry Profile
1.1 Industrial Scale
1.2 Industrial Pattern
1.3 Recent Developments
2. PCB Downstream Market
2.1 Mobile Phone
2.1.1 Global Mobile Phone Market Size
2.1.2 Market Shares of Mobile Phone Brands
2.1.3 Smart Phone Market and Industry
2.1.4 China Mobile Phone Industry
2.2 Notebook
2.2.1 Global Notebook Market Size and Brand Pattern
2.2.2 Tablet Computer Market
3. PCB Industry Analysis
3.1 Mobile Phone PCB Industry
3.1.1 Ranking of Mobile Phone PCB Manufacturers
3.1.2 Mobile Phone PCB Supporting Relationship
3.2 Any-layer HDI
3.2.1 Definition
3.2.2 Application
3.2.3 Supply & Demand
3.3 PCB for Memory Module
3.4 Photovoltaic Panel
3.5 PCB for Automotive Electronics
3.6 PCB for Notebook
3.7 PCB Drilling Machine
3.8 PCB Industry Rankings
4. PCB Manufacturers
4.1 Unimicron
4.2 Compeq
4.3 Tripod Technology
4.4 HannStar Board
4.4.1 Jiangyin HannStar Board
4.5 Meiko
4.6 CMK
4.6.1 CMK Electronics (Wuxi)
4.6.2 Ruisheng Technology
4.6.3 Qideli Electronics
4.7 IBIDEN
4.8 Daeduck Electronics
4.8.1 Daeduck GDS
4.9 TTM
4.10 Unitech Printed Circuit Board
4.11 GOLD CIRCUIT ELECTRNICS
4.12 AT&S
4.13 Kingboard Chemical Holdings Ltd
4.13.1 Elec & Eltek
4.13.2 Techwise Circuits
4.13.3 Express Electronics
4.14 SIMMTECH
4.15 Taiwan PCB Techvest
4.16 Ellington Electronics
4.17 Chin Poon Industrial
4.18 LG INNOTEK
4.19 SEMCO
4.20 Founder PCB
4.21 Gul Tech
4.22 Dynamic Electronics
4.23 ViaSystems
4.24 Nanya PCB
4.26 Shennan Circuit
4.27 WUS Printed Circuit
4.28 GOWORLD
4.29 Multek
Output Value of PCB Industry, 2006-2012
PCB Industry Chains
Output Value of PCB Industry by Technology, 2010
Output Value of PCB Industry by Region, 2010
Output Value of PCB Industry by Application, 2010
PCB Order Quantity and Shipment Indices and the Order-Shipment Ratio in North America, Jan.2009-Jan.2011
Pixel Distribution of Camera Phones Worldwide, 2007-2013E
Shipment of Auto-focus Camera Phones, 2007-2013E
Mobile Phone Shipment Worldwide, 2007-2014E
Mobile Phone Shipment and Annual Growth Margin Worldwide, Q1 2008-Q4 2010
Mobile Phone Shipment by Region in the World, Q1 2007-Q2 2010
Mobile Phone Shipment by Technology in the World, Q1 2007-Q2 2010
CDMA/WCDMA Mobile Phone Shipment by Region in the World, 2006-2010
Shipment of World’s Main Mobile Phone Brands, 2009-2010
Operating Margins of Global Top Five Mobile Phone Manufacturers, Q1 2009-Q4 2010
Smart Phone Shipment of World’s Main Mobile Phone Manufacturers, 2010-2011
China Mobile Phone Output by Region, 2010
Global Notebook Shipment and Growth Margin, 2007-2013E
Shipment of World’s Main Notebook Manufacturers, 2010-2011
Shipment of Netbook, iPad and Tablet Computer, 2008-2012E
PCB Suppliers of Nokia Mobile Phones, 2010
PCB Suppliers of SAMSUNG Mobile Phones
PCB Suppliers of LG Mobile Phones, 2010
PCB Suppliers of ZTE Mobile Phones, 2010
PCB Suppliers of RIM Mobile Phones, 2010
PCB Suppliers of APPLE Mobile Phones, 2010
Distribution of Any-layer Applications, 2010-2011
Market Shares of Memory PCB Manufacturers, 2010
Market Shares of Key Chinese Photovoltaic Panel Manufacturers, 2006
Market Shares of Notebook PCB Manufacturers, 2010
Unimicron Organization Structure
Unimicron Revenue and Gross Margin, 2003-2011
Unimicron Shipment of Mobile Phone Boards, Q1 2009-Q1 2010
Unimicron Revenue by Application, 2009-2010
Unimicron Revenue by Application, Q3 & Q4, 2010
Associated Enterprises of Unimicron
Compeq Revenue and Gross Margin, 2006-2011
Compeq Shipment of Mobile Phone Boards, Q1 2009-Q4 2010
Revenue and Gross Margin of Tripod Technology, 2006-2011
Revenue of Tripod Technology by Application, 2010
Associated Enterprises of HannStar Board
Revenue and Gross Margin of HannStar Board, 2006-2011
Market Shares of Notebook PCB of HannStar Board, 2003-2011
Organization Structure of HannStar Board
Revenue of HannStar Board by Application, Q1 2009-Q2 2010
Revenue of HannStar Board by Layer, Q1 2009-Q2 2010
Capacity Utilization of HannStar Board, Q1 2009-Q2 2010
Production Capacities of Plants of HannStar Board, 2003-Q3 2010
Turnover and Operating Margin of Jiangyin HannStar Board, 2005-2010
Meiko Revenue and Operating Margin, FY2006-FY2011
Meiko Revenue by Region, FY2008-FY2011Q3
Meiko Revenue by Application, FY2010 vs. FY2012
Meiko Revenue by Layer, FY2010 vs. FY2012
CMK Revenue and Operating Margin, FY2005-FY2011
CMK Revenue by Application, FY2007-FY2011 H1
CMK Revenue by Layer, FY2007-FY2011 H1
CMK Revenue by Region, FY2007-FY2011 H1
IBIDEN Revenue and Operating Margin, FY2006-FY2011
IBIDEN Revenue by Sector, FY2006-FY2011Q3
IBIDEN Operating Margin by Sector, FY2009-FY2011Q3
HDI Output of IBIDEN, 2008-2012
Revenue and Operating Margin of Daeduck Electronics, 2005-2011
Revenue of Daeduck Electronics by Sector, 2009-2011
Revenue of Daeduck Electronics by Sectro, 2010Q1-2011Q4
Revenue and Operating Margin of Daeduck GDS
Revenue of Daeduck GDS by Sector, 2007-2010
Global Presence of TTM
TTM Revenue and Acquisitions, 1998-2010
TTM Revenue by Technology, Q1 2009-Q4 2010
Downstream Distribution of TTM Revenue in Asia-Pacific Region, 2010
Downstream Distribution of TTM Revenue in North America, 2010
Main Customers of TTM
Organization Structure of Unitech Printed Circuit Board
Revenue and Gross Margin of Unitech Printed Circuit Board, 2006-2011
Revenue and Gross Margin of Gold Circuit Electronics, 2005-2011
Revenue of Gold Circuit Electronics by Application
AT&S Revenue and EBITDA, 2006-2011
AT&S Revenue by Region, FY2005-FY2010
AT&S Revenue by Application, FY2009-FY2011
AT&S Revenue by Region, FY2009-FY2011
Revenue and Profit Margin Attributable to Stockholders of Kingboard Chemical Holdings, 2002-2010
Revenue of Kingboard Chemical Holdings by Sector, FY2008 vs. FY2009
Structure of Kingboard Chemical Holdings
Structure of Elec & Eltek
Elec & Eltek Revenue and Operating Margin, 2005-2010
Elec & Eltek Revenue by Region, 2006-2010
Elec & Eltek Revenue by Layer, 2006-2010
Production Capacities of Elec & Eltek Plants, the end of 2009
Multi-layer Board Output of Express Electronics, 2004-2009
Double-sided Board Output of Express Electronics, 2004-2009
Organization Structure of SIMMTECH
SIMMTECH Revenue and Operating Margin, 2004-2011
SIMMTECH Revenue and Operating Margin, Q1 2010-Q4 2011
SIMMTECH Memory Revenue by Speed, Q1 2010-Q4 2011
SIMMTECH Substrate Revenue by Type, Q1 2010-Q4 2011
SIMMTECH Revenue from Substrate and Memory Modules, Q1 2004-Q4 2010
SIMMTECH Capacity Utilization of Substrate and Memory Modules, 2005-2010
SIMMTECH Revenue from Memory Modules by Type, Q1 2004-Q4 2010
SIMMTECH Revenue from Substrates by Type, Q1 2004-Q4 2010
SIMMTECH Output of Substrates and Memory PCB, Q1 2010-Q4 2011
SIMMTECH Capacity Utilization of Substrates and Memory PCB, Q1 2010-Q4 2011
SIMMTECH Revenue by Application, Q1 2004-Q4 2010
Customers of SIMMTECH, 2004-2010
Plant Areas of SIMMTECH
Revenue and Gross Margin of Taiwan PCB Techvest, 2005-2011
Revenue and Gross Margin of Ellington Electronics, 2007-2010
Revenue and Gross Margin of Chin Poon Industrial, 2005-2011
LG INNOTEK Revenue and Operating Margin, 2006-2011
LG INNOTEK Revenue by Product, 2009-2012
Revenue of LG INNOTEK PCB Division, Q4 2009-Q4 2010
Downstream Applications of LG INNOTEK PCB, Q3 2010-Q4 2010
SEMCO Revenue by Division, 2010-2011
Revenue and Operating Margin of SEMCO ACI Business Division, Q1 2010-Q4 2011
Organization Structure of Founder Group
Organization Structure of Founder PCB
Revenue of Founder PCB, 2004-2010
Downstream Applications of Founder PCB, 2010
Production Capacity of Founder Chongqing Plant by Technology
Production Capacity of Founder Zhuhai Plant I by Technology
Production Capacity of Founder Zhuhai Plant III by Technology
Production Capacity of Founder Zhuhai Plant V by Technology
Production Capacity of Founder Hanghzou Plant II by Technology
Production Capacity of Founder Zhuhai Plant IV by Technology
Revenue and Operating Profit of Gul Tech, 2005-2010
Organization Structure of DYnamic Electronics
Revenue and Gross Margin of DYnamic Electronics, 2006-2011
Production Capacity of DYnamic Electronics, 2009-2012
Production Capacity of DYnamic Electronics Taiwan, 2009-2012
Production Capacity of DYnamic Electronics Kunshan, 2009-2012
Production Capacity of DYnamic Electronics Xiamen, 2009-2012
ViaSystems Revenue and Operating Margin, 2006-2010
ViaSystems Revenue by Sector, 2008-2010
Global Presence of ViaSystems
ViaSystems Revenue by Application, 2008-2010
Main Customers of ViaSystems
ViaSystems Revenue by Region, 2010
Organization Structure of Nanya PCB
Production Capacity and Global Presence of Nanya PCB
Revenue of Nanya PCB by Sector, 2007-2011
Customers of Nanya PCB, 2010
Organization Structure of Shennan Circuit
Revenue and Operating Profit of WUS Printed Circuit, 2007-2011
Revenue of WUS Printed Circuit by Application, 2007-2010
GOWORLD Revenue and Operating Margin, 2005-2011
GOWORLD Revenue by Sector, 2007-2010
Flextronics Revenue by Application, FY2007 vs. FY2011
Flextronics Revenue by Application, Q4 2009-Q4 2010
Shipment of Global Key Mobile Phone Brands, Q1-Q4, 2010
Market Shares of Global Key Mobile Phone Brands by Revenue, Q1 2009-Q3 2010
Shipment of Smart Phone Operating System in the World, Q3 2010
Ranking of Mobile Phone PCB Manufacturers by Revenue, 2010
Market Shares of Automotive Electronic PCB Manufacturers by Revenue, 2010
Notebook Used PCB Technology Roadmap
Unimicron Mergers and Acquisitions in Past Years
Unimicron Capacities by Product, Q4 2010
Financial Data of Main Subsidiaries of Unimicron, 2009
Financial Data of Main Subsidiaries of COMPEQ, 2009
Production Capacity of Tripod Technology, 2006-2010
Revenue and Operating Margin of Meiko Subsidiaries in Mainland China, FY2009-FY2011
Revenue and Output of CMK Electronics (Wuxi), 2003-2010
Revenue of IBIDEN Electronics, 2007-2011
Meadville Revenue and Operating Profit, 2004-2008
TTM Revenue and Operating Profit, 2005-2009
Meadville Plants in China
AT&S Bases Worldwide
Technology Capability of Elec & Eltek, 2010
Manufacturing Capability of Express Electronics, 2010
Customers of Taiwan PCB Techvest, 2010
Production Capacity of Taiwan PCB Techvest, 2008-2011
Output of Ellington Electronics, 2007-Q3 2010
Production and Sales Volume of Ellington Electronics by Layer, 2007-Q3 2010
Revenue of Ellington by Layer, 2007-Q3 2010
Revenue of Ellington by Application, 2007-Q3 2010
Revenue of Ellington by Region, 2007-Q3 2010
Revenue of Ellington by Customer, 2007-Q3 2010
Monthly Production Capacity of Plants of Chin Poon Industrial, 2007-2010
HDI Technology Capability of Founder
Main Customers of ViaSystems, 2008-2010
Technology Capability of Shennan Circuit
Shipment of WUS Printed Circuit by Layer, 2007-2009
Revenue of WUS Printed Circuit by Layer, 2007-2009
Main Customers of WUS Printed Circuit, 2010
Output of GOWORLD, 2007-2009
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