Taiwan-based DRAM maker Rexchip Electronics has completed the upgrade of its manufacturing process at a monthly capacity of 80,000 12-inch wafers from 40nm to 30nm, one month ahead of originally scheduled for the end of 2011, according to industry sources in Taiwan.

Rexchip earlier this year upgraded its DRAM process to 40nm, and the further upgrade to 30nm makes it most competitive among Taiwan-based DRAM makers with South Korea-based Samsung Electronics and Hynix Semiconductor in terms of advanced technology, the sources pointed out.

The 30nm-based production cost of 2Gb DDR3, including packaging and testing, stands at US$1.1-1.2 and that of 4Gb DDR3 is about US$2, the sources indicated.

Due to demand for 40nm-based DRAM from clients of its parent company Japan-based Elpida Memory, Rexchip reserves 25% of capacity, 20,000 wafers, for temporary production based on 40nm.