ASML has been developing the next generation of its NXE-series EUV lithography machines, the 3300 series, according to Peter Jenkins, VP of marketing at the Dutch fab tool supplier. The available NXE:3100 EUV lithography tools have been shipped to customers with six units shipped in 2011, Jenkins added.

The expanding market for mobile consumer devices including smartphones and tablet PCs has created huge demand for system-on-chip solutions. A constant reduction in chip sizes is to meet end-market requirements and also keep Moore's Law on track. Acknowledging the trend, ASML has poured significant R&D efforts into development for EUV as well as multi-patterning immersion lithography scanners for next-node processes, Jenkins noted.

There are still some technological challenges in developing EUV equipment, Jenkins said. For instance, the power of the light source is an issue.

ASML's NXE:3100 series has been proven to be used at 16nm, according to Jenkins. In the future, ASML expects its EUV tools to be used for processes under 7nm.

In addition, Jenkins disclosed that ASML has begun R&D for 450mm (18-inch) wafer processing equipment. Immersion lithography tools will have to be re-designed to meet demand for production on the larger wafers without any loss in speed and throughput, which does pose a challenge for developers, Jenkins said.