Global and China IC Substrate Industry Report, 2014-2015
  • July 2014
  • Hard Copy
  • USD $2,400
  • Pages:97
  • Single User License
    (PDF Unprintable)       
  • USD $2,200
  • Code: ZYW177
  • Enterprise-wide License
    (PDF Printable & Editable)       
  • USD $3,500
  • Hard Copy + Single User License
  • USD $2,600
      

Global and China IC Substrate Industry Report, 2014-2015 contains the followings
1. Status quo of global semiconductor industry
2. Introduction of IC substrate
3. Analysis on IC substrate market
4. Analysis on IC substrate industry
5. Research on 11 IC substrate vendors
6. Research on the world’s top 4 IC substrate packaging companies.

PCB (printed circuit board) industry can be divided into three broad categories i.e. rigid PCB, flexible PCB (FPCB) and substrate. IC substrate industry suffered a continuous decline in 2012 and 2013, rooted in two aspects: first, the PC shipment declined, and CPU substrate as the main type of IC substrate enjoyed the highest average selling price (ASP); second, to suppress the development of Japanese and Taiwanese IC substrate vendors, Korean companies slashed price, Samsung Electro-Mechanics (SEMCO), in particular, implemented a nearly 30% price cut. This led to the global IC substrate industry market scale down 10.3% to USD7.568 billion in 2013. But after suffering comes happiness, IC substrate industry is expected to bloom in 2014 and 2015.

There are several factors for the growth in 2014.

20120114.gifFirst, MediaTek’s 8-core MT6592 adopts FC-CSP packaging. Released in October 2013, the chip will see shipment boost-up in 2014. Entering the age of 28nm, MediaTek will ensure uniform adoption of FC-CSP packaging; Spreadtrum from Mainland China will follow in its footsteps.

20120114.gifSecond, LTE 4G networks are under construction, thereof IC substrate is needed by BASESTATION chip.

20120114.gifThird, wearable devices are invading the market, which will stimulate SiP module packaging, also needs IC substrate.

20120114.gifFourth, the pursuit of ultra-thin mobile phone requires chip with good heat dissipation, FC-CSP packaging boasts obvious advantages in terms of heat dissipation and thickness. Main chip for mobile phone of the future will be the FC-CSP packaging or SiP module packaging, involving power management and memory.

20120114.gifFifth, PC industry will revive in 2014. Tablet PC will not see high growth, even fall in 2014, since consumers have been aware of its function only as a toy but completely unable to compare with PC in performance, PC industry will usher in recovery. At last, SEMCO will not fall back on price-cutting competition, because it is Taiwan’s TSMC not Samsung Electronics that on track to produce Apple’s next-generation processor A8. Even slashing price, it is impossible for TSMC to turn over the order.

The global IC substrate industry market scale is expected to grow at a rate of 9.8% in 2014, and then speed up to 11.6% in 2015.

IC substrate industry falls into three camps i.e. Japan, Korea and Taiwan. Japanese companies as the IC substrate pioneer have the strongest technical strength, mastering the most profitable CPU substrate. Korean and Taiwanese companies rely on the industrial chain cooperation, the former hold about 70% of the world's memory capacity, the Apple’s processor foundry provider Samsung also can produce part of mobile phone chips.

Taiwanese companies are more powerful in the industrial chain by possessing 65% of global foundry production capacity and 80% of senior mobile phone chip foundry (by TSMC or UMC), whose margin is much higher than that of traditional electronic products, (gross margin) exceeding 50%. MediaTek’s MT6592, for instance, the foundry is charged by TSMC or UMC, the packaging is completed by ASE and SPIL, the substrate is offered by Kinsus and testing by KYEC; sharing the same factory, these vendors are pretty high-efficient.

The utterly disadvantaged Mainland Chinese companies in the industrial chain lack support from foundries and packaging companies, lagging behind Taiwanese counterparts several even a dozen years. Even Hisilicon and Spreadtrum have impressive shipments, Taiwanese companies still hold the discourse right of the supply chain.

IC载板 英文_副本.jpg

1. Global Semiconductor Industry
1.1 Overview
1.2 IC Packaging
1.3 IC Packaging and Testing

2. IC Substrate
2.1 Introduction
2.2 Flip Chip IC Substrate
2.3 Trends

3. IC Substrate Market and Industry
3.1 IC Substrate Market
3.2 Mobile Phone Market
3.3 WLCSP Market
3.4 PC Market
3.5 Tablet PC Market
3.6 FPGA and CPLD Market
3.7 IC Substrate Industry
3.8 Wafer Foundry Market Size
3.9 Wafer Foundry Industry Competition

4. IC Substrate Vendors
4.1 Unimicron
4.2 IBIDEN
4.3 Daeduck Electronics
4.4 SIMMTECH
4.5 LG INNOTEK
4.6 SEMCO
4.7 Nan Ya PCB
4.8 Kinsus
4.9 Shinko
4.10 Kyocera SLC
4.11 AT&S

5. IC Substrate Packaging Companies
5.1 ASE
5.2 Amkor
5.3 Siliconware Precision
5.4 STATS ChipPAC
5.5 MITSUBISHI GAS CHEMICAL COMPANY
Quarterly Revenue of Global Semiconductor Industry, 2009-2014
Revenue of Global Semiconductor Industry, 2008-2017E
Revenue of Global Semiconductor Industry by Product, 2012-2017E
Market Size Growth of Global Semiconductor Industry by Product, 2012-2017E
Annual Capital Expenditure of Semiconductor Industry, 2008-2017E
Capital Expenditure of Global Semiconductor Industry by Downstream Application, 2008-2017E
IC Packaging Types Used by Major Electronic Products
Global IC Packaging and Testing Market Size, 2012-2017E
Global IC Substrate Market Size by Technology, 2012-2015E
Global Outsourcing IC Packaging and Testing Market Size, 2012-2017E
Global IC Packaging Market Size, 2012-2017E
Global IC Testing Market Size, 2012-2017E
Revenue of Taiwan Semiconductor Packaging & Testing Service Revenue, 2009-2013
Revenue of Global Top Ten Packaging Vendors, 2013
Global IC Substrate Market Size, 2009-2016E
Application Products of IC Substrate
IC Substrate by Node, 2011-2016E
Global Mobile Phone Shipment, 2007-2015E
Global 3G/4G Mobile Phone Shipment by Region, 2011-2014
Worldwide Smartphone Sales to End Users by Vendor, 2013 (Thousands of Units)
Worldwide Smartphone Sales to End Users by Operating System, 2013 (Thousands of Units)
Worldwide Mobile Phone Sales to End Users by Vendor, 2013 (Thousands of Units)
WLCSP Packaging Market Size, 2010-2016E
WLCSP’s Shipment by Application, 2010-2016E
Global PC-use CPU and Discrete GPU Shipment, 2008-2015
Global Tablet PC Shipment, 20011-2016E
Market Share of Major Tablet PC Brands,2013
Shipment of Major Global Tablet PC Vendors, 2012-2013
Application Distribution and Geographical Distribution of FPGA and CPLD Market, 2011
Market Share of Major FPGA Vendors, 1999-2013
Revenue of Major IC Substrate Vendors, 2010-2014
Global Foundry Market Size, 2008-2017E
Foundry Revenue of Advanced Nodes, 2012-2017E
Global Foundry Capacity by Node, 2012-2018E
Global Foundry Revenue by Node, 2012-2018E
Global Ranking by Foundry, 2013
Unimicron’s Organizational Structure
Unimicron’s Revenue and Gross Margin, 2003-2014
Unimicron’s Revenue and Operating Margin, 2009-2014
Unimicron’s Quarterly Revenue and Gross Margin, Q1 2012-Q1 2014
Unimicron’s Sales Breakdown by Technology, 2010-2014
Unimicron’s Sales Breakdown by Application, 2010-2014
Unimicron’s Capacity by Product, 2010-2014
Unimicron’s CAPEX, 2004-2013
Unimicron's M & A
IBIDEN Revenue and Operating Margin, FY2006-FY2015
Revenue of IBIDEN by Business, FY2006-FY2015
Revenue of IBIDEN by Business, Q2 FY2012-Q1 FY2014
Operating Income of IBIDEN by Business,Q2 FY2012-Q1 FY2014
Revenue of IBIDEN ‘s Electronics Business by Product, FY2010-FY2015
IBIDEN’s CAPEX and Depreciation, FY2010-FY2015
Major Projects of IBIDEN in 2014
Revenue and Operating Margin of Daeduck Electronics, 2005-2014
Revenue of Daeduck Electronics by Business, 2009-2014
SIMMTECH’s Organizational Structure
SIMMTECH’s Revenue and Operating Margin, 2004-2014
Revenue, Gross Margin and Net Margin of SIMMTECH, 2009-2014
SIMMTECH’s Balance Sheet, 2009-2013
Quarterly Revenue of SIMMTECH by Product, Q3 2013-Q4 2014
Revenue of SIMMTECH by Product, 2012- 2015
Quarterly Gross Margin and Operating Margin of SIMMTECH, Q1 2013-Q4 2014
Quarterly Shipment of SIMMTECH, Q1 2013-Q4 2014
SIMMTECH’s Shipment, 2012-2015
Quarterly Capacity Utilization of SIMMTECH, Q1 2013-Q4 2014
Capacity Utilization of SIMMTECH, 2012- 2015
SIMMTECH’s Revenue by Application, 2008-2014
Substrate Revenue of SIMMTECH by Application, 2012-2014
SIMMTECH’s Plants
Revenue and Operating Margin of LG INNOTEK, 2006-2014
Quarterly Revenue and Operating Margin of LG INNOTEK, Q1 2011-Q1 2014
Revenue of LG INNOTEK by Business, 2011-2014
Operating Income of LG INNOTEK by Business, 2011-2013
Revenue and Operating Margin of SEMCO, 2009-2014
Revenue of SEMCO by Segment, 2010-2014
Operating Income of SEMCO by Segment, 2012-2014
Quarterly Revenue and Operating Margin of SEMCO’s ACI Segment, Q1 2013- Q4 2014
SEMCO’s IC Substrate Sales by Technology, 2013-2015
Operating Income of SEMCO’s IC Substrate by Technology, 2013-2015
Organizational Structure of Nan Ya PCB
Revenue and Gross Margin of Nan Ya PCB, 2006-2014
Revenue and Operating Margin of Nan Ya PCB, 2009-2014
Monthly Revenue and Growth Rate of Nan Ya PCB, May 2012-May 2014
Production Allocation and Monthly Capacity of Nan Ya PCB
Revenue and Gross Margin of Kinsus, 2004-2014
Revenue and Operating Margin of Kinsus, 2009-2014
Monthly Revenue and Growth Rate of Kinsus, May 2012-May 2014
Revenue of Kinsus by Product, 2011-2014
Revenue of Kinsus by Downstream Application, 2011
Revenue of Kinsus by Applications, Q1 2014
Client Structure of KINSUS, 2013-2014
Shinko’s Revenue and Net Income, FY2007-FY2015
Shinko’s Revenue by Business, FY2011-FY2014
Revenue and EBITDA Margin of AT&S, FY2005-FY2014
Global Presence of AT&S
Substrate Plant Ramp of AT&S in Chongqing
Revenue of AT&S by Region, FY2014
Balance Sheet of AT&S, FY2014
ASE Group Organization Chart
ASE’s Revenue and Gross Margin, 2001-2014
ASE’s Revenue and Operating Margin, 2009-2014
Monthly Revenue of ASE, May 2012-May 2014
ASE’s Revenue by Business, 2010-2013
Revenue and Gross Margin of ASE’s Packaging Division, Q1 2013-Q1 2014
Revenue of ASE’s Packaging Division by Type, Q1 2013-Q1 2014
Revenue and Gross Margin of ASE’s Materials Division, Q1 2013-Q1 2014
Revenue and Gross Margin of ASE’s EMS, Q1 2013-Q1 2014
Revenue of ASE’s EMS by Application, Q1 2013-Q1 2014
ASE’s Revenue by Application, Q1 2014
Revenue, Gross Margin and Operating Margin ofAmkor, 2005-2014
Amkor’s Revenue by Packaging Type, 2007-2012
Amkor’s Revenue by Product, 2012-2014Q1
Organizational Structure of Siliconware Precision
Revenue, Gross Margin, Operating Margin of Siliconware Precision, 2003-2014
Monthly Revenue of SPIL, May 2012-May 2014
Quarterly Revenue, Gross Margin and Operating Margin of SPIL, Q1 2012-Q1 2014
Revenue of SPIL by Region, 2005-2014
Revenue of SPIL by Downstream Application, 2005-2014
Revenue of SPIL by Business, 2005-2014
Capacity of SPIL, 2006-2014
Revenue and Gross Margin of STATS ChipPAC, 2004-2014
Revenue of STATS ChipPAC by Packaging Type, 2006-2013
Revenue of STATS ChipPAC by Application, 2006-2013
Revenue of STATS ChipPAC by Region, 2006-2013
Organization Chart of Mitsubishi Gas Chemical
Revenue and Operating Income of Mitsubishi Gas Chemical, FY2009-FY2015
Revenue of Mitsubishi Gas Chemical by Segment, FY2009-FY2015
Operating Income of Mitsubishi Gas Chemical by Segment, FY2013-FY2015
CAPEX and Depreciation of Information and Advanced materials Segment of Mitsubishi Gas Chemical, FY2009-FY2014

Global and China IC Substrate Industry Report, 2015

Global and China IC Substrate Industry Report, 2015 highlights the followings:1. Status quo of semiconductor and IC packaging industry2. Analysis on downstream market of IC substrate3. ...

Global and China FPCB (Flexible Printed Circuit Board) Industry Report, 2014-2015

Global and China FPCB Industry Report, 2014-2015 involves the following:1. Analysis on the FPCB Industry2. Analysis on the FPCB Downstream Market 3. Comparison between FPCB Companies 4. Research on 22...

Global and China Rigid PCB Industry Report, 2015

Global and China Rigid PCB Industry Report, 2014-2015 highlights the followings:1. PCB industry2. PCB downstream market3. Horizontal comparison of PCB companies4. 35 typical PCB companies 2014 was a ...

Global and China LED Industry Report, 2014-2015

Global and China LED Industry Report, 2014-2015 is primarily concerned with the following:1. LED development trend2. LED industry analysis3. 38 LED companies After experiencing fall to the bottom and...

Global and China Display IC Industry Report, 2014-2015

The report contains the following aspects:1, Development trends of LCD driver IC and touch IC2, Analysis on downstream markets of LCD driver IC and touch IC3, Analysis on LCD driver IC and touch IC In...

China Supercapacitor Industry Report, 2014-2020

A supercapacitor (SC), sometimes ultracapacitor, formerly electric double-layer capacitor (EDLC) is a high-capacity electrochemical element that accumulates energy by polarizing electrolyte. However, ...

Global and China CCM (CMOS Camera Module) Industry Report, 2014-2015

Global and China CCM (CMOS Camera Module) Industry Report, 2014-2015 covers the following:1. CIS (CMOS Image Sensor) market and industry2. Lens industry3. CCM industry and market4. Development trend o...

Global and China Touch Screen (Panel)Industry Report, 2014-2015

The report covers the followings: 1, Development trends of touch screen technology2, Trends of touch screen market3, Analysis on the touch screen industry4, Study on 22 major touch screen vendors 5, R...

Global and China Mobile Phone Display Industry Report, 2014-2015

Global and China Mobile Phone Display Industry Report, 2014-2015 focuses on the following: 1. Overview of TFT-LCD2. TFT-LCD industry chain3. LCD market and industry4. Mobile phone display market and i...

Global and China TFT-LCD Industry Report, 2014-2015

Global and China TFT-LCD Industry Report, 2014-2015 contains the following aspects:1, Introduction to TFT-LCD2, Research on TFT-LCD upstream industries (glass substrate, backlight module, polarizer, d...

Global and China FPCB(Flexible Printed Circuit Board) Industry Report, 2014

Global and China FPCB Industry Report, 2014 mainly deals with the followings:1. Overview of FPCB;2. FPCB market;3. FPCB industry;4. 22 FPCB vendors;5. 9 FCCL vendors. In 2013, FPCB industry enjoyed a...

Global and China Electronic Cable Assembly Industry Report, 2014

Global and China Electronic Cable Assembly Industry Report, 2014 contains the following aspects:1, Brief introduction to electronic cable assembly2, Background of electronic cable assembly industry3, ...

China Environmental Monitoring Instrument Industry Report, 2013-2015

As industrialization and urbanization advances unceasingly in China, environmental issues are of the greatest concern to the public and environmental protection gradually turns into a national policy....

Global and China Earphone Industry Report, 2013-2014

Global and China Earphone Industry Report, 2013-2014 focuses on the following: 1. Earphone overview2. Earphone market3. Earphone industry4. 8 branded earphone vendors5. 13 earphone OEMs The report c...

Global and China Micro Electronic-Acoustics Component Industry Report, 2013-2014

The report highlights the followings:1. Introduction to Micro Electronic-Acoustics System2. Downstream Market of Micro Electronic-Acoustics 3. Micro Electronic-Acoustics Industry4. 21 Micro Electronic...

Global and China Wafer Foundry Industry Report, 2013-2014

Global and China Wafer Foundry Industry Report, 2013-2014 is all about the followings:1. Overview of Global Semiconductor Industry  2. Downstream Market of Wafer Foundry Industry3. Wafer Foundry ...

Global and China IC Advanced Packaging Equipment Industry Report, 2013-2014

Global and China IC Advanced Packaging Equipment Industry Report, 2013-2014 mainly deals with the followings:1. Overview of semiconductor industry2. Status quo of memory and wafer foundry industry3. D...

Global and China IC Advanced Packaging Industry Report, 2013-2014

Global and China IC Advanced Packaging Industry Report, 2013-2014 is mainly all about the followings 1. Overview of semiconductor industry2. Status quo of memory and wafer foundry industry3. Upstream ...

2005-2014 www.researchinchina.com All Rights Reserved 京ICP备05069564号-1 京公网安备1101054484号
在线客服系统