Global and China Advanced Packaging Industry Report, 2019-2025
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May 2019
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The global semiconductor packaging and testing market is enlarging with the prevalence of consumer electronics, automotive semiconductors and the Internet of Things (IoT), with its size edging up 2.5% year on year to $54.3 billion in 2018, of which the advanced packaging sales rose by 6.6% to approximately $25.6 billion in 2018, a figure projected to be $42.8 billion in 2025, at a CAGR of 7.6% or so between 2018 and 2025. To better meet the domestic and foreign demand for advanced packaging technology, Chinese packaging and testing companies have quickened their pace of deployments in 3D, SIP and WLCSP where they put more in research and development, which thus sends the market size of mid- and high-end packaging to $5.88 billion, or 30% of the total.
Foreign companies led by ASMPacific Technology (ASMP), US-based Alltech, Germany’s TPT and Austrian vendor FK, are the main suppliers of wire bonder, a key device for semiconductor packaging, among which ASMP boasts the biggest share, or 25% of the global market in the back-end-of-line (BEOL) process. America’s Teradyne and Japan-based Advantest are the two major vendors of sorter and tester, two kinds of semiconductor testing equipment, commanding 48% and 39% of the global market, separately.
The packaging and testing market in Mainland China has been ballooning to the second largest around the globe, as local players independently develop advanced packaging technology and acquire foreign firms, for example, Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) acquired STATS ChipPAC based in Singapore, making itself the world’s third-ranking packaging and testing plant only second to ASE Group and Amkor; Tianshui Huatian Technology Co., Ltd. acquired Flip Chip International, LLC (FCI), an American company; Tongfu Microelectronics Co., Ltd. has also been on the global top ten packaging and testing plants list after acquiring AMD’s packaging and testing subsidiary. All of which is a proof that global packaging and testing operations are gathering around Mainland China.
Global and China Advanced Packaging Industry Report, 2019-2025 highlights the following:
Global semiconductor industry (development course, market size, competitive pattern, packaging industry at a glance, etc.);
IC packaging upstream and downstream industries: (wafer, memory, collector, PC, etc.) (market size, output & sales, competitive pattern, etc.);
Packaging technology trends (SIP, 2.5D, 3D, WLCSP, etc.);
Advanced packaging industry (market size, competitive pattern, development trend, etc.);
15 key foreign and Chinese vendors (ASMP, Kulicke & Soffa, Advantest, etc.) (profile, operation, R&D, manufacturing base distribution, technical characteristics, etc.).
1. Global Semiconductor Industry
1.1 Overview
1.2 Supply Chain
1.3 Semiconductor Packaging Introduction
2. Upstream & Downstream of IC Packaging Industry
2.1 Semiconductor Industry by Location
2.2 Wafer Foundry Industry
2.2.1 Market Size
2.2.2 Competitive Pattern
2.2.3 China’s Wafer Market
2.3 DRAM Industry
2.3.1 Status Quo
2.3.2 Market Share of DRAM Vendors
2.3.3 Market Share of Mobile DRAM Vendors
2.4 NAND Flash
2.5 Mobile Phone Market
2.6 PC Market
2.7 Tablet PC Market
3. Packaging & Testing Technology Trend
3.1 WIDE IO/HMC MEMORY
3.2 Embedded Component Substrate
3.3 Embedded Trace Substrate
3.4 IC Packaging for Handset
3.4.1 Status Quo
3.4.2 PoP Packaging
3.4.3 FOWLP
3.5 SIP Packaging
3.5.1 Murata
3.5.2 USI (Taiwan)
3.6 2.5D Packaging (SI/GLASS/ORGANIC INTERPOSER)
3.6.1 Introduction
3.6.2 Application
3.6.3 2.5D Interposer Market Size
3.6.4 Suppliers
3.7 TSV (3D) Packaging
3.7.1 Equipment
4. Packaging & Testing Industry
4.1 Market Size
4.2 Middle-end Packaging &Testing Industry
4.3 Market Size of Packaging Equipment
4.4 Competitive Pattern
4.4.1 Market Share of Packaging Equipment
4.4.2 Ranking of Packaging Equipment Vendors
5. Packaging Equipment Vendors
5.1 ASM Pacific
5.2 Kulicke & Soffa
5.3 BESI
5.4 Advantest
5.5 Hitachi High-Technologies
5.6 Teradyne
5.7 DISCO
5.8 TOWA
5.9 Hanmi
5.10 PFSA
5.11 SUSS MicroTec
5.12 Cohu Semiconductor Equipment Group
5.13 Shinkawa
5.14 Tokyo Seimitsu
5.15 Ultratech
Semiconductor Industry Growth versus Worldwide GDP Growth
Revenue of Global Semiconductor Industry, 2016-2018
Global Semiconductor Market Structure by Product, 2015-2018
Market Size Growth of Global Semiconductor Market by Product, 2015-2018
Semiconductor Outsourced Supply Chain
Semiconductor Company Systems
Semiconductor Outsourced Supply Chain Example
Major Functions of Packaging
Top 25 Semiconductor Sales Leaders, 2018
Top 10 IC Manufacturers in China, 2017-2018
Global Foundry Market Size, 2008-2018
Global Wafer Advanced Packaging Output, 2015-2025E
Foundry Revenue of Advanced Nodes, 2012-2018
Global Foundry Capacity by Node, 2012-2018
Global Foundry Revenue by Node, 2012-2018
Global Ranking by Foundry, 2013
Distribution of 12-inch Foundries in Mainland China
Capacity of 12-inch Foundries in Mainland China
Global DRAM and NAND Market Size, 2008-2018
DRAM Supply/Demand, 2015-2018
DRAM Tech Migration Roadmap
DRAM CAPEX, 2013-2018
Revenue Ranking for Branded DRAM Vendor, 2017-2018
DRAM Market Share, 2017-2018
Mobile DRAM Market Share, 2016-2018
Mobile DRAM Market Share, 2018
Revenue Ranking for Branded Mobile DRAM Vendors, 2017-2018
Market Share of Branded NAND Flash Vendors, 2018
NAND Supply/Demand, 2016-2018
NAND Tech Migration Roadmap
Average IC Cost of Mobile Phone, 2013-2018
Global Mobile Phone Shipments, 2012-2018
Global 3G/4G Mobile Phone Shipments by Region, 2012-2018
Worldwide Smartphone Sales to End Users by Vendor in 2018
Worldwide Smartphone Sales to End Users by Operating System in 2018
Worldwide Mobile Phone Sales to End Users by Vendor in 2018
Global PC-used CPU and Discrete GPU Shipments, 2012-2018
Global Notebook Computer Shipments, 2012-2018
Global Major Notebook Computer ODM Shipments, 2016-2018
Global Tablet PC Shipments, 2013-2018
Market Share of Major Tablet PC Brands, 2018
Output of Global Tablet PC Vendors, 2017-2018
Advantages of WIDE IO
SK Hynix WIDE IO2 Roadmap
HMC Architecture
HMC Benefits
Advantages of Embedded Passive/Active Substrate
Embedded Component Substrate Process
Comparison of Embedded Active & Passive Components
Roadmap of Embedded Passive Substrate
Structure Roadmap of Embedded Active Substrate
FOWLP and PLP Process Comparison
WHY Embedded Trace?
Embedded Trace Package Features
Apple iPad 4 LTE A1459 IC Package Type List
iPhone X IC Package Type
iPhone X IC BOM and Package Type
PoP Package Development Trend
Market Share of Major SiP Packaging Vendors, 2018
Murata Sales and Operation Margin, FY2013-FY2018
Murata Sales by Region, FY2013-FY2018
Sales, New Orders and Backlog of Murata, 2013-2018
Operating Income and Net Income of Murata, 2015-2018
Murata Sales by Product, FY2015-FY2018
Murata Sales by Application, FY2016-FY2018
Revenue and Gross Margin of USI (Taiwan), 2013-2018
Quarterly Revenue and Gross Margin of USI (Taiwan), 2016-2018
Quarterly Revenue of USI (Taiwan) by Product, 2016-2018
Revenue and Operating Margin of USI, 2016-2018
Revenue of USI by Application, 2016-2018
Output of USI by Product, 2016-2018
2.5D Interposer Manufacturing Revenue
Breakdown by Interposer Bulk Material, 2013-2018
TSV Application
TSV Equipment Suppliers
TSV Packaging Equipment Distribution, 2013-2018
Global Semiconductor Equipment Sales, 2015-2025E
Global Semiconductor Packaging & Testing Equipment Sales, 2015-2025E
Share of IC Package Added Value, 1990-2020E
Global IC Packaging Shipment by Type, 2018
IC Packaging & Testing Industry Sales in China, 2015-2025E
Distribution of Global Top 10 Packaging Vendors, 2018
Advanced Packaging Market Size in China, 2015-2025E
Middle-End Packaging & Testing Process
Chinese Packaging & Testing Companies Recently With More Efforts in R&D of Advanced Packaging Technology for a Faster Progress in Deployment
Market Size of Die Level Packaging Equipment, 2015-2018
Semi Equipment Book-to-bill, 2015-2018
Breakdown of Die Packaging Level Equipment by Product, 2017-2018
Wire Bonder Vendor Market Share, 2018
Flip-chip Bonder Vendor Market Share, 2018
Die Bonder Vendor Market Share, 2018
Test Handler Vendor Market Share, 2018
Ranking of Top 16 Major Global Packaging Equipment Vendors by Revenue, 2017-2018
Comparison between Chinese and Foreign Companies in Packaging & Testing Link
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