Global and China IC Advanced Packaging Equipment Industry Report, 2013-2014
  • Aug.2014
  • Hard Copy
  • USD $2,500
  • Pages:120
  • Single User License
    (PDF Unprintable)       
  • USD $2,300
  • Code: ZYW181
  • Enterprise-wide License
    (PDF Printable & Editable)       
  • USD $3,600
  • Hard Copy + Single User License
  • USD $2,700

Global and China IC Advanced Packaging Equipment Industry Report, 2013-2014 mainly deals with the followings:
1. Overview of semiconductor industry
2. Status quo of memory and wafer foundry industry
3. Downstream market of semiconductor industry
4. Trend in emerging advanced packaging technology
5. Packaging equipment industry analysis and ranking
6. 15 major advanced packaging equipment vendors
Packaging equipment can fall into two categories: wafer level and die level. And the former is typically included in wafer equipment as it is used in the manufacturing of wafer. Wafer level packaging is primarily used in the following 5 fields, namely, Analog & Mixed Signal (including IPD, PA, PMU, Local Power, IC Driver, and Audio & Video), Wireless Connectivity (including Bluetooth+FM+WLAN Combo and GPS Single Chip), Optoelectronic (including CIS, AL Sensor), MEMS & Sensor (including Accelerometers, Gyroscope, RF-MEMS, Pressure Sensor, and Fingerprint Sensor), as well as Misc Logic and Memory (covering Logic gate and EEPROMs). And these applications mostly adopt the Fan-in design, with the number of Pin usually less than 20.

In future, WLCSP will be required to follow the Fan-out design to expand its applications. However, the current Fan-out design, which is not mature, restricts the application of wafer level packaging, leaving an untapped market potential for now. But if the Fan-out design is mature, WLCSP will embark on a new development stage.

Wafer level packaging equipment consists of Process Tool (mainly including CVD and PVD, Etching, Sputtering), Packaging Lithography, Contact Probers, and Packaging Inspection. Among them, the main vendors of Process Tool are Applied Material (including the acquired NEXX) and ULVAC; the major companies in Packaging Lithography field are Ultratech, SUSS, and EV Group; the companies involved in Contact Probers are represented by Tokyo Seimitsu and Tokyo Electron(already acquired by Applied Material); the companies engaging in Packaging Inspection principally include Rudolph, Camtek, and KLA-TENCOR. In 2014, the market size of wafer packaging level equipment will be very likely to reach approximately USD1.3 billion.

Die packaging level equipment mainly involves Wire Bonder (main vendors are Kulicke & Soffa, ASM Pacific, and Shinkawa), Die Bonder (represented by ASM Pacific, Hitachi High Technologies, BESI, and Canon), Flip chip Bonder (typical vendors cover PFSA, BESI, ASM Pacific, Toray Engineering, and Hanmi), Test Handler (Delta Design, Advantest, Epson, and Tesec serve as the major players), Wafer Dicing Saws (players include DISCO and Tokyo Seimitsu), Molding/Encapsulation (Towa, BESI, Dai-ichi Seiko are the typical vendors), and Package singulation (Hanmi, ASM Pacific, and DISCO play the main role).

With obvious periodicity, semiconductor devices saw a rise during 2001-2007 but a slump in 2008-2009, while fiercely surged by 100% in 2011, then declined for 3 consecutive years from 2011. And in 2014, they will witness an explosive growth, with the estimated market size of die packaging level equipment rising significantly by 20% to USD4.1 billion. And this figure is projected to climb to USD4.3 billion in 2015 and then begin to fall in 2016. The major growth engine would be Die Bonder, Flip-chip Bonder, and Test Handler.

封装设备 英文_副本.jpg

1. Global Semiconductor Industry
1.1 Overview
1.2 Supply Chain
1.3 Semiconductor Packaging Introduction

2. Upstream & Downstream of IC Packaging Industry
2.1 Semiconductor Industry by Location 
2.2 Semiconductor Industry Capital Spending Trend 
2.3 DRAM memory Industry
2.3.1 Status Quo
2.3.2 Market Share of DRAM memory Vendors
2.3.3 Market Share of Mobile DRAM memory Vendors
2.4 NAND Flash
2.5 Wafer Foundry Industry
2.6 Wafer Foundry Competition
2.7 Ranking in Wafer Foundry Industry
2.8 Mobile Phone Market
2.9 PC Market
2.10 Tablet PC Market 
2.11 FPGA and CPLD Market

3. Packaging & Testing Technology Trend  
3.1 Wide IO/HMC Memory
3.2 Embedded Component Substrate
3.3 Embedded Trace Substrate
3.4 IC Packaging for Handset 
3.4.1 Status Quo
3.4.2 PoP Packaging
3.4.3 FOWLP
3.5 SIP Packaging 
3.5.1 Murata
3.5.2 USI (Taiwan) 
3.6.1 Introduction
3.6.2 Application
3.6.3 2.5D Interposer Market Size 
3.6.4 Suppliers
3.7 TSV (3D) Packaging
3.7.1 Equipment 

4. Packaging Equipment Industry
4.1 Market Size of Packaging &Testing Industry 
4.2 Middle-end Packaging &Testing Industry  
4.3 Market Size of Packaging Equipment
4.4 Market Share of Packaging Equipment
4.5 Ranking of Packaging Equipment Vendors

5. Packaging Equipment Vendors
5.3 BESI
5.8 TOWA
5.10 PFSA
5.12 GROUP
Semiconductor Industry Growth versus Worldwide GDP Growth, 1990-2014
Quarterly Revenue of Global Semiconductor Industry, 2012-2014
Breakdown of Global Semiconductor Market by Product, 2012-2018E
Semiconductor Outsourced Supply Chain
Semiconductor Company Systems
Semiconductor Outsourced Supply Chain Example
Top 25 Semiconductor Sales Leaders, 1Q2014
Worldwide IC Sales by Company Headquarters Location, 1990-2013
Fabless IC Sales Market Share by Company Headquarters Location (77.9B), 2013
Top 10 IC Manufacturers in China, 2008-2013
Top 10 Spenders Capital Spending Outlook, 2011-2014F
Top 5 Share of Total Semiconductor Capital Spending, 1994-2013
Worldwide Semiconductor Capital Spending Share of Full Year Budget, 1Q2014
Market Size of Global DRAM and NAND, 2008-2016E
DRAM Supply/Demand, 1Q2012-4Q2014
CAPEX of DRAM Industry, 2005-2015E
ASP of 4Gb DDR3, 2012-2014
ASP of 32Gb MLC NAND, 2012-2014
Ranking of Branded DRAM Vendors by Revenue, 2Q2013-1Q2014
Market Share of DRAM, Q12007-Q12014
Market Share of Mobile DRAM, 2009-2011
Market Share of Mobile DRAM, 2012
Ranking of Branded Mobile DRAM Vendors by Revenue, 2Q2013-1Q2014
Market Share of Branded NAND Flash Vendors, 2012
Market Share of Branded NAND Flash Vendors, 2014Q1
NAND Supply/Demand, 1Q2012-4Q2014
NAND Tech Migration Roadmap
Market Size of Global Foundry, 2008-2017E
Foundry Revenue of Advanced Nodes, 2012-2017E
Global Foundry Capacity by Node, 2012-2018E
Global Foundry Revenue by Node, 2012-2018E
Global Ranking by Foundry
Average IC Costs of Each Mobile Phone, 2008-2016E
Shipments of Global Mobile Phones, 2007-2015E
Worldwide Smartphone Sales to End Users by Vendor in 2013
Worldwide Smartphone Sales to End Users by Operating System, 2013 
Worldwide Mobile Phone Sales to End Users by Vendor, 2013
Shipments of Global CPU and Discrete GPU for PC, 2008-2015E
Shipments of NB PC, 2008-2015E
Shipments of Global NB PC ODM Vendors, 2010-2013
Shipments of Global Tablet PC, 2011-2016E
Market Share of Major Tablet PC Brands, 2013
Output of Global Tablet PC Vendors, 2012-2013
MFPGA and CPLD Markets by Application and by Region, 2011
Market Share of Major FPGA Vendors, 1999-2013
Mobile DRAM Trend
Strengths of WIDE IO
SK Hynix WIDE IO2 Roadmap
HMC Architecture
Advantages of Embedded Passive/Active Substrate
Embedded Component Substrate Process
Comparison of Embedded Active & Passive Components
Roadmap of Embedded Passive Substrate
Structure Roadmap of Embedded Active Substrate
FOWLP and PLP Process Comparison
WHY Embedded Trace?
Embedded Trace Package Features
Embedded Trace Package Sweet Spot (for Wire Bonding)
Embedded Trace Package Sweet Spot (for FLIP CHIP)
Apple iPad 4 LTE A1459 IC Package Type List
Trend in PoP Packaging
Market Share of Major SiP Packaging Vendors, 2014 
Sales and Operation Margin of Murata, FY 2009-FY 2014 
Sales of Murata by Region, FY 2009-FY 2014  
Revenue, New Orders and Backlog of Murata, 2011Q1-2014Q2
Operating Income and Net Income of Murata, 2011Q1-2014Q2
Order of Murata by Product, 2011Q1-2014Q2
Sales of Murata by Product, FY 2010-FY 2014  
Murata Sales by Application, FY 2010-FY 2014
Revenue and Gross Margin of USI (Taiwan), 2008-2014
Quarterly Revenue and Gross Margin of USI (Taiwan), 2013Q1-2014Q2
Quarterly Revenue Breakdown of USI (Taiwan) by Product, 2013Q1-2014Q2
Revenue and Operating Income of USI (Shanghai), 2008-2014  
Revenue Breakdown of USI (Shanghai) by Downstream, 2011-2013
Output of Various Products of USI (Shanghai), 2011-2013
2.5D Interposer Manufacturing Revenue
Breakdown by Interposer Bulk Material, 2010-2017E
TSV Downstream Application 
TSV Equipment Suppliers 
TSV Packaging Equipment Distribution, 2012-2017E
OSAT Market Size, 2006-2015E
Share of IC Package Added Value, 1990-2020E
Global IC Packaging Shipment by Type, 2011\2016E
Middle-End Packaging & Testing Process
Market Size of Die Level Packaging Equipment, 2007-2016E
Semi Equipment Book-to-bill, 2010Q1-2014Q2
Breakdown of Die Packaging Level Equipment by Product, 2013-2014
Wire Bonder Vendor Market Share, 2014
Flip-chip Bonder Vendor Market Share, 2014
Die Bonder Vendor Market Share, 2014
Test Handler Vendor Market Share, 2014
Branches of ASM
Product Line of ASM Pacific
Revenue and EBT of ASM Pacific, 2009-2014 
Assets and Liabilities of ASM Pacific, 2009-2013
Revenue Breakdown of ASM Pacific by Business, 2012-2013
Quarterly sales trend by Business of ASM Pacific, 2007-2014E
EBIT Breakdown of ASM Pacific by Business, 2012-2013 
Book-to-bill of ASM Pacific, 2007-2014
Revenue Breakdown of ASM Pacific by Region, 2012-2013  
Revenue Breakdown of ASM Pacific by Product, 2011-2013    
Capex/Sales of ASM Pacific, 1993-2015E
Revenue and Operating Margin of Kulicke & Soffa, FY 2007-FY 2014
Top 10 Clients of Kulicke & Soffa, FY 2011-FY 2013
Global Distribution of Kulicke & Soffa
Revenue of Kulicke & Soffa, 2011Q2-2014Q2
Operating Margin of Kulicke & Soffa, 2011Q2-2014Q2
R&D Costs of Kulicke & Soffa, 2011Q2-2014Q2
Wire Bonder Equipment Market, 2009-2018E
Copper Bonder Unit, 2012-2018E
BESI Organization
Revenue and Orders of BESI, 2009-2014
Revenue \Operation Margin\Net Margin of BESI, 2009-2014
Quarterly Revenue and Orders of BESI, 1Q2012-2Q2014
Quarterly Revenue and Net Margin of BESI, 1Q2012-2Q2014
Milestone of BESI
Quarterly Expense of BESI, 1Q12-2Q14 
Quarterly Headcount of BESI, 1Q12-2Q14
Quarterly Cash and Debt of BESI, 1Q12-2Q14
Market Share of BESI, 2013
Revenue Breakdown of BESI by Product, 2013
BESI’s Product Position
BESI’s Products
BESI’s Global Operation
Revenue and Gross Margin of Advantest, 2Q12-2Q14
New Orders of Advantest, 2Q12-2Q14
Advantest Order by Business, FY 2013-Q1/FY 2015
Advantest Order by Region, FY 2013-Q1/FY 2015
Sales of Advantest by Business, FY 2013-Q1/FY 2015
Sales of Advantest by Region, FY 2013-Q1/FY 2015 
Assets and Liabilities of Advantest, 2013Q3-2014Q2
Revenue and Operation Margin of Hitachi High-Technologies, FY 2007-FY 2015
Revenue Breakdown of Hitachi High-Technologies by Segment, FY 2011-FY 2015 
Operation Margin Breakdown of Hitachi High-Technologies by Segment, FY 2011-FY 2014
Revenue Breakdown of Hitachi High-Technologies’ Electronic Device Systems by Business, FY 2013-FY 2015
Front-end Revenue Breakdown of Hitachi High-Technologies’ Electronic Device Systems by Field, FY 2014-FY 2015
Revenue and Operating Income of Teradyne, 2006-2014  
Net Revenue of Teradyne by Country and % of Total Revenue, 2011-2013
Revenue Breakdown of Teradyne by Product, 2011-2014 
Organization Chart of DISCO
Revenue and Operating Income of DISCO, FY 2010-FY 2015    
Quarterly Consolidated Financial Results of DISCO, Q1/FY 2005-Q4/FY 2013
Quarterly Sales/Orders of DISCO, Q1/FY 2005-Q4/FY 2013 
Quarterly Sales Breakdown of DISCO by Product, Q1/FY 2010-Q4/FY 2013 
Product and Equipment Sales Breakdown, Q4/FY 2013 
Equipment, Non-consolidated Cutting and Dicing Saws Sales Breakdown of DISCO by Application, FY 2012-FY 2013
Equipment, Non-consolidated Grinders and Polishers Sales Breakdown of DISCO by Application, FY 2012-FY 2013
Consolidated Sales Breakdown of DISCO by Region, FY 2012-FY 2013 
Consolidated R&D/CAPEX Forecast of DISCO, FY 2000-FY 2014
Organization Chart of Towa
Revenue and Operating Income of TOWA, FY 2010-FY 2015    
Revenue Breakdown of TOWA by Product, FY 2011-FY 2014 
Orders Breakdown of TOWA by Product, FY 2011-FY 2014
Revenue Breakdown of TOWA by Region, FY 2011-FY 2014
Revenue and Operating Margin of Hanmi, 2010-2014  
Revenue Breakdown of Hanmi by Product, 2007-2015E  
Sales and EBITDA Margin of SUSS MicroTec, 2008-2014
Orders of SUSS MicroTec, 2008-2014
Sales and Orders of SUSS by Segment, 2014H1 
Sales and Orders of SUSS by Region, 2014H1 
Revenue and Operating Margin of Cohu, 2008-2014   
Revenue Breakdown of Cohu by Product, 2008-2014 
Revenue Breakdown of Cohu Semiconductor Equipment by Product, 2011-2013
Revenue and Operating Income of Shinkawa, FY 2009-FY 2015   
Revenue Breakdown of Shinkawa by Product, FY 2011-FY 2014 
Revenue Breakdown of Shinkawa by Region, FY 2011-FY 2014 
Revenue and Operating Income of Tokyo Seimitsu, FY 2009-FY 2015    
Revenue Breakdown of Tokyo Seimitsu by Product, FY 2012-FY 2015    
Quarterly Sales of Tokyo Seimitsu’s Semiconductor Equipment, Q1/FY 2010-Q1/FY 2015
Quarterly Order of Tokyo Seimitsu’s Semiconductor Equipment, Q1/FY 2010-Q1/FY 2015
Revenue and Operating Margin of Ultratech, 2009-2014   
Revenue Breakdown of Ultratech by Product, 2011-2013

Global and China IC Substrate Industry Report, 2015

Global and China IC Substrate Industry Report, 2015 highlights the followings:1. Status quo of semiconductor and IC packaging industry2. Analysis on downstream market of IC substrate3. ...

Global and China FPCB (Flexible Printed Circuit Board) Industry Report, 2014-2015

Global and China FPCB Industry Report, 2014-2015 involves the following:1. Analysis on the FPCB Industry2. Analysis on the FPCB Downstream Market 3. Comparison between FPCB Companies 4. Research on 22...

Global and China Rigid PCB Industry Report, 2015

Global and China Rigid PCB Industry Report, 2014-2015 highlights the followings:1. PCB industry2. PCB downstream market3. Horizontal comparison of PCB companies4. 35 typical PCB companies 2014 was a ...

Global and China LED Industry Report, 2014-2015

Global and China LED Industry Report, 2014-2015 is primarily concerned with the following:1. LED development trend2. LED industry analysis3. 38 LED companies After experiencing fall to the bottom and...

Global and China Display IC Industry Report, 2014-2015

The report contains the following aspects:1, Development trends of LCD driver IC and touch IC2, Analysis on downstream markets of LCD driver IC and touch IC3, Analysis on LCD driver IC and touch IC In...

China Supercapacitor Industry Report, 2014-2020

A supercapacitor (SC), sometimes ultracapacitor, formerly electric double-layer capacitor (EDLC) is a high-capacity electrochemical element that accumulates energy by polarizing electrolyte. However, ...

Global and China CCM (CMOS Camera Module) Industry Report, 2014-2015

Global and China CCM (CMOS Camera Module) Industry Report, 2014-2015 covers the following:1. CIS (CMOS Image Sensor) market and industry2. Lens industry3. CCM industry and market4. Development trend o...

Global and China Touch Screen (Panel)Industry Report, 2014-2015

The report covers the followings: 1, Development trends of touch screen technology2, Trends of touch screen market3, Analysis on the touch screen industry4, Study on 22 major touch screen vendors 5, R...

Global and China Mobile Phone Display Industry Report, 2014-2015

Global and China Mobile Phone Display Industry Report, 2014-2015 focuses on the following: 1. Overview of TFT-LCD2. TFT-LCD industry chain3. LCD market and industry4. Mobile phone display market and i...

Global and China TFT-LCD Industry Report, 2014-2015

Global and China TFT-LCD Industry Report, 2014-2015 contains the following aspects:1, Introduction to TFT-LCD2, Research on TFT-LCD upstream industries (glass substrate, backlight module, polarizer, d...

Global and China FPCB(Flexible Printed Circuit Board) Industry Report, 2014

Global and China FPCB Industry Report, 2014 mainly deals with the followings:1. Overview of FPCB;2. FPCB market;3. FPCB industry;4. 22 FPCB vendors;5. 9 FCCL vendors. In 2013, FPCB industry enjoyed a...

Global and China Electronic Cable Assembly Industry Report, 2014

Global and China Electronic Cable Assembly Industry Report, 2014 contains the following aspects:1, Brief introduction to electronic cable assembly2, Background of electronic cable assembly industry3, ...

China Environmental Monitoring Instrument Industry Report, 2013-2015

As industrialization and urbanization advances unceasingly in China, environmental issues are of the greatest concern to the public and environmental protection gradually turns into a national policy....

Global and China Earphone Industry Report, 2013-2014

Global and China Earphone Industry Report, 2013-2014 focuses on the following: 1. Earphone overview2. Earphone market3. Earphone industry4. 8 branded earphone vendors5. 13 earphone OEMs The report c...

Global and China Micro Electronic-Acoustics Component Industry Report, 2013-2014

The report highlights the followings:1. Introduction to Micro Electronic-Acoustics System2. Downstream Market of Micro Electronic-Acoustics 3. Micro Electronic-Acoustics Industry4. 21 Micro Electronic...

Global and China Wafer Foundry Industry Report, 2013-2014

Global and China Wafer Foundry Industry Report, 2013-2014 is all about the followings:1. Overview of Global Semiconductor Industry  2. Downstream Market of Wafer Foundry Industry3. Wafer Foundry ...

Global and China IC Advanced Packaging Equipment Industry Report, 2013-2014

Global and China IC Advanced Packaging Equipment Industry Report, 2013-2014 mainly deals with the followings:1. Overview of semiconductor industry2. Status quo of memory and wafer foundry industry3. D...

Global and China IC Advanced Packaging Industry Report, 2013-2014

Global and China IC Advanced Packaging Industry Report, 2013-2014 is mainly all about the followings 1. Overview of semiconductor industry2. Status quo of memory and wafer foundry industry3. Upstream ...

2005-2014 All Rights Reserved 京ICP备05069564号-1 京公网安备1101054484号