Automotive Cockpit SoC Technology and Application Research Report, 2022
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Cockpit SoC research: local chip vendors begin to come to the front, and who will rule the roost in the ten-billion-yuan market.

Cockpit SoC is the computing power supply unit of intelligent cockpits. It is mainly responsible for operation and processing of massive cockpit data, including video access of multiple cameras, network processing unit (NPU), in-car audio processing, speech, and image rendering and output (GPU/DPU) of multiple displays, in-car Bluetooth/WiFi connection, and Ethernet data interaction with other major in-vehicle ECUs (e.g., central gateway).

Cockpit SoC products featuring great computing power, multi-integration and strong AI boast ever better performance.

As intelligent cockpits gain pace, the main control SoC of cockpits not only needs to meet the needs of multi-screen scenarios such as cluster, cockpit display, and AR-HUD, but also to perform operations such as voice recognition and vehicle control. User experience indexes of cockpit systems, like response speed, boot time, and connection speed, directly determine whether an auto brand is competitive or not. Smart cars have increasingly high requirements on performance and computing power of cockpit SoC.  

The CPU computing power of cockpit SoC has got improved significantly, from dozens of KDMIPS in the past to more than 100 KDMIPS now. At present, the CPU computing power of Qualcomm Snapdragon SA8155P is about 105KDMIPS, SA8195P about 150KDMIPS, and the 4th-generation automotive cockpit SoC SA8295 even up to over 200KDMIPS. Among Chinese vendors, the CPU computing power of Huawei Kirin 990 exceeds 75KDMIPS; SemiDrive’s latest cockpit chip X9U boasts CPU computing power of 100KDMIPS; Rockchip's newest intelligent cockpit chip RK3588M feature CPU computing power of 100KDMIPS as well.

SoC 1_副本.png

The AI computing power of cockpit SoC has also multiplied. Wherein, Samsung's production SoC Exynos Auto V910 delivers AI computing power of about 1.9TOPS. According to Samsung’s plan, the NPU computing power of Exynos Auto V920, a cockpit chip to be mass-produced around 2025 will reach about 30TOPS. Qualcomm's production chip SA8155P offers AI computing power of about 8TOPS, and its fourth-generation cockpit SoC is integrated with the NPU computing power of as high as 30TOPS. Qualcomm plans production of its cockpit SoC product launched with the greatest AI computing power in 2023.

As for Chinese cockpit SoCs, SemiDrive’s cockpit products from the mid-end to the premium are all embedded with AI computing power, of which X9U delivers AI computing power of 1.2TOPS; Rockchip's latest cockpit SoC RK3588M provides AI computing power of 6TOPS; the AI computing power of Longying No.1, a cockpit chip of SiEngine Technology under Geely, is about 8TOPS.

SoC 2_副本.png

In terms of cockpit SoC process, the 5nm process has come out. At present, 7nm and 8nm cockpit chips have been spawned, such as Qualcomm 8155/8195, Samsung V910 and Rockchip RK3588M. Moreover Qualcomm introduced its latest 5nm chip, a 4th Generation Snapdragon Automotive Cockpit Platform, and plans to start mass production in 2023.

In the fierce cockpit SoC competition, foreign giants forge ahead steadily and Chinese vendors step up their efforts to produce chips.

In the past two years, the competition in the automotive cockpit SoC market has intensified, especially in the mid- and high-end segments. Not only are there more competing companies, but also consumer electronics chip players like Qualcomm, Intel, NVIDIA, Huawei, AMD, MediaTek are vigorous entrants, in addition to traditional automotive SoC vendors such as NXP, Renesas and TI. For example, in 2021, AMD forged into the automotive cockpit market through Tesla. From the vehicle game scenario, AMD has tailored for Tesla an intelligent cockpit SoC carrying a consumer game graphics card.

As well as overseas chip bellwethers, Chinese chip companies such as AutoChips, SemiDrive, Rockchip, Horizon Robotics and SiEngine have also joined the battlefield as independent chip vendors, which reshapes the automotive chip industry pattern. In 2021, local companies in China competed to introduce self-developed new products for a place in the cockpit SoC market.

In April 2021, SemiDrive unveiled X9U, a flagship cockpit SoC product with total CPU computing power up to 100KDMIPS, 3D graphics performance up to 300GFLOPS, and AI computing power up to 1.2TOPS. In December 2021, SiEngine, Geely’s automotive chip designer, released Longying No.1, a 7nm intelligent cockpit chip subject to AEC-Q100 Grade 3 automotive standard. It is an equivalent of Qualcomm 8155 and is projected to be produced in quantities in the third quarter of 2022.

In late December 2021, Rockchip, a specialist in design and development of AIoT processors, launched a range of automotive cockpit electronics, including automotive cockpit SoCs such as RK3358M, RK3568M and RK3588M, and grouped PMIC chips RK809M and RK806M, which provide customers with high-, mid- and low-end cockpit chip solutions with different performance.

SoC 3_副本.png

Rockchip's flagship automotive cockpit SoC RK3588M adopts 8nm process and high-performance Octa-core CPU and GPU. With CPU computing power of 100K DMIPS, GPU computing power of 512GFLOPS, and NPU AI computing power of 6TOPS, this chip enables hybrid, quantitative, multi-model parallel computing. It provides AI processing capabilities comparable with edge computing boxes, and realizes functions such as one-core multi-screen.

In addition, in 2021, some overseas companies also launched new cockpit SoC products to stabilize or break through the market pattern. For example, in July 2021, Renesas introduced a new series of R-Car Gen3e SoCs, covering six new products, which are applicable to integrated cockpit domain control and other areas and scheduled to be mass-produced in 2022; in November 2021, Samsung released Exynos Auto V7, a new ASIL-B safety standard-compliant SoC for mid-to-high-end intelligent cockpit systems, which has been applied to Volkswagen's on-board computer ICAS3.1

Cockpit SoC companies flexibly adjust their strategies to cope with the changing intelligent vehicle market amid the supply chain reconstruction and business model shift.

Chips need hardware and software to play their role. Software weighs more heavily in vehicle market in the context of software defined vehicles. In recent years, chip vendors have been transforming from hardware suppliers into service providers, that is, they no longer just sell chip and hardware products and have got down to developing hardware + software or even complete system solutions. 

Among them, Nvidia has rolled out full protocol stacks. Nvidia which only sold chips in the past provides the DRIVE IX full protocol stack for cockpits in addition to the DRIVE AV full protocol stack for autonomous driving. DRIVE IX starts with Orin chips for autonomous driving, and also integrates previous Parker and Xavier.

In September 2021, Renesas unveiled the R-Car Software Development Kit (SDK), a complete software platform in a single package that enables quicker and easier software development and validation for smart cameras. Renesas is also developing a cross-platform, reusable and scalable software platform.

SoC 4_副本.png

Besides, as intelligent vehicles advance and software-defined vehicles arrive, automotive business models are making a quite change. In the future users will care about iteratively upgraded software services more than conventional needs when they buy a car. This also drives change to the cockpit SoC supply relationship. OEMs not only need cockpit SoC vendors to provide original products but require them to meet customization needs and offer software capabilities compatible with OEMs or suppliers.

Chips were traded to automakers through Tier1s in the past, but now this indirect partnership is being replaced by possibly direct cooperation between chip vendors and OEMs. A new supply model where software and hardware are custom-made and co-developed has turned up. 

1 Overview of Automotive Cockpit SoC 
1.1 Overview of Cockpit SoC
1.2 Composition of Cockpit SoC
1.3 Design Flow of Cockpit SoC
1.4 Development History of Cockpit SoC 
1.5 Comparison between Popular Cockpit SoCs (I)
1.6 Comparison between Popular Cockpit SoCs (II)
1.7 Comparison between Popular Cockpit SoCs (III)
1.8 Ranking of Cockpit SoCs by CPU Compute 
1.9 Ranking of Cockpit SoCs by GPU Compute 
1.10 Ranking of Cockpit SoCs by NPU Compute 
1.11 Specifications of Cockpit SoC Memory
1.12 Operating Systems Supported by Cockpit SoC
1.13 Displays and Cameras Enabled by Cockpit SoC
1.14 Automotive Safety Certification of Cockpit SoC
1.15 Major Companies’ Planning for Cockpit SoC

2 Automotive Cockpit SoC Market Development
2.1 Cockpit SoC Competitive Pattern
2.2 Market Pattern of Cockpit SoCs for Low- and Medium-end Models
2.3 Low- and Medium-end Cockpit SoCs Win Most Popularity
2.4 Market Pattern of Cockpit SoCs for Medium- and High-end Models
2.5 Competitive Pattern of Foreign Cockpit SoC Vendors
2.6 Competitive Pattern of Chinese Cockpit SoC Vendors
2.7 Global Cockpit SoC Market Structure (by Shipment), 2021
2.8 Global Cockpit SoC Market Structure (by Amount), 2021
2.9 Automotive Cockpit and Head Unit Supply Chain
2.10 Ongoing Reconstruction of Automotive Cockpit SoC Supply Chain
2.11 Cockpit SoC Shipment Price
2.12 Penetration of Cockpit SoC in New Vehicles Worldwide
2.13 Penetration of Cockpit SoC in New Vehicles in China
2.14 China’s Cockpit SoC Market Size 

3 Foreign Cockpit SoC Vendors

3.1 NXP
3.1.1 Cockpit Processors (1)
3.1.2 Cockpit Processors (2)
3.1.3 Main Performance Indices of i.MX8 Series (1)
3.1.4 Main Performance Indices of i.MX8 Series (2)
3.1.5 NXP i.MX8QM Software Stack Module
3.1.6 Typical Use Cases of NXP I.MX Chips in Cockpits
3.1.7 NXP i.MX6 Once Ruled the Roost in the Low- and Medium-end Market
3.1.8 NXP i.MX Partner Ecosystem
3.1.9 Operating Systems NXP i.MX Supports
3.1.10 AI Algorithms NXP i.MX Supports
3.1.11 NXP i.MX Products and Future Cockpit Systems (1)
3.1.12 NXP i.MX Products and Future Cockpit Systems (2)
3.1.13 Connected eCockpit Co-launched by NXP and Altia at CES 2022
3.1.14 Latest Cockpit Dynamics 

3.2 Texas Instruments (TI)
3.2.1 Cockpit Chips
3.2.2 TI J6
3.2.3 TI Wins a Place in Mid-end Cockpit Processor Market
3.2.4 Parameters of Jacinto 6 Series 
3.2.5 Jacinto Cockpit Solution and Partners
3.2.6 TI Invested USD30 Billion to Build 4 New Semiconductor Factories

3.3 Renesas
3.3.1 Profile
3.3.2 Chip Business
3.3.3 Expansion of Vehicle Product Lines by Acquiring Dialog 
3.3.4 Expansion of Vehicle Product Lines by Acquiring Dialog
3.3.5 Product Portfolio Sales of Renesas, FY2020  
3.3.6 Renesas + Dialog Combinations Provide High-end Comprehensive Cockpit Solutions
3.3.7 Renesas + Dialog Combinations Provide Cockpit Solutions with Haptic Touch 
3.3.8 Chip Capacity Expansion Plan
3.3.9 R-Car Series for Automotive Sector
3.3.10 R-Car Series Used in Cockpit Processors
3.3.11 Cockpit SoC Product Lines
3.3.12 Key Features of Cockpit SoC
3.3.13 R-Car Gen3e
3.3.14 Digital Dashboard with Driver ID Integrated R-Car E3e
3.3.15 Android-based Comprehensive Cockpit Powered by R-Car M3e
3.3.16 Low-Cost Digital Instrument Cluster Reference Design
3.3.17 Cockpit Trends of Renesas
3.3.18 R-Car in Future Automotive Architectures
3.3.19 Renesas EEA Strategy 
3.3.20 Software Platforms: R-Car Software Development Kit (SDK)
3.3.21 Software platforms: Cross-platform, Scalable and Reusable
3.3.22 Renesas Software Service Platform
3.3.23 Main Dynamics

3.4 Qualcomm
3.4.1 Development History of Cockpit SoC
3.4.2 4th Generation Snapdragon Cockpit Platforms
3.4.3 4th Generation Cockpit SoCs
3.4.4 3rd Snapdragon Generation Cockpit SoCs (1)
3.4.5 3rd Snapdragon Generation Cockpit SoCs (2) 
3.4.6 1st and 2nd Generation Snapdragon Cockpit SoCs
3.4.7 AI Support for 820A (1)
3.4.8 AI Support for 820A (2) 
3.4.9 OEMs Using Qualcomm Cockpit Chips
3.4.10 Snapdragon Cockpit SoCs Mass Produced for (Planned) Models
3.4.11 Latest Cockpit Dynamics

3.5 Intel
3.5.1 Cockpit Processor Layout
3.5.2 Intel A3900 Processor

3.6 Samsung
3.6.1 Cockpit Processors
3.6.2 Cockpit Processors: V9
3.6.3 Cockpit Processors: V7
3.6.4 Cockpit SoC: Exynos Auto V7
3.6.5 Automotive SoC Roadmap
3.6.6 Application Cases of Samsung Automotive SoCs 

3.7.1 Deep Learning Processors
3.7.2 Deep Learning Processors: Orin
3.7.3 Deep Learning Processors: Parker
3.7.4 Mercedes-Benz’s 1st Gen MBUX Uses NVIDIA Parker, and the 2nd Gen MBUX Uses Xavier NX
3.7.5 NVIDIA Chips Were Once the Favorites of Mercedes-Benz and Audi 

3.8 Telechips
3.8.1 Targeting Low-end and LCD Cluster Markets 
3.8.2 Cockpit Processor: Dolphin
3.8.3 Cockpit Chips: Dolphin 3 Series
3.8.4 Cockpit Chips: Dolphin Series
3.8.5 Models Applying Telechips Chips in the Chinese Market
3.8.6 Cockpit Application Solutions 
3.8.7 Dolphin 3 Intelligent Cockpit Solution
3.8.8 Cockpit Dynamics

3.9 AMD
3.9.1 Automotive Processor Layout
3.9.2 The Cockpits of Full Range of Tesla Models Will Use AMD Processors
3.9.3 GPU Architecture Roadmap
3.9.4 Processor Architecture Roadmap

4 Chinese Cockpit SoC Companies

4.1 MediaTek
4.1.1 Cockpit Chips
4.1.2 MediaTek MT2712
4.1.3 The Lightweight Hypervisor for MT2712 Helps to Create Popular Android Infotainment
4.1.4 MediaTek and ECARX 
4.1.5 MediaTek MT8666 and MT8675
4.1.6 Cockpit Development Plan

4.2 AutoChips 
4.2.1 Cockpit SoCs
4.2.2 Cockpit Processor: AC8015
4.2.3 Cockpit Chip Development Plan

4.3 SemiDrive
4.3.1 Profile
4.3.2 Cockpit Chip: X9
4.3.3 Four Core Technologies of X9
4.3.4 X9 Series Products
4.3.5 X9 Application Block Diagram
4.3.6 Release of New Processor Products
4.3.7 Flagship Cockpit Processor: X9U
4.3.8 Intelligent Cockpit Solutions: X9H 
4.3.9 Intelligent Cockpit Solutions: X9P 
4.3.10 Partners
4.3.11 Product Roadmap
4.3.12 Developed a Digital Cockpit Solution Together with BlackBerry QNX
4.3.13 To Use Elektrobit AUTOSAR for Software Development
4.3.14 Launched X9U Cockpit Platform Together with Denso Kotei
4.3.15 Cooperated with Pioneer Technology
4.3.16 Latest Dynamics

4.4 HiSilicon Technologies 
4.4.1 Cockpit Chips: Kirin 710A
4.4.2 Cockpit Chips: Kirin 990A

4.5 SiEngine Technology
4.5.1 Profile
4.5.2 Intelligent Cockpit Chip: Yinglong No.1 (SE1000)
4.5.3 Key Parameters of Intelligent Cockpit Chips 
4.5.4 Cockpit Chip Software and Hardware Reference Design Platform
4.5.5 Development Plan
4.5.6 Built Cooperation with Desay SV, Neusoft, etc. 

4.6 Rockchip 
4.6.1 Profile
4.6.2 Development History
4.6.3 Application of Automotive Solutions 
4.6.4 Automotive Chip Plan
4.6.5 Introduction to Automotive Chips
4.6.6 Rockchip RK3358M – Applicable to Full LCD Dashboard and Center Console (Subject to AEC-Q100 Reliability Certification Standard)
4.6.7 Rockchip RK3568M – Applicable to ADAS + Center Console Integrated Product 
4.6.8 Rockchip RK3588M – Applicable to One-core Multi-screen Intelligent Cockpit Solution
4.6.9 One-core Multi-screen Cockpit Solution
4.6.10 Rockchip RV1126K – Applicable to DVR 
4.6.11 Rockchip RV1126K – Detailed Specifications 

4.7.1 Profile
4.7.2 Intelligent Cockpit Chips

5 Cockpit SoC Application Trends of OEMs  

5.1 Summary of Cockpit SoC Application Trends of Major OEMs 
5.1.1 Summary of Cockpit SoC Supply to Chinese Automakers (1)
5.1.2 Summary of Cockpit SoC Supply to Chinese Automakers (2)
5.1.3 Summary of Cockpit SoC Supply to Foreign Automakers (1)
5.1.4 Summary of Cockpit SoC Supply to Foreign Automakers (2) 
5.1.5 Summary of Cockpit SoC Supply to Emerging Carmakers (1)
5.1.6 Summary of Cockpit SoC Supply to Emerging Carmakers (2) 
5.1.7 Cockpit SoC Application Trends of Major OEMs (1)
5.1.8 Cockpit SoC Application Trends of Major OEMs (2)  

5.2 Tesla Cockpit SoC
5.2.1 Intelligent Cockpit Hardware Iteration (1)
5.2.2 Intelligent Cockpit Hardware Iteration (2)
5.2.3 MCU2 Framework 
5.2.4 MCU3 Framework

5.3 BMW Cockpit SoC
5.3.1 Evolution of Cockpit SoCs
5.3.2 MGU21
5.3.3 MGU
5.3.4 BMW iX
5.3.5 BMW Cockpit Electronic Architecture
5.3.6 TCB, Gateway and Head Unit Architectures

5.4 Mercedes-Benz Cockpit SoC
5.4.1 Evolution of Cockpit Chips
5.4.2 3rd Gen MBUX
5.4.3 2nd Gen MBUX Uses Xavier NX
5.4.4 Cockpit of the Newest Mercedes-Benz S-Class 
5.4.5 Decomposition of 2nd Gen MBUX for New Mercedes-Benz S-Class
5.4.6 1st Gen MBUX Uses NVIDIA Parker
5.4.7 Mercedes-Benz NTG6 Dual Architecture

5.5 Volkswagen Cockpit SoC
5.5.1 Cockpit SoCs
5.5.2 ICAS3 Cockpit
5.5.3 ID.4 Cockpit
5.5.4 CNS 3.0 Architecture

5.6 Audi Cockpit SoC
5.6.1 Intelligent Automotive Cockpit SoCs 
5.6.2 Audi MIB Dual System Architecture
5.6.3 Audi MMI System Architecture

5.7 GM Cockpit SoC
5.7.1 Decomposition of GM MY21 INFO3.5 Cockpit
5.7.2 GM Will Partner with Semiconductor Companies to Develop Automotive Chips

5.8 Ford Cockpit SoC
5.8.1 Evolution of SYNC Chip
5.8.2 Evolution of SYNC+ Chip
5.8.3 SYNC4 Hardware
5.8.4 Mustang Mach-E
5.8.5 EVOS Intelligent Cockpit
5.8.6 NXP and Ford Cooperated on Next Generation Cockpit Entertainment System
5.8.7 Ford and GlobalFoundries Signed a Strategic Agreement on Joint Development and Production of High-end Chips

5.9 Volvo Cockpit SoC
5.9.1 Volvo Cockpit SoC
5.9.2 Cockpit of XC90 BEV 
5.9.3 Volvo and Qualcomm Cooperated to Deploy Intelligent Cockpits 

5.10 Toyota Cockpit SoC
5.10.1 Cockpit SoCs
5.10.2 Decomposition of Toyota Tundra Cockpit 

5.11 Hyundai Cockpit SoC
5.11.1 Cockpit SoCs
5.12.2 Hyundai and Samsung Co-develop Automotive Semiconductors

5.12 Tata Cockpit SoC
5.12.1 Tata Intelligent Cockpit Architecture
5.12.2 Functional Safety in Tata Intelligent Cockpit Architecture

5.13 Great Wall Motor Cockpit SoC
5.13.1 Intelligent Cockpit SoCs of Great Wall Motor
5.13.2 WEY Mocha Intelligent Cockpit
5.13.3 WEY Macchiato 
5.13.4 SL Mecha Dragon 
5.13.5 Haval Mythical Beast 
5.13.6 Cockpit SoC of Haval H6S
5.13.7 Cockpit Hardware Architecture of Haval H6S
5.13.8 Cockpit Software Architecture of Haval H6S
5.13.9 Coffee Intelligence 2.0—Intelligent Cockpit
5.13.10 Nobo Intelligent Cockpit Domain Layout 
5.13.11 Nobo Intelligent Cockpit Products 
5.13.12 Great Wall Motor’s Intelligent Cockpit Planning Goals

5.14 GAC Cockpit SoC
5.14.1 Intelligent Cockpit SoCs  
5.14.2 Chip of GAC ADiGO Intelligent Driving Interconnection 4.0 
5.14.3 GAC AION LX Plus
5.14.4 Intelligent Cockpit Chip of Trumpchi GS4 PLUS
5.14.5 GAC AION Xingling Architecture (1)
5.14.6 GAC AION Xingling Architecture (2)

5.15 Changan Cockpit SoC
5.15.1 Intelligent Cockpit SoCs
5.15.2 Changan UNI-V
5.15.3 Changan Oshan X7 PLUS

5.16 SAIC Cockpit SoC
5.16.1 Intelligent Cockpit SoCs
5.16.2 Luoshen Intelligent Cockpit SoC
5.16.3 Intelligent Cockpit Configuration of IM L7
5.16.4 SAIC Marvel R Equipped with 5G Intelligent Cockpit
5.16.6 Cockpit/Cabin Integrated HPC Co-developed by SAIC Z-One and Technomous

5.17 Geely Cockpit SoC
5.17.1 Cockpit SoCs
5.17.2 Xingyue L
5.17.3 Cockpit of ZEEKR 001
5.17.4 Cockpit SoC Configuration of Lynk & Co 09
5.17.5 Cockpit SoC Planning in Smart Geely 2025

5.18 BAIC Cockpit SoC
5.18.1 Cockpit SoCs of BAIC Passenger Cars
5.18.2 BAIC @me Intelligent Cockpit for Passenger Cars Adopts Kirin Chips
5.18.3 Cockpit of BAIC ARCFOX αS Huawei Inside (HI) Edition 
5.18.4 Cockpit Configuration of BAIC Magic Cube 

5.19 Hongqi Cockpit SoC
5.19.1 Cockpit SoCs
5.19.2 Intelligent Cockpit Platform
5.19.3 Cockpit SoCs of Main Models

5.20 Chery Cockpit SoC
5.20.1 Intelligent Cockpit SoC of EXEED
5.20.2 Chip Configuration of Chery Lion System 
5.20.3 Chery Tiggo 8Plus

5.21 Dongfeng Voyah Cockpit SoC
5.21.1 Cockpit SoCs
5.21.2 Cockpit of Voyah Dreamer 
5.21.3 Cockpit SoCs of Other Dongfeng Brands

5.22 Li Auto Cockpit SoC
5.22.1 Cockpit SoCs
5.22.2 Cockpit Chip of Li ONE

5.23 NIO Cockpit SoC
5.23.1 Cockpit SoCs
5.23.2 NIO and Qualcomm Announced Cooperation

5.24 Xpeng Motor Cockpit SoC
5.24.1 Cockpit SoCs
5.24.2 Iteration of Intelligent Cockpit Xmart OS from 1.0 to 3.0 
5.24.3 Xpeng and Qualcomm Built Strategic Cooperation

5.25 Weltmeister Cockpit SoC
5.25.1 Cockpit SoCs
5.25.2 WM Connect Intelligent Digital Cockpit
5.25.3 Released IdeaL4 Technology Strategy

5.26 Hozon Cockpit SoC 
5.26.1 Cockpit SoCs of Neta Auto
5.26.2 Neta Intelligent Cockpit Domain Controller 1.0
5.26.3 Neta PIOVT 2.0 Intelligent Cockpit System
5.26.4 Neta Intelligent Cockpit Plan

5.27 Human Horizons Cockpit SoC
5.27.1 Cockpit SoCs of Human Horizons HiPhi
5.27.2 HiPhi Human Oriented Architecture (HOA)

5.28 Leapmotor Cockpit SoC 
5.28.1 Cockpit SoCs
5.28.2 "2.0 Strategy" Aims to Create Evolvable Intelligent Cockpits 

5.29 Other OEMs
5.29.1 Cockpit of Nissan Flagship EV Ariya 
5.29.2 Decomposition of Cockpit of Renault Mégane E-Tech Electric 
5.29.3 Land Rover's Single Hardware System
5.29.4 Honda Adopts Qualcomm Cockpit Chips
5.29.5 Decomposition of Head Unit of 2021 Honda Accord 
5.29.6 Cockpit of SOL QX 
5.29.7 Cockpit of SOL Yao  
5.29.8 BYD Uses Cockpits Based on Huawei Kirin Chips
5.29.9 JiDU Announced Use of Qualcomm's 4th Generation Cockpit SoC in Its First Model 

6 Development Trends of Automotive Cockpit SoC
6.1 Development Trends of Intelligent Cockpit
6.2 Next Generation Intelligent Cockpit System Architecture 
6.3 Design Trends of Cockpit SoC
6.4 Trends of Cockpit SoC Application Solutions
6.5 Summary of Cockpit SoC Application Trends
6.6 Deployment Dynamics of Cockpit SoC Vendors 
6.7 Self-developed Chip Layout of OEMs
6.8 Performance of Next Generation Cockpit SoC Products of Main Companies
6.9 Development Trends of Cockpit SoC Products (1)
6.10 Development Trends of Cockpit SoC Products (2)
6.11 Development Trends of Cockpit SoC Products (3)
6.12 Development Trends of Cockpit SoC Products (4)
6.13 Development Trends of Cockpit SoC Products (5)

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